128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO5, SOT-23, 5 PIN
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
零件包装代码 | SOT-23 |
包装说明 | LSSOP, |
针数 | 5 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
其他特性 | 1000000 ERASE/WRITE CYCLES GUARANTEED |
最大时钟频率 (fCLK) | 0.1 MHz |
JESD-30 代码 | R-PDSO-G5 |
JESD-609代码 | e3 |
长度 | 2.95 mm |
内存密度 | 1024 bi |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 5 |
字数 | 128 words |
字数代码 | 128 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 128X8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.45 mm |
串行总线类型 | I2C |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.5 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.95 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 1.6 mm |
最长写入周期时间 (tWC) | 10 ms |
Base Number Matches | 1 |
24LCS61/OT | 24LCS61-E/OT | 24LCS61-E/P | 24LCS61-E/ST | 24LCS61-E/SN | 24LCS62-E/OT | 24LCS62-E/P | 24LCS62-E/ST | 24LCS62-E/SN | BLL8H1214L-250_15 | |
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描述 | 128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO5, SOT-23, 5 PIN | 128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO5, SOT-23, 5 PIN | 128 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | 128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, TSSOP-8 | 128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO5, SOT-23, 5 PIN | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, TSSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | LDMOS L-band radar power transistor |
零件包装代码 | SOT-23 | SOT-23 | DIP | SOIC | SOIC | SOT-23 | DIP | SOIC | SOIC | - |
包装说明 | LSSOP, | LSSOP, | DIP, | TSSOP, | SOP, | LSSOP, | DIP, | TSSOP, | SOP, | - |
针数 | 5 | 5 | 8 | 8 | 8 | 5 | 8 | 8 | 8 | - |
Reach Compliance Code | compli | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | - |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
其他特性 | 1000000 ERASE/WRITE CYCLES GUARANTEED | 1000000 ERASE/WRITE CYCLES GUARANTEED | 1000000 ERASE/WRITE CYCLES GUARANTEED | 1000000 ERASE/WRITE CYCLES GUARANTEED | 1000000 ERASE/WRITE CYCLES GUARANTEED | 1000000 ERASE/WRITE CYCLES GUARANTEED | 1000000 ERASE/WRITE CYCLES GUARANTEED | 1000000 ERASE/WRITE CYCLES GUARANTEED | 1000000 ERASE/WRITE CYCLES GUARANTEED | - |
最大时钟频率 (fCLK) | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | - |
JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G5 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | - |
长度 | 2.95 mm | 2.95 mm | 9.46 mm | 4.4 mm | 4.9 mm | 2.95 mm | 9.46 mm | 4.4 mm | 4.9 mm | - |
内存密度 | 1024 bi | 1024 bi | 1024 bi | 1024 bi | 1024 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | - |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | - |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
端子数量 | 5 | 5 | 8 | 8 | 8 | 5 | 8 | 8 | 8 | - |
字数 | 128 words | 128 words | 128 words | 128 words | 128 words | 256 words | 256 words | 256 words | 256 words | - |
字数代码 | 128 | 128 | 128 | 128 | 128 | 256 | 256 | 256 | 256 | - |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
组织 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 256X8 | 256X8 | 256X8 | 256X8 | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | LSSOP | LSSOP | DIP | TSSOP | SOP | LSSOP | DIP | TSSOP | SOP | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 1.45 mm | 1.45 mm | 4.32 mm | 1.1 mm | 1.75 mm | 1.45 mm | 4.32 mm | 1.1 mm | 1.75 mm | - |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | - |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
表面贴装 | YES | YES | NO | YES | YES | YES | NO | YES | YES | - |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
温度等级 | COMMERCIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | - |
端子节距 | 0.95 mm | 0.95 mm | 2.54 mm | 0.65 mm | 1.27 mm | 0.95 mm | 2.54 mm | 0.65 mm | 1.27 mm | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - |
宽度 | 1.6 mm | 1.6 mm | 7.62 mm | 3 mm | 3.9 mm | 1.6 mm | 7.62 mm | 3 mm | 3.9 mm | - |
最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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