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IDT72241L20LB

产品描述FIFO, 4KX9, 12ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32
产品类别存储    存储   
文件大小234KB,共14页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT72241L20LB概述

FIFO, 4KX9, 12ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32

IDT72241L20LB规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFJ
包装说明CERAMIC, LCC-32
针数32
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间12 ns
最大时钟频率 (fCLK)50 MHz
周期时间20 ns
JESD-30 代码R-CQCC-N32
JESD-609代码e0
长度13.97 mm
内存密度36864 bit
内存集成电路类型OTHER FIFO
内存宽度9
功能数量1
端子数量32
字数4096 words
字数代码4000
工作模式SYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织4KX9
可输出YES
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QCCN
封装等效代码LCC32,.45X.55
封装形状RECTANGULAR
封装形式CHIP CARRIER
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
认证状态Not Qualified
筛选级别MIL-STD-883 Class B
座面最大高度3.048 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb)
端子形式NO LEAD
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度11.43 mm

文档预览

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CMOS SyncFIFO™
64 x 9, 256 x 9, 512 x 9,1,024 x 9,
2,048 x 9, 4,096 x 9, 8,192 x 9
FEATURES:
IDT72421, IDT72201
IDT72211, IDT72221
IDT72231, IDT72241
IDT72251
64 x 9-bit organization (IDT72421)
256 x 9-bit organization (IDT72201)
512 x 9-bit organization (IDT72211)
1,024 x 9-bit organization (IDT72221)
2,048 x 9-bit organization (IDT72231)
4,096 x 9-bit organization (IDT72241)
8,192 x 9-bit organization (IDT72251)
10 ns read/write cycle time (excluding the IDT72251)
Read and Write Clocks can be independent
Dual-Ported zero fall-through time architecture
Empty and Full Flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags can be set
to any depth
Programmable Almost-Empty and Almost-Full flags default to
Empty+7, and Full-7, respectively
Output enable puts output data bus in high-impedance state
Advanced submicron CMOS technology
Available in the 32-pin plastic leaded chip carrier (PLCC)
All devices, except the 72251, are available in the ceramic
leadless chip carrier (LCC) and 32-pin Thin Quad Flat Pack
(TQFP)
For through-hole product please see the IDT72420/72200/72210/
72220/72230/72240 data sheet
Military product compliant to MIL-STD-883, Class B
Industrial temperature range (–40°C to +85°C) is available
°
°
(plastic packages only)
D
0
- D
8
The IDT72421/72201/72211/72221/72231/72241/72251 SyncFIFO™
are very high-speed, low-power First-In, First-Out (FIFO) memories with
clocked read and write controls. These devices have a 64, 256, 512, 1,024,
2,048, 4,096, and 8,192 x 9-bit memory array, respectively. These FIFOs are
applicable for a wide variety of data buffering needs such as graphics, local area
networks and interprocessor communication.
These FIFOs have 9-bit input and output ports. The input port is controlled
by a free-running clock (WCLK), and two write enable pins (WEN1, WEN2).
Data is written into the Synchronous FIFO on every rising clock edge when the
write enable pins are asserted. The output port is controlled by another clock
pin (RCLK) and two read enable pins (REN1,
REN2).
The Read Clock can
be tied to the Write Clock for single clock operation or the two clocks can run
asynchronous of one another for dual-clock operation. An output enable pin
(OE) is provided on the read port for three-state control of the output.
The Synchronous FIFOs have two fixed flags, Empty (EF) and Full (FF).
Two programmable flags, Almost-Empty (PAE) and Almost-Full (PAF), are
provided for improved system control. The programmable flags default to
Empty+7 and Full-7 for
PAE
and
PAF,
respectively. The programmable flag
offset loading is controlled by a simple state machine and is initiated by asserting
the load pin (LD).
These FIFOs are fabricated using IDT’s high-speed submicron CMOS
technology. Military grade product is manufactured in compliance with the latest
revision of MIL-STD-883, Class B.
DESCRIPTION:
FUNCTIONAL BLOCK DIAGRAM
WCLK
WEN1
WEN2
LD
INPUT REGISTER
OFFSET REGISTER
EF
PAE
PAF
FF
WRITE CONTROL
LOGIC
RAM ARRAY
64 x 9, 256 x 9,
512 x 9, 1,024 x 9,
2,048 x 9, 4,096 x 9,
8,192 x 9
FLAG
LOGIC
WRITE POINTER
READ POINTER
READ CONTROL
LOGIC
OUTPUT REGISTER
RESET LOGIC
RCLK
REN1
REN2
RS
OE
Q
0
- Q
8
2655 drw 01
OCTOBER 2000
DSC-2655/-
1
2000 Integrated Device Technology, Inc.

IDT72241L20LB相似产品对比

IDT72241L20LB IDT72211L10L IDT72201L10L IDT72421L10L IDT72221L10L IDT72231L10L IDT72231L20LB IDT72241L10L
描述 FIFO, 4KX9, 12ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 512X9, 6.5ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 256X9, 6.5ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 64X9, 6.5ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 1KX9, 6.5ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 2KX9, 6.5ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 2KX9, 12ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 4KX9, 6.5ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 QFJ QFJ QFJ QFJ QFJ QFJ QFJ QFJ
包装说明 CERAMIC, LCC-32 QCCN, QCCN, QCCN, CERAMIC, LCC-32 CERAMIC, LCC-32 CERAMIC, LCC-32 CERAMIC, LCC-32
针数 32 32 32 32 32 32 32 32
Reach Compliance Code not_compliant compliant compliant compliant compliant compliant not_compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 12 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 12 ns 6.5 ns
周期时间 20 ns 10 ns 10 ns 10 ns 10 ns 10 ns 20 ns 10 ns
JESD-30 代码 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0
长度 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm
内存密度 36864 bit 4608 bit 2304 bit 576 bit 9216 bit 18432 bit 18432 bit 36864 bit
内存宽度 9 9 9 9 9 9 9 9
功能数量 1 1 1 1 1 1 1 1
端子数量 32 32 32 32 32 32 32 32
字数 4096 words 512 words 256 words 64 words 1024 words 2048 words 2048 words 4096 words
字数代码 4000 512 256 64 1000 2000 2000 4000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 125 °C 70 °C 70 °C 70 °C 70 °C 70 °C 125 °C 70 °C
组织 4KX9 512X9 256X9 64X9 1KX9 2KX9 2KX9 4KX9
可输出 YES YES YES YES YES YES YES YES
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 QCCN QCCN QCCN QCCN QCCN QCCN QCCN QCCN
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED 225 225 NOT SPECIFIED NOT SPECIFIED 225 225
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.048 mm 3.048 mm 3.048 mm 3.048 mm 3.048 mm 3.048 mm 3.048 mm 3.048 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED 30 30 NOT SPECIFIED NOT SPECIFIED 30 30
宽度 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm
厂商名称 IDT (Integrated Device Technology) - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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