MN103SE5 Series
Type
Internal ROM type
ROM (byte)
RAM (byte)
Package (Lead-free)
Minimum Instruction
Execution Time
MN103SFE5P
FLASH
624K
32K
LQFP048-P2-0707A (Under development)
20.9
ns (at
3.0
V to
3.6
V,
48
MHz)
Interrupts
RESET. IRQ
×
3.
Timer
×
12.
I
2
C
×
7.
SIF
×
8.
DMA
×
12.
Stream DMA
×
1.
WDT. System error. USB
×
2.
I2S
×
1
Timer Counter
8-bit
timer
×
6
Reload-down count. Cascade connection possible (usable as a
16-bit
to
32-bit
timer)
16-bit
timer
×
2
Up-down count. Input capture. PWM output. Compare/capture register
2
channnels
Watchdog timer
×
1
Serial interface
Multi-master I
2
C
×
2
UART/Synchronous interface selective
×
4
Audio Output Interface
I2S interface
×
1
DMA controller
Number of channels:
4
channels
Unit of transfer:
8/16/32
bits
Maximum transfer cycles:
65535
Starting factor: External interrupt. Timer. Serial transmission/reception. I
2
C transmission/reception. Software. USB transmission/reception
end. I2S empty
Transfer method:
2-bus
cycle transfer
Adressing modes: Fixed. Increment. Decrement
Transfer mode: Word transfer. Burst transfer. Intermittent transfer
Stream DMA controller
Number of channels:
1
channels
Unit of transfer:
8/32
bits
Maximum transfer cycles:
65535
Transfer source: Interface RAM
Transfer destination: Serial I/F. Audio output interface
USB HOST Controller
Conforms to USB
2.0:
Full-speed (12 Mbps) supported
OHCI R1.0a standard conforming. External power supply control function. USB transceiver built-in
I/O Pins
I/O
27
:
(3 V I/O) Common use
Development tools
On-board Development Tools
PX-PAC-NUT103S-DT (with trace unit)
MAF00030BEM
Pin Assignment
MAF00030BEM
OCD_SDA
OCD_SCL
P00, EXTRG0
P01, EXTRG1
P02, TRCCLK
P03, TRCST
VSS
P04, TRCD0
P05, TRCD1
P06, TRCD2
P07, TRCD3
P83, TM11IOA, IRQ3, MCLK
37
38
39
40
41
42
43
44
45
46
47
48
P81, TM10IOA, SCL5
P82, TM10IOB, SDA5
P84, TM11IOB, SBO1, BCKA
P85, TM6IO, SBI1, SRDATAA
P86, TM7IO, SBT1, LRCLKA
P33, SBO3, SDA3
P34, SBI3
P35, SBT3, SCL3, CLK0
P92, SBT0, BCKB
P90, SBO0, SRDATAB
P91, SBI0
VDD3
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
VDD3
VDD3
VDD18
VSS
VPPEX
NRST
VDDI
PD4, IRQ1
PD2, SBT2
PD1, SBI2
PD0, SBO2
PD5, IRQ2, LRCLKB
36
35
34
33
32
31
30
29
28
27
26
25
MMOD1
MMOD0
VDDI, VOUT
VDD3
OSCO
OSCI
AVDD
USBD+
AVSS
USBD-
USBNPP, USBPP, PC1
USBNOC, PC0
LQFP048-P2-0707A
MN103SFE5P
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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