EEPROM, 128X16, Serial, CMOS, PDSO8, SSOP-8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | LSSOP, |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 其他特性 | DATA RETENTION: 10 YEARS |
| 最大时钟频率 (fCLK) | 0.5 MHz |
| 数据保留时间-最小值 | 10 |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e2 |
| 长度 | 4.4 mm |
| 内存密度 | 2048 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 128 words |
| 字数代码 | 128 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 128X16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.3 mm |
| 串行总线类型 | 3-WIRE |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver (Sn/Ag) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 10 |
| 宽度 | 3.1 mm |
| 最长写入周期时间 (tWC) | 10 ms |
| Base Number Matches | 1 |
| S-29U294AFSG | S-29U194ADFEG | S-29U194AFSG | S-29U294ADFEG | S-29U394ADFE-TF | S-29U394ADFE-TB | S-29U394AFSG | S-29U394ADFEG | |
|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 128X16, Serial, CMOS, PDSO8, SSOP-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, SSOP-8 | EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDSO8, SSOP-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, SOP-8 |
| 包装说明 | LSSOP, | LSOP, | LSSOP, | LSOP, | SOP, SOP8,.25 | SOP, SOP8,.25 | LSSOP, | LSOP, |
| Reach Compliance Code | compli | compli | compli | compli | unknow | unknow | compli | compli |
| 数据保留时间-最小值 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 内存密度 | 2048 bi | 1024 bi | 1024 bi | 2048 bi | 4096 bi | 4096 bi | 4096 bi | 4096 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 128 words | 64 words | 64 words | 128 words | 256 words | 256 words | 256 words | 256 words |
| 字数代码 | 128 | 64 | 64 | 128 | 256 | 256 | 256 | 256 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 128X16 | 64X16 | 64X16 | 128X16 | 256X16 | 256X16 | 256X16 | 256X16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | LSOP | LSSOP | LSOP | SOP | SOP | LSSOP | LSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | MICROWIRE | MICROWIRE | 3-WIRE | 3-WIRE |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - | - | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | - | - | SOIC | SOIC |
| 针数 | 8 | 8 | 8 | 8 | - | - | 8 | 8 |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | EAR99 | EAR99 |
| 其他特性 | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | - | - | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS |
| 最大时钟频率 (fCLK) | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | - | - | 0.5 MHz | 0.5 MHz |
| JESD-609代码 | e2 | e2 | e2 | e2 | - | - | e2 | e2 |
| 长度 | 4.4 mm | 5.2 mm | 4.4 mm | 5.2 mm | - | - | 4.4 mm | 5.2 mm |
| 功能数量 | 1 | 1 | 1 | 1 | - | - | 1 | 1 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS | SYNCHRONOUS |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | - | - | 260 | 260 |
| 座面最大高度 | 1.3 mm | 1.7 mm | 1.3 mm | 1.7 mm | - | - | 1.3 mm | 1.7 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - | - | 1.8 V | 1.8 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - | 3.3 V | 3.3 V |
| 端子面层 | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | - | - | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) |
| 处于峰值回流温度下的最长时间 | 10 | 10 | 10 | 10 | - | - | 10 | 10 |
| 宽度 | 3.1 mm | 4.4 mm | 3.1 mm | 4.4 mm | - | - | 3.1 mm | 4.4 mm |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | - | - | 10 ms | 10 ms |
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