FRK9150D, FRK9150R,
FRK9150H
June 1998
26A, -100V, 0.125 Ohm, Rad Hard,
P-Channel Power MOSFETs
Package
TO-204AE
Features
• 26A, -100V, RDS(on) = 0.125
Ω
• Second Generation Rad Hard MOSFET Results From New Design Concepts
• Gamma
-
-
-
-
-
Meets Pre-Rad Specifications to 100KRAD(Si)
Defined End Point Specs at 300KRAD(Si) and 1000KRAD(Si)
Performance Permits Limited Use to 3000KRAD(Si)
Survives 3E9RAD(Si)/sec at 80% BVDSS Typically
Survives 2E12 Typically If Current Limited to IDM
• Gamma Dot
• Photo Current
• Neutron
- 7.0nA Per-RAD(Si)/sec Typically
- Pre-RAD Specifications for 3E13 Neutrons/cm
2
- Usable to 3E14 Neutrons/cm
2
Description
Intersil has designed a series of SECOND GENERATION hardened power MOS-
FETs of both N and P channel enhancement types with ratings from 100V to 500V,
1A to 60A, and on resistance as low as 25M
Ω
. Total dose hardness is offered at
100K RAD(Si) and 1000KRAD(Si) with neutron hardness ranging from 1E13n/cm2
for 500V product to 1E14n/cm2 for 100V product. Dose rate hardness (GAMMA
DOT) exists for rates to 1E9 without current limiting and 2E12 with current limiting.
This MOSFET is an enhancement-mode silicon-gate power field effect transistor of
the vertical DMOS (VDMOS) structure. It is specially designed and processed to
exhibit minimal characteristic changes to total dose (GAMMA) and neutron (n
o
)
exposures. Design and processing efforts are also directed to enhance survival to
heavy ion (SEE) and/or dose rate (GAMMA DOT) exposure.
This part may be supplied as a die or in various packages other than shown above.
Reliability screening is available as either non TX (commercial), TX equivalent of
MIL-S-19500, TXV equivalent of MIL-S-19500, or space equivalent of
MIL-S-19500. Contact Intersil Corporation’s High-Reliability Marketing group for
any desired deviations from the data sheet.
Symbol
D
G
S
Absolute Maximum Ratings
(TC = +25
o
C) Unless Otherwise Specified
FRK9150D, R, H
-100
-100
26
17
78
±
20
150
60
1.2
78
26
78
-55 to +150
300
UNITS
V
V
A
A
A
V
W
W
W/
o
C
A
A
A
o
C
o
C
Drain-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDS
Drain-Gate Voltage (RGS = 20k
Ω
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Continuous Drain Current
TC = +25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
TC = +100
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Gate-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS
Maximum Power Dissipation
TC = +25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT
TC = +100
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT
Derated Above +25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Inductive Current, Clamped, L = 100
µ
H, (See Test Figure) . . . . . . . . . . . . . . . . . . . . . . . . . . ILM
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IS
Pulsed Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ISM
Operating And Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJC, TSTG
Lead Temperature (During Soldering)
Distance > 0.063 in. (1.6mm) From Case, 10s Max . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
©2001 Fairchild Semiconductor Corporation
FRK9150D, FRK9150R, FRK9150H Rev. A
FRK9150D, FRK9150R, FRK9150H
Pre-Radiation Electrical Specifications
TC = +25
o
C, Unless Otherwise Specified
LIMITS
PARAMETER
Drain-Source Breakdown Volts
Gate-Threshold Volts
Gate-body Leakage Forward
Gate-Body Leakage Reverse
Zero-Gate Voltage
Drain Current
Rated Avalanche Current
Drain-Source On-State Volts
Drain-source On Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Gate-Charge Threshold
