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IDT70T16L20PFG8

产品描述Dual-Port SRAM, 16KX9, 20ns, CMOS, PQFP80, 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80
产品类别存储    存储   
文件大小278KB,共18页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览

IDT70T16L20PFG8概述

Dual-Port SRAM, 16KX9, 20ns, CMOS, PQFP80, 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80

IDT70T16L20PFG8规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80
针数80
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间20 ns
JESD-30 代码S-PQFP-G80
JESD-609代码e3
长度14 mm
内存密度147456 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度9
湿度敏感等级3
功能数量1
端子数量80
字数16384 words
字数代码16000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织16KX9
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)2.6 V
最小供电电压 (Vsup)2.4 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14 mm

文档预览

下载PDF文档
HIGH-SPEED 2.5V
16/8K X 9 DUAL-PORT
STATIC RAM
Features
IDT70T16/5L
True Dual-Ported memory cells which allow simultaneous
reads of the same memory location
High-speed access
– Commercial:20/25ns (max.)
– Industrial: 25ns (max.)
Low-power operation
– IDT70T16/5L
Active: 200mW (typ.)
Standby: 600
µ
W (typ.)
IDT70T16/5 easily expands data bus width to 18 bits or
more using the Master/Slave select when cascading more
than one device
M/S = V
IH
for
BUSY
output flag on Master
M/S = V
IL
for
BUSY
input on Slave
Busy and Interrupt Flag
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
LVTTL-compatible, single 2.5V (±100mV) power supply
Available in an 80-pin TQFP and 100-pin
fpBGA
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Functional Block Diagram
OE
L
CE
L
R/W
L
OE
R
CE
R
R/W
R
I/O
0L
- I/O
8L
I/O
Control
BUSY
L
(2,3)
I/O
0R
-I/O
8R
I/O
Control
BUSY
R
Address
Decoder
14
(2,3)
A
13L
(1)
A
0L
MEMORY
ARRAY
14
Address
Decoder
A
13R
(1)
A
0R
CE
L
OE
L
R/W
L
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE
R
OE
R
R/W
R
SEM
L
(3)
INT
L
NOTES:
1. A
13
is a NC for IDT70T15.
2. (MASTER):
BUSY
is output; (SLAVE):
BUSY
is input.
3.
BUSY
outputs and
INT
outputs are non-tri-stated push-pull drivers.
M/S
SEM
R
(3)
INT
R
5663 drw 01
AUGUST 2004
1
©2004 Integrated Device Technology, Inc.
DSC 5663/2

IDT70T16L20PFG8相似产品对比

IDT70T16L20PFG8 IDT70T15L25PFG8 IDT70T15L25PFGI8 IDT70T15L20PFG8 IDT70T16L25PFG8 IDT70T16L25PFGI8
描述 Dual-Port SRAM, 16KX9, 20ns, CMOS, PQFP80, 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80 Dual-Port SRAM, 8KX9, 25ns, CMOS, PQFP80, 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80 Dual-Port SRAM, 8KX9, 25ns, CMOS, PQFP80, 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80 Dual-Port SRAM, 8KX9, 20ns, CMOS, PQFP80, 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80 Dual-Port SRAM, 16KX9, 25ns, CMOS, PQFP80, 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80 Dual-Port SRAM, 16KX9, 25ns, CMOS, PQFP80, 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP QFP QFP QFP QFP
包装说明 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80 1.18 X 1.18 INCH, 0.16 INCH HEIGHT, TQFP-80
针数 80 80 80 80 80 80
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 20 ns 25 ns 25 ns 20 ns 25 ns 25 ns
JESD-30 代码 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80
JESD-609代码 e3 e3 e3 e3 e3 e3
长度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
内存密度 147456 bit 73728 bit 73728 bit 73728 bit 147456 bit 147456 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 9 9 9 9 9 9
湿度敏感等级 3 3 3 3 3 3
功能数量 1 1 1 1 1 1
端子数量 80 80 80 80 80 80
字数 16384 words 8192 words 8192 words 8192 words 16384 words 16384 words
字数代码 16000 8000 8000 8000 16000 16000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 85 °C 70 °C 70 °C 85 °C
组织 16KX9 8KX9 8KX9 8KX9 16KX9 16KX9
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP LQFP LQFP LQFP LQFP LQFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 2.6 V 2.6 V 2.6 V 2.6 V 2.6 V 2.6 V
最小供电电压 (Vsup) 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL
端子面层 MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm

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