Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Solid State Scientific Inc |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-XDIP-T16 |
JESD-609代码 | e0 |
逻辑集成电路类型 | MULTIPLEXER |
功能数量 | 1 |
输入次数 | 8 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5/15 V |
认证状态 | Not Qualified |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
SCL4512BC | SCL4512BC++ | SCL4512BC+ | SCL4512BE | SCL4512BE+ | |
---|---|---|---|---|---|
描述 | Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16 | Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16 | Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16 | Multiplexer, 1-Func, 8 Line Input, CMOS, PDIP16 | Multiplexer, 1-Func, 8 Line Input, CMOS, PDIP16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
功能数量 | 1 | 1 | 1 | 1 | 1 |
输入次数 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
表面贴装 | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
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