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TS68C000DESC03XCA

产品描述Microprocessor, 32-Bit, 12.5MHz, HCMOS, CQCC68, GOLD PLATED, CERAMIC, LCC-68
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小668KB,共52页
制造商Atmel (Microchip)
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TS68C000DESC03XCA概述

Microprocessor, 32-Bit, 12.5MHz, HCMOS, CQCC68, GOLD PLATED, CERAMIC, LCC-68

TS68C000DESC03XCA规格参数

参数名称属性值
厂商名称Atmel (Microchip)
零件包装代码LCC
包装说明QCCN,
针数68
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
地址总线宽度24
位大小32
边界扫描NO
最大时钟频率12.5 MHz
外部数据总线宽度16
格式FIXED POINT
集成缓存NO
JESD-30 代码S-CQCC-N68
长度24.13 mm
低功率模式NO
端子数量68
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QCCN
封装形状SQUARE
封装形式CHIP CARRIER
认证状态Not Qualified
速度12.5 MHz
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术HCMOS
温度等级MILITARY
端子形式NO LEAD
端子节距1.27 mm
端子位置QUAD
宽度24.13 mm
uPs/uCs/外围集成电路类型MICROPROCESSOR

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Features
16-/32-bit Data and Address Register
16-Mbyte Direct Addressing Range
56 Powerful Instruction Types
Operations on Five Main Data Types
Memory Mapped Input/Output
14 Addressing Modes
Three Available Versions: 8 MHz/10 MHz and 12.5 MHz
Military Temperature Range: -55/+125°C
Power Supply: 5V
DC
± 10%
Description
The TS68C000 reduced power consumption device dissipates an order of magnitude
less power than the HMOS TS68000. The TS68C000 is an implementation of the
TS68000 16/32 microprocessor architecture. The TS68C000 has a 16-bit data bus
and 24-bit address bus while the full architecture provides for 32-bit address and data-
buses. It is completely code-compatible with the HMOS TS68000, TS68008 8-bit data
bus implementation of the TS68000 and the TS68020 32-bit implementation of the
architecture. Any user-mode programs written using the TS68C000 instruction set will
run unchanged on the TS68000, TS68008 and TS68020. This is possible because the
user programming model is identical for all processors and the instruction sets are
proper sub-sets of the complete architecture.
Low Power
HCMOS
16-/32-bit
Hi-Rel
Microprocessor
TS68C000
Screening/Quality
This product is manufactured in full compliance with:
MIL-STD-883 class B
DESC drawing 5962-89462
Atmel standards
C Suffix
DIL 64
Ceramic Package
F Suffix
CQFP 68
Ceramic Quad Flat Pack (on request)
E Suffix
LCCC 68
Leadless Ceramic Chip Carrier
R Suffix
PGA 68
Pin Grid Array
Rev. 2170A–HIREL–09/05

 
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