SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications 32-VQFN -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | HVQCCN, |
| Reach Compliance Code | compli |
| Factory Lead Time | 6 weeks |
| Samacsys Descripti | Ultra-low power wireless MCU targeting 2.4GHz applications |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 16 |
| DAC 通道 | NO |
| DMA 通道 | YES |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQCC-N32 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 湿度敏感等级 | 3 |
| I/O 线路数量 | 15 |
| 端子数量 | 32 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| ROM可编程性 | FLASH |
| 座面最大高度 | 1 mm |
| 速度 | 48 MHz |
| 最大供电电压 | 3.8 V |
| 最小供电电压 | 1.8 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| CC2630F128RHBT | CC2630F128RSMR | CC2630F128RSMT | CC2630F128RHBR | CC2630F128RGZR | |
|---|---|---|---|---|---|
| 描述 | SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications 32-VQFN -40 to 85 | SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications 32-VQFN -40 to 85 | SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications 32-VQFN -40 to 85 | SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications 32-VQFN -40 to 85 | SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications 48-VQFN -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, |
| Reach Compliance Code | compli | compli | compli | compli | compli |
| Factory Lead Time | 6 weeks | 6 weeks | 8 weeks | 6 weeks | 8 weeks |
| 具有ADC | YES | YES | YES | YES | YES |
| 位大小 | 16 | 16 | 16 | 16 | 16 |
| DAC 通道 | NO | NO | NO | NO | NO |
| DMA 通道 | YES | YES | YES | YES | YES |
| JESD-30 代码 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N48 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 5 mm | 4 mm | 4 mm | 5 mm | 7 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
| I/O 线路数量 | 15 | 10 | 10 | 15 | 31 |
| 端子数量 | 32 | 32 | 32 | 32 | 48 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH |
| 座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 速度 | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| 最大供电电压 | 3.8 V | 3.8 V | 3.8 V | 3.8 V | 3.8 V |
| 最小供电电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.4 mm | 0.4 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 5 mm | 4 mm | 4 mm | 5 mm | 7 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - |
| Samacsys Descripti | Ultra-low power wireless MCU targeting 2.4GHz applications | SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications | RF Microcontrollers - MCU SimpleLink ultra-low power wireless MCU targeting Zigbee and 6LoWPAN applications 32-VQFN -40 to 85 | - | - |
| ECCN代码 | - | 5A992C | - | 5A992C | 5A992C |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
