EEPROM, 64KX1, Serial, CMOS, PDSO8
| 参数名称 | 属性值 |
| 包装说明 | TSSOP-8 |
| Reach Compliance Code | compli |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 4.4 mm |
| 内存密度 | 65536 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 64KX1 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 筛选级别 | AEC-Q100; TS 16949 |
| 座面最大高度 | 1.2 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| Base Number Matches | 1 |
| 24AA64T-E/STVAO | 24AA64-E/STVAO | 24LC64-E/SN16KVAO | 24LC64T-E/MC16KVAO | 24LC64T-E/SN16KVAO | 24AA64-I/W16K | 24AA64/S15K | 24AA64T | 24AA64T-E/MNYVAO | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 64KX1, Serial, CMOS, PDSO8 | EEPROM, 64KX1, Serial, CMOS, PDSO8 | EEPROM, 8KX8, Serial, CMOS, PDSO8 | EEPROM, 8KX8, Serial, CMOS, PDSO8 | EEPROM, 8KX8, Serial, CMOS, PDSO8 | IC EEPROM 64K I2C 400KHZ WAFER | IC EEPROM 64K I2C 400KHZ WAFER | 存储器接口类型：I2C 存储器容量：64Kb (8K x 8) 工作电压：1.7V ~ 5.5V 存储器类型：Non-Volatile 64-Kbit(8K x 8bit)，I2C接口，工作电压：1.7V to 5.5V | EEPROM, 8KX8, Serial, CMOS, PDSO8 |
| 包装说明 | TSSOP-8 | TSSOP-8 | SOP, | HVSON, | SOP, | DIE, | - | - | TDFN-8 |
| Reach Compliance Code | compli | compli | compliant | compliant | compliant | unknown | - | - | compli |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | - | - | 0.4 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-G8 | R-XUUC-N | - | - | R-PDSO-N8 |
| 长度 | 4.4 mm | 4.4 mm | 4.9 mm | 3 mm | 4.9 mm | - | - | - | 3 mm |
| 内存密度 | 65536 bi | 65536 bi | 65536 bit | 65536 bit | 65536 bit | 65536 bit | - | - | 65536 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | - | - | EEPROM |
| 内存宽度 | 1 | 1 | 8 | 8 | 8 | 8 | - | - | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | - | - | - | 8 |
| 字数 | 65536 words | 65536 words | 8192 words | 8192 words | 8192 words | 8192 words | - | - | 8192 words |
| 字数代码 | 64000 | 64000 | 8000 | 8000 | 8000 | 8000 | - | - | 8000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | - | - | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - | -40 °C |
| 组织 | 64KX1 | 64KX1 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | - | - | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | - | - | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | SOP | HVSON | SOP | DIE | - | - | HVSON |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | UNCASED CHIP | - | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - | - | SERIAL |
| 筛选级别 | AEC-Q100; TS 16949 | AEC-Q100; TS 16949 | TS 16949 | TS 16949 | TS 16949 | - | - | - | TS 16949 |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.75 mm | 1 mm | 1.75 mm | - | - | - | 0.8 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | - | - | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 1.7 V | 2.5 V | 2.5 V | 2.5 V | 1.7 V | - | - | 1.7 V |
| 标称供电电压 (Vsup) | 3 V | 2.5 V | 5 V | 5 V | 5 V | 2.5 V | - | - | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | - | - | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | EEPROM | - | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | - | - | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD | - | - | NO LEAD |
| 端子节距 | 0.65 mm | 0.65 mm | 1.27 mm | 0.5 mm | 1.27 mm | - | - | - | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER | - | - | DUAL |
| 宽度 | 3 mm | 3 mm | 3.9 mm | 2 mm | 3.9 mm | - | - | - | 2 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | - | - | 5 ms |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
| 厂商名称 | - | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | - | - | Microchip(微芯科技) |
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