1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP52, POWER, PLASTIC, LQFP-52
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | QFP |
| 包装说明 | HLQFP, |
| 针数 | 52 |
| Reach Compliance Code | unknown |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQFP-G52 |
| JESD-609代码 | e0 |
| 长度 | 10 mm |
| 最大线性误差 (EL) | 0.0317% |
| 湿度敏感等级 | 3 |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 52 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HLQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, HEAT SINK/SLUG, LOW PROFILE |
| 峰值回流温度（摄氏度） | 240 |
| 采样速率 | 125 MHz |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 1.6 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 10 mm |
| AD9433BSQ-125 | AD9433BSQZ-125 | AD9433BSQ-105 | AD9433BSQZ-105 | |
|---|---|---|---|---|
| 描述 | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP52, POWER, PLASTIC, LQFP-52 | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP52, POWER, PLASTIC, LQFP-52 | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP52, POWER, PLASTIC, LQFP-52 | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP52, POWER, PLASTIC, LQFP-52 |
| 是否无铅 | 含铅 | 不含铅 | 含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | QFP | QFP | QFP | QFP |
| 包装说明 | HLQFP, | HLQFP, | HLQFP, | HLQFP, |
| 针数 | 52 | 52 | 52 | 52 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQFP-G52 | S-PQFP-G52 | S-PQFP-G52 | S-PQFP-G52 |
| JESD-609代码 | e0 | e3 | e0 | e3 |
| 长度 | 10 mm | 10 mm | 10 mm | 10 mm |
| 最大线性误差 (EL) | 0.0317% | 0.0317% | 0.0317% | 0.0317% |
| 湿度敏感等级 | 3 | 3 | 3 | 3 |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 52 | 52 | 52 | 52 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HLQFP | HLQFP | HLQFP | HLQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, HEAT SINK/SLUG, LOW PROFILE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE |
| 峰值回流温度（摄氏度） | 240 | 260 | 240 | NOT APPLICABLE |
| 采样速率 | 125 MHz | 125 MHz | 105 MHz | 105 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | MATTE TIN | TIN LEAD | MATTE TIN |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 40 | 30 | NOT APPLICABLE |
| 宽度 | 10 mm | 10 mm | 10 mm | 10 mm |
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