|
ONET1151MRGTR |
ONET1151MRGTT |
描述 |
11.35Gbps Differential Modulator Driver with Output Waveform Shaping 16-VQFN -40 to 100 |
11.35Gbps Differential Modulator Driver with Output Waveform Shaping 16-VQFN -40 to 100 |
Brand Name |
Texas Instruments |
Texas Instruments |
是否无铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
包装说明 |
HVQCCN, LCC16,.12SQ,20 |
VQFN-16 |
Reach Compliance Code |
compli |
compliant |
Factory Lead Time |
6 weeks |
6 weeks |
应用程序 |
SONET; SDH |
SONET; SDH |
JESD-30 代码 |
S-PQCC-N16 |
S-PQCC-N16 |
JESD-609代码 |
e4 |
e4 |
长度 |
3 mm |
3 mm |
湿度敏感等级 |
2 |
2 |
功能数量 |
1 |
1 |
端子数量 |
16 |
16 |
最高工作温度 |
100 °C |
100 °C |
最低工作温度 |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
HVQCCN |
HVQCCN |
封装等效代码 |
LCC16,.12SQ,20 |
LCC16,.12SQ,20 |
封装形状 |
SQUARE |
SQUARE |
封装形式 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) |
260 |
260 |
座面最大高度 |
1 mm |
1 mm |
最大压摆率 |
100 mA |
100 mA |
标称供电电压 |
3.3 V |
3.3 V |
表面贴装 |
YES |
YES |
电信集成电路类型 |
ATM/SONET/SDH SUPPORT CIRCUIT |
ATM/SONET/SDH SUPPORT CIRCUIT |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
NO LEAD |
NO LEAD |
端子节距 |
0.5 mm |
0.5 mm |
端子位置 |
QUAD |
QUAD |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
3 mm |
3 mm |
Base Number Matches |
1 |
1 |