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IDT71V65602S150BQI

产品描述ZBT SRAM, 256KX36, 3.8ns, CMOS, PBGA165, 13 X 15 MM, FPBGA-165
产品类别存储    存储   
文件大小499KB,共26页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT71V65602S150BQI概述

ZBT SRAM, 256KX36, 3.8ns, CMOS, PBGA165, 13 X 15 MM, FPBGA-165

IDT71V65602S150BQI规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明13 X 15 MM, FPBGA-165
针数165
Reach Compliance Codenot_compliant
ECCN代码3A991.B.2.A
最长访问时间3.8 ns
其他特性PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)150 MHz
I/O 类型COMMON
JESD-30 代码R-PBGA-B165
JESD-609代码e0
长度15 mm
内存密度9437184 bit
内存集成电路类型ZBT SRAM
内存宽度36
湿度敏感等级3
功能数量1
端子数量165
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织256KX36
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TBGA
封装等效代码BGA165,11X15,40
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)225
电源2.5,3.3 V
认证状态Not Qualified
座面最大高度1.2 mm
最大待机电流0.06 A
最小待机电流3.14 V
最大压摆率0.345 mA
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度13 mm

文档预览

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256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
2.5V I/O, Burst Counter
Pipelined Outputs
x
x
x
x
x
x
x
x
x
x
x
x
x
IDT71V65602
IDT71V65802
Features
256K x 36, 512K x 18 memory configurations
Supports high performance system speed - 150MHz
(3.8ns Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read cycles
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
Three chip enables for simple depth expansion
3.3V power supply (±5%)
2.5V I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad and
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA)
Description
The IDT71V65602/5802 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMs. They are designed to eliminate dead
bus cycles when turning the bus around between reads and writes, or
writes and reads. Thus, they have been given the name ZBT
TM
, or Zero
Bus Turnaround.
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read or write.
The IDT71V65602/5802 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used to
disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65602/5802
to be suspended as long as necessary. All synchronous inputs are ignored
when (CEN) is high and the internal device registers will hold their previous
values.
There are three chip enable pins (CE
1
, CE
2
,
CE
2
) that allow the
user to deselect the device when desired. If any one of these three are not
asserted when ADV/LD is low, no new memory operation can be initiated.
However, any pending data transfers (reads or writes) will be completed. The
data bus will tri-state two cycles after chip is deselected or a write is initiated.
The IDT71V65602/5802 have an on-chip burst counter. In the burst
mode, the IDT71V65602/5802 can provide four cycles of data for a single
address presented to the SRAM. The order of the burst sequence is defined
by the
LBO
input pin. The
LBO
pin selects between linear and interleaved burst
sequence. The ADV/LD signal is used to load a new external address (ADV/
LD
= LOW) or increment the internal burst counter (ADV/LD = HIGH).
The IDT71V65602/5802 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm 100-
pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA)
and a 165 fine pitch ball grid array (fBGA).
Pin Description Summary
A
0
-A
1 8
CE
1
, CE
2
,
CE
2
OE
R/W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
A DV /LD
LBO
ZZ
I/O
0
-I/O
3 1
, I/O
P 1
-I/O
P 4
V
D D
, V
D DQ
V
SS
A d d re ss Inp uts
Chip E nab le s
Outp ut E nab le
Re ad /Write S ig nal
Clo c k E nab le
Ind ivid ual B yte W rite S e le cts
Clo ck
A d v ance b urst ad d re ss / Lo ad ne w ad d re ss
Line ar / Inte rle ave d B urst Ord e r
S le e p M o d e
Data Inp ut / Outp ut
Co re P o we r, I/O P o we r
Gro und
Inp ut
Inp ut
Inp ut
Inp ut
Inp ut
Inp ut
Inp ut
Inp ut
Inp ut
Inp ut
I/O
S up p ly
S up p ly
S ynchro no us
S ynchro no us
A s ynchro no us
S ynchro no us
S ynchro no us
S ynchro no us
N/A
S ynchro no us
S tatic
A s ynchro no us
S ynchro no us
S tatic
S tatic
5303 tbl 01
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
DECEMBER 2002
DSC-5303/04
1
©2002 Integrated Device Technology, Inc.

IDT71V65602S150BQI相似产品对比

IDT71V65602S150BQI IDT71V65602S100BGI IDT71V65802S133PFI IDT71V65802S150BGI IDT71V65602S150BGI
描述 ZBT SRAM, 256KX36, 3.8ns, CMOS, PBGA165, 13 X 15 MM, FPBGA-165 ZBT SRAM, 256KX36, 5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 512KX18, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 256KX36, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119
是否无铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA BGA QFP BGA BGA
包装说明 13 X 15 MM, FPBGA-165 14 X 22 MM, PLASTIC, BGA-119 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 14 X 22 MM, PLASTIC, BGA-119 14 X 22 MM, PLASTIC, BGA-119
针数 165 119 100 119 119
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 3.8 ns 5 ns 4.2 ns 3.8 ns 3.8 ns
其他特性 PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
最大时钟频率 (fCLK) 150 MHz 100 MHz 133 MHz 150 MHz 150 MHz
I/O 类型 COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-PBGA-B165 R-PBGA-B119 R-PQFP-G100 R-PBGA-B119 R-PBGA-B119
JESD-609代码 e0 e0 e0 e0 e0
长度 15 mm 22 mm 20 mm 22 mm 22 mm
内存密度 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit
内存集成电路类型 ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
内存宽度 36 36 18 18 36
湿度敏感等级 3 3 3 3 3
功能数量 1 1 1 1 1
端子数量 165 119 100 119 119
字数 262144 words 262144 words 524288 words 524288 words 262144 words
字数代码 256000 256000 512000 512000 256000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
组织 256KX36 256KX36 512KX18 512KX18 256KX36
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TBGA BGA LQFP BGA BGA
封装等效代码 BGA165,11X15,40 BGA119,7X17,50 QFP100,.63X.87 BGA119,7X17,50 BGA119,7X17,50
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE GRID ARRAY FLATPACK, LOW PROFILE GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 240 225 225
电源 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 2.36 mm 1.6 mm 2.36 mm 2.36 mm
最大待机电流 0.06 A 0.06 A 0.06 A 0.06 A 0.06 A
最大压摆率 0.345 mA 0.27 mA 0.32 mA 0.345 mA 0.345 mA
最大供电电压 (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn85Pb15) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL GULL WING BALL BALL
端子节距 1 mm 1.27 mm 0.65 mm 1.27 mm 1.27 mm
端子位置 BOTTOM BOTTOM QUAD BOTTOM BOTTOM
处于峰值回流温度下的最长时间 20 20 20 20 20
宽度 13 mm 14 mm 14 mm 14 mm 14 mm
最小待机电流 3.14 V 3.14 V - - 3.14 V
Base Number Matches - 1 1 1 -

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