EE PLD, 5ns, CMOS, PQFP128, PLASTIC, QFP-128
参数名称 | 属性值 |
零件包装代码 | QFP |
包装说明 | QFP, |
针数 | 128 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
最大时钟频率 | 180 MHz |
JESD-30 代码 | S-PQFP-G128 |
长度 | 28 mm |
专用输入次数 | 6 |
I/O 线路数量 | 96 |
端子数量 | 128 |
组织 | 6 DEDICATED INPUTS, 96 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装形状 | SQUARE |
封装形式 | FLATPACK |
可编程逻辑类型 | EE PLD |
传播延迟 | 5 ns |
认证状态 | Not Qualified |
座面最大高度 | 3.93 mm |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
宽度 | 28 mm |
Base Number Matches | 1 |
ISPLSI2096VE-180LQ | ISPLSI2096VE-135LQ | ISPLSI2096VE-135LT | ISPLSI2096VE-180LT | ISPLSI2096VE-100LQ | ISPLSI2096VE-100LT | |
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描述 | EE PLD, 5ns, CMOS, PQFP128, PLASTIC, QFP-128 | EE PLD, 5ns, CMOS, PQFP128, PLASTIC, QFP-128 | EE PLD, 5ns, CMOS, PQFP128, TQFP-128 | EE PLD, 5ns, CMOS, PQFP128, TQFP-128 | EE PLD, 5ns, CMOS, PQFP128, PLASTIC, QFP-128 | EE PLD, 5ns, CMOS, PQFP128, TQFP-128 |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | QFP, | QFP, | LFQFP, | LFQFP, | QFP, | LFQFP, |
针数 | 128 | 128 | 128 | 128 | 128 | 128 |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
JESD-30 代码 | S-PQFP-G128 | S-PQFP-G128 | S-PQFP-G128 | S-PQFP-G128 | S-PQFP-G128 | S-PQFP-G128 |
长度 | 28 mm | 28 mm | 14 mm | 14 mm | 28 mm | 14 mm |
专用输入次数 | 6 | 6 | 6 | 6 | 6 | 6 |
I/O 线路数量 | 96 | 96 | 96 | 96 | 96 | 96 |
端子数量 | 128 | 128 | 128 | 128 | 128 | 128 |
组织 | 6 DEDICATED INPUTS, 96 I/O | 6 DEDICATED INPUTS, 96 I/O | 6 DEDICATED INPUTS, 96 I/O | 6 DEDICATED INPUTS, 96 I/O | 6 DEDICATED INPUTS, 96 I/O | 6 DEDICATED INPUTS, 96 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | LFQFP | LFQFP | QFP | LFQFP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 5 ns | 5 ns | 5 ns | 5 ns | 5 ns | 5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.93 mm | 3.93 mm | 1.6 mm | 1.6 mm | 3.93 mm | 1.6 mm |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.8 mm | 0.8 mm | 0.4 mm | 0.4 mm | 0.8 mm | 0.4 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 28 mm | 28 mm | 14 mm | 14 mm | 28 mm | 14 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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