Gate-Charge On State
Gate-Charge Total
Plateau Voltage
Gate-Charge Source
Gate-Charge Drain
Diode Forward Voltage
Reverse Recovery Time
Junction-To-Case
Junction-To-Ambient
SYMBOL
BVDSS
VGS(th)
IGSSF
IGSSR
IDSS1
IDSS2
IDSS3
IAR
VDS(on)
RDS(on)
td(on)
tr
td(off)
tf
QG(th)
QG(on)
QGM
VGP
QGS
QGD
VSD
TT
R
θ
jc
R
θ
ja
Free Air Operation
ID = 26A, VGD = 0
I = 26A; di/dt = 100A/
µ
s
VDD = -50V, IDD = 26A
IGS1 = IGS2
0
≤
VGS
≤
20
TEST CONDITIONS
VGS = 0, ID = 1mA
VDS = VGS, ID = 1mA
VGS = -20V
VGS = +20V
VDS = -100V, VGS = 0
VDS = -80V, VGS = 0
VDS = -80V, VGS = 0, TC = +125
o
C
Time = 20
µ
s
VGS = -10V, ID = 26A
VGS = -10V, ID = 17A
VDD = -50V, ID = 26A
Pulse Width = 3
µ
s
Period = 300
µ
s, Rg = 25
Ω
0
≤
VGS
≤
10 (See Test Circuit)
MIN
-100
-2.0
-
-
-
-
-
-
-
-
-
-
-
-
3
58
129
-3
16
21
-0.6
-
-
-
MAX
-
-4.0
100
100
1
0.025
0.25
78
-3.41
.125
164
672
ns
326
240
15
234
518
-14
66
nc
86
-1.8
500
.83
30
V
ns
o
C/W
UNITS
V
V
nA
nA
mA
A
V
Ω
nc
V
ELECTRONIC SWITCH OPENS
WHEN I
AS
IS REACHED
V
DD
V
DS
L
R
L
V
DS
0V
DUT
+
CURRENT I
TRANSFORMER
AS
-
VARY t
P
TO OBTAIN
REQUIRED PEAK I
AS
0V
t
P
50Ω
+
-
DUT
50Ω
V
DD
V
GS
= -12V
R
GS
V
GS
≤
20V
50V-150V
FIGURE 1. RESISTIVE SWITCHING TEST CIRCUIT
FIGURE 2. UNCLAMPED ENERGY TEST CIRCUIT
©2001 Fairchild Semiconductor Corporation
FRK9150D, FRK9150R, FRK9150H Rev. A
FRK9150D, FRK9150R, FRK9150H
Post-Radiation Electrical Specifications
TC = +25
o
C, Unless Otherwise Specified
LIMITS
PARAMETER
Drain-Source
Breakdown Volts
(Note 4, 6)
(Note 5, 6)
Gate-Source
Threshold Volts
(Note 4, 6)
(Note 3, 5, 6)
Gate-Body
Leakage Forward
(Note 4, 6)
(Note 5, 6)
Gate-Body
Leakage Reverse
(Note 2, 4, 6)
(Note 2, 5, 6)
Zero-Gate Voltage
Drain Current
(Note 4, 6)
(Note 5, 6)
Drain-Source
On-state Volts
(Note 1, 4, 6)
(Note 1, 5, 6)
Drain-Source
On Resistance
(Note 1, 4, 6)
(Note 1, 5, 6)
NOTES:
1. Pulse test, 300
µ
s max
2. Absolute value
3. Gamma = 300KRAD(Si)
4. Gamma = 10KRAD(Si) for “D”, 100KRAD(Si) for “R”. Neutron = 3E13
5. Gamma = 1000KRAD(Si). Neutron = 3E13
6. Insitu Gamma bias must be sampled for both VGS = -10V, VDS = 0V and VGS = 0V, VDS = 80% BVDSS
7. Gamma data taken 1/18/91 on TA17751 devices by GE ASTRO SPACE; EMC/SURVIVABILITY LABORATORY; KING OF PRUSSIA,
PA 19401
8. Single event drain burnout testing by Titus, J.L., et al of NWSC, Crane, IN at Brookhaven Nat. Lab. Dec 11-14, 1989
9. Neutron derivation, INTERSIL Application note AN-8831, Oct. 1988
SYMBOL
BVDSS
BVDSS
VGS(th)
VGS(th)
IGSSF
IGSSF
IGSSR
IGSSR
IDSS
IDSS
VDS(on)
VDS(on)
RDS(on)
RDS(on)
TYPE
FRK9150D, R
FRK9150H
FRK9150D, R
FRK9150H
FRK9150D, R
FRK9150H
FRK9150D, R
FRK9150H
FRK9150D, R
FRK9150H
FRK9150D, R
FRK9150H
FRK9150D, R
FRK9150H
TEST CONDITIONS
VGS = 0, ID = 1mA
VGS = 0, ID = 1mA
VGS = VDS, ID = 1mA
VGS = VDS, ID = 1mA
VGS = -20V, VDS = 0
VGS = -20V, VDS = 0
VGS = +20V, VDS = 0
VGS = +20V, VDS = 0
VGS = 0, VDS = -80V
VGS = 0, VDS = -80V
VGS = -10V, ID = 26A
VGS = -16V, ID = 26A
VGS = -10V, ID = 17A
VGS = -14V, ID = 17A
MIN
-100
-95
-2.0
-2.0
-
-
-
-
-
-
-
-
-
-
MAX
-
-
-4.0
-6.0
100
200
100
200
25
100
-3.41
-5.12
.125
.188
UNITS
V
V
V
V
nA
nA
nA
nA
µ
A
µ
A
V
V
Ω
Ω
©2001 Fairchild Semiconductor Corporation
FRK9150D, FRK9150R, FRK9150H Rev. A
FRK9150D, FRK9150R, FRK9150H
Typical Performance Characteristics
©2001 Fairchild Semiconductor Corporation
FRK9150D, FRK9150R, FRK9150H Rev. A
FRK9150D, FRK9150R, FRK9150H
Typical Performance Characteristics
(Continued)
©2001 Fairchild Semiconductor Corporation
FRK9150D, FRK9150R, FRK9150H Rev. A
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