Quadruple D-Type Flip-Flops With Clear 16-SOIC -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| Factory Lead Time | 6 weeks |
| 系列 | HC |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 9.9 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Su | 25000000 Hz |
| 最大I（ol） | 0.0052 A |
| 湿度敏感等级 | 1 |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2/6 V |
| 最大电源电流（ICC） | 0.08 mA |
| Prop。Delay @ Nom-Su | 38 ns |
| 传播延迟（tpd） | 190 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 3.91 mm |
| 最小 fmax | 29 MHz |
| SN74HC175DG4 | SN74HC175PWT | SN74HC175PWR | SN74HC175PW | SN74HC175NSR | SN74HC175NE4 | CP41T-AHS | AD163 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Quadruple D-Type Flip-Flops With Clear 16-SOIC -40 to 85 | Flip Flops Quadruple D-Type Flip-Flop W/Clear | Quadruple D-Type Flip-Flops With Clear 16-TSSOP -40 to 85 | Quadruple D-Type Flip-Flops With Clear 16-TSSOP -40 to 85 | Quadruple D-Type Flip-Flops With Clear 16-SO -40 to 85 | Quadruple D-Type Flip-Flops With Clear 16-PDIP -40 to 85 | Cree® P4 LED | GERMANIUM POWER TRANSISTORS |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - |
| 是否无铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | - | - | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - |
| 零件包装代码 | SOIC | TSSOP | TSSOP | TSSOP | SOIC | DIP | - | - |
| 包装说明 | SOP, SOP16,.25 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 | SOP, SOP16,.3 | DIP, DIP16,.3 | - | - |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | - | - |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | - | - |
| Factory Lead Time | 6 weeks | 1 week | 6 weeks | 1 week | 1 week | 6 weeks | - | - |
| 系列 | HC | HC/UH | HC | HC/UH | HC | HC | - | - |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | - | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | - | - |
| 长度 | 9.9 mm | 5 mm | 5 mm | 5 mm | 10.3 mm | 19.3 mm | - | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | - |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - | - |
| 最大频率@ Nom-Su | 25000000 Hz | 25000000 Hz | 25000000 Hz | 25000000 Hz | 25000000 Hz | 25000000 Hz | - | - |
| 最大I（ol） | 0.0052 A | 0.004 A | 0.0052 A | 0.0052 A | 0.0052 A | 0.0052 A | - | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | - | - | - |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | - | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | SOP | TSSOP | TSSOP | TSSOP | SOP | DIP | - | - |
| 封装等效代码 | SOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | SOP16,.3 | DIP16,.3 | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | - | - |
| 包装方法 | TUBE | TAPE AND REEL | TR | TUBE | TR | TUBE | - | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED | - | - |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | - | - |
| 最大电源电流（ICC） | 0.08 mA | - | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | - | - |
| Prop。Delay @ Nom-Su | 38 ns | - | 38 ns | 38 ns | 38 ns | 38 ns | - | - |
| 传播延迟（tpd） | 190 ns | 190 ns | 190 ns | 190 ns | 190 ns | 190 ns | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 座面最大高度 | 1.75 mm | 1.2 mm | 1.2 mm | 1.2 mm | 2 mm | 5.08 mm | - | - |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | - | - |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 表面贴装 | YES | YES | YES | YES | YES | NO | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | - | - |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 2.54 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | - |
| 宽度 | 3.91 mm | 4.4 mm | 4.4 mm | 4.4 mm | 5.3 mm | 6.35 mm | - | - |
| 最小 fmax | 29 MHz | 29 MHz | 29 MHz | 29 MHz | 29 MHz | 29 MHz | - | - |
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