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IDT70V9389L7PRF9

产品描述Dual-Port SRAM, 64KX18, 18ns, CMOS, PQFP128, TQFP-128
产品类别存储    存储   
文件大小212KB,共19页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT70V9389L7PRF9概述

Dual-Port SRAM, 64KX18, 18ns, CMOS, PQFP128, TQFP-128

IDT70V9389L7PRF9规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明LFQFP,
针数128
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间18 ns
其他特性FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码R-PQFP-G128
JESD-609代码e0
长度20 mm
内存密度1179648 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量128
字数65536 words
字数代码64000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织64KX18
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)240
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度14 mm

文档预览

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HIGH-SPEED 3.3V
64K x18/x16
SYNCHRONOUS PIPELINED
DUAL-PORT STATIC RAM
Features:
IDT70V9389/289L
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
High-speed clock to data access
– Commercial: 6/7.5/9/12ns (max.)
– Industrial: 9ns (max.)
Low-power operation
– IDT70V9389/289L
Active: 500mW (typ.)
Standby: 1.5mW (typ.)
Flow-Through or Pipelined output mode on either port via
the
FT/PIPE
pins
Counter enable and reset features
Dual chip enables allow for depth expansion without
additional logic
Full synchronous operation on both ports
– 3.5ns setup to clock and 0ns hold on all control, data, and
address inputs
– Data input, address, and control registers
– Fast 6.5ns clock to data out in the Pipelined output mode
– Self-timed write allows fast cycle time
– 10ns cycle time, 100MHz operation in Pipelined output mode
Separate upper-byte and lower-byte controls for
multiplexed bus and bus matching compatibility
LVTTL- compatible, single 3.3V (±0.3V) power supply
Industrial temperature range (–40°C to +85°C) is
available for selected speeds
Available in a 128-pin Thin Quad Flatpack (TQFP) and
100-pin Thin Quad Flatpack (TQFP)
Functional Block Diagram
R/
W
L
UB
L
CE
0L
R/
W
R
UB
R
CE
0R
CE
1L
LB
L
OE
L
1
0
0/1
1
0
0/1
CE
1R
LB
R
OE
R
FT
/PIPE
L
0/1
1b 0b
b a
1a 0a
0a 1a
a
0b 1b
b
0/1
FT
/PIPE
R
I/O
9L
-I/O
17L
(2)
I/O
Control
I/O
0L
-I/O
8L
(1)
I/O
Control
I/O
9R
-I/O
17R
(1)
I/O
0R
-I/O
8R
(1)
A
15L
A
0L
CLK
L
Counter/
Address
Reg.
MEMORY
ARRAY
Counter/
Address
Reg.
A
15R
A
0R
CLK
R
ADS
L
CNTEN
L
CNTRST
L
ADS
R
CNTEN
R
CNTRST
R
4856 drw 01
NOTE:
1. I/O
0X
- I/O
7X
for IDT70V9289.
2. I/O
8X
- I/O
15
X
for IDT70V9289.
APRIL 2003
1
©2003 Integrated Device Technology, Inc.
DSC-4856/3

IDT70V9389L7PRF9相似产品对比

IDT70V9389L7PRF9 IDT70V9389L9PRF9 IDT70V9289L12PRF9 IDT70V9289L7PRF9 5046940201 IDT70V9389L12PRF9
描述 Dual-Port SRAM, 64KX18, 18ns, CMOS, PQFP128, TQFP-128 Dual-Port SRAM, 64KX18, 20ns, CMOS, PQFP128, TQFP-128 Dual-Port SRAM, 64KX16, 25ns, CMOS, PQFP128, TQFP-128 Dual-Port SRAM, 64KX16, 18ns, CMOS, PQFP128, TQFP-128 CP-3.3 Plug Housing, 3.30mm Pitch, Single Row, Polarized, Positive Inertia Lock Dual-Port SRAM, 64KX18, 25ns, CMOS, PQFP128, TQFP-128
是否无铅 含铅 含铅 含铅 含铅 - 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 - 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology)
零件包装代码 QFP QFP QFP QFP - QFP
包装说明 LFQFP, LFQFP, TQFP-128 TQFP-128 - LFQFP,
针数 128 128 128 128 - 128
Reach Compliance Code compliant compliant compliant compliant - compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A EAR99 3A991.B.2.B - 3A991.B.2.A
最长访问时间 18 ns 20 ns 25 ns 18 ns - 25 ns
其他特性 FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE - FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 - R-PQFP-G128
JESD-609代码 e0 e0 e0 e0 - e0
长度 20 mm 20 mm 20 mm 20 mm - 20 mm
内存密度 1179648 bit 1179648 bit 1048576 bit 1048576 bit - 1179648 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM - DUAL-PORT SRAM
内存宽度 18 18 16 16 - 18
湿度敏感等级 3 3 3 3 - 3
功能数量 1 1 1 1 - 1
端子数量 128 128 128 128 - 128
字数 65536 words 65536 words 65536 words 65536 words - 65536 words
字数代码 64000 64000 64000 64000 - 64000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C - 70 °C
组织 64KX18 64KX18 64KX16 64KX16 - 64KX18
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP LFQFP - LFQFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH - FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL - PARALLEL
峰值回流温度(摄氏度) 240 240 240 240 - 240
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm - 1.6 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V - 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V - 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V - 3.3 V
表面贴装 YES YES YES YES - YES
技术 CMOS CMOS CMOS CMOS - CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL - COMMERCIAL
端子面层 TIN LEAD TIN LEAD TIN LEAD TIN LEAD - TIN LEAD
端子形式 GULL WING GULL WING GULL WING GULL WING - GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm - 0.5 mm
端子位置 QUAD QUAD QUAD QUAD - QUAD
处于峰值回流温度下的最长时间 20 20 20 20 - 20
宽度 14 mm 14 mm 14 mm 14 mm - 14 mm

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