Decade Counter, Synchronous, Up Direction, CMOS, CDIP16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Hughes Microelectronics |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| 计数方向 | UP |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e0 |
| 负载/预设输入 | NO |
| 逻辑集成电路类型 | DECADE COUNTER |
| 工作模式 | SYNCHRONOUS |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| HCTR6010D | HCTR6010P | HCTR6010AD | HCTR6010BD | HCTR6010BP | |
|---|---|---|---|---|---|
| 描述 | Decade Counter, Synchronous, Up Direction, CMOS, CDIP16 | Decade Counter, Synchronous, Up Direction, CMOS, PDIP16 | Decade Counter, Synchronous, Up Direction, CMOS, CDIP16 | Decade Counter, Synchronous, Up Direction, CMOS, CDIP16 | Decade Counter, Synchronous, Up Direction, CMOS, PDIP16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Hughes Microelectronics | Hughes Microelectronics | Hughes Microelectronics | Hughes Microelectronics | Hughes Microelectronics |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 计数方向 | UP | - | UP | UP | UP |
| JESD-30 代码 | R-XDIP-T16 | - | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 |
| 负载/预设输入 | NO | - | NO | NO | NO |
| 逻辑集成电路类型 | DECADE COUNTER | - | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER |
| 工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 16 | - | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC | - | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | DIP | DIP |
| 封装等效代码 | DIP16,.3 | - | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | - | NO | NO | NO |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL |
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