EDO DRAM, 256KX16, 80ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40
参数名称 | 属性值 |
厂商名称 | Micron Technology |
零件包装代码 | SOJ |
包装说明 | SOJ, |
针数 | 40 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE WITH EDO |
最长访问时间 | 80 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 代码 | R-PDSO-J40 |
长度 | 26.06 mm |
内存密度 | 4194304 bit |
内存集成电路类型 | EDO DRAM |
内存宽度 | 16 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 40 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 256KX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOJ |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
认证状态 | Not Qualified |
刷新周期 | 512 |
座面最大高度 | 3.81 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 10.21 mm |
MT4C16270DJ-8TR | MT4C16270TG-7 | MT4C16270TG-7TR | MT4C16270TG-8 | MT4C16270TG-8TR | MT4C16270DJ-8 | MT4C16270TG-6TR | MT4C16270TG-6 | |
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描述 | EDO DRAM, 256KX16, 80ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40 | EDO DRAM, 256KX16, 70ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP-44/40 | EDO DRAM, 256KX16, 70ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP-44/40 | EDO DRAM, 256KX16, 80ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP-44/40 | EDO DRAM, 256KX16, 80ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP-44/40 | EDO DRAM, 256KX16, 80ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40 | EDO DRAM, 256KX16, 60ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP2-44/40 | EDO DRAM, 256KX16, 60ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP-44/40 |
厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
零件包装代码 | SOJ | TSOP | TSOP | TSOP | TSOP | SOJ | TSOP2 | TSOP |
包装说明 | SOJ, | 0.400 INCH, PLASTIC, TSOP-44/40 | TSOP2, | 0.400 INCH, PLASTIC, TSOP-44/40 | TSOP2, | 0.400 INCH, PLASTIC, SOJ-40 | TSOP2, | 0.400 INCH, PLASTIC, TSOP-44/40 |
针数 | 40 | 44 | 44 | 44 | 44 | 40 | 44 | 44 |
Reach Compliance Code | unknown | not_compliant | unknown | not_compliant | unknown | not_compliant | unknown | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
最长访问时间 | 80 ns | 70 ns | 70 ns | 80 ns | 80 ns | 80 ns | 60 ns | 60 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 代码 | R-PDSO-J40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-J40 | R-PDSO-G40 | R-PDSO-G40 |
长度 | 26.06 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 26.06 mm | 18.41 mm | 18.41 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOJ | TSOP2 | TSOP2 | TSOP2 | TSOP2 | SOJ | TSOP2 | TSOP2 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
座面最大高度 | 3.81 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.81 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | J BEND | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1.27 mm | 0.8 mm | 0.8 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.21 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.21 mm | 10.16 mm | 10.16 mm |
JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子面层 | - | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) |
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