Switch/Digital Output Temperature Sensor, DIGITAL TEMP SENSOR-SERIAL, 10BIT(s), 1Cel, SQUARE, SURFACE MOUNT, MICRO, SOIC-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大精度（摄氏度） | 1 Cel |
| 其他特性 | THIS IS A TEMPERATURE MEASUREMENT ONLY DEVICE |
| 主体宽度 | 3 mm |
| 主体高度 | 1.01 mm |
| 主体长度或直径 | 3 mm |
| 外壳 | PLASTIC |
| JESD-609代码 | e3 |
| 安装特点 | SURFACE MOUNT |
| 位数 | 10 |
| 最大工作电流 | 0.003 mA |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出接口类型 | 3-WIRE INTERFACE |
| 封装形状/形式 | SQUARE |
| 传感器/换能器类型 | TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.7 V |
| 表面贴装 | YES |
| 端子面层 | Matte Tin (Sn) |
| 端接类型 | SOLDER |
| AD7816ARMZ | AD7817SRZ | AD7816ARMZ-REEL7 | AD7816ARZ-REEL | AD7816ARZ-REEL7 | AD7816ARMZ-REEL | |
|---|---|---|---|---|---|---|
| 描述 | Switch/Digital Output Temperature Sensor, DIGITAL TEMP SENSOR-SERIAL, 10BIT(s), 1Cel, SQUARE, SURFACE MOUNT, MICRO, SOIC-8 | IC 4-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16, MS-012-AC, SOIC-16, Analog to Digital Converter | IC SPECIALTY ANALOG CIRCUIT, PDSO8, MICRO, SOIC-8, Analog IC:Other | IC SPECIALTY ANALOG CIRCUIT, PDSO8, SOIC-8, Analog IC:Other | IC SPECIALTY ANALOG CIRCUIT, PDSO8, SOIC-8, Analog IC:Other | IC SPECIALTY ANALOG CIRCUIT, PDSO8, MICRO, SOIC-8, Analog IC:Other |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| Reach Compliance Code | compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | THIS IS A TEMPERATURE MEASUREMENT ONLY DEVICE | - | THIS IS A TEMPERATURE MEASUREMENT ONLY DEVICE | THIS IS A TEMPERATURE MEASUREMENT ONLY DEVICE | THIS IS A TEMPERATURE MEASUREMENT ONLY DEVICE | THIS IS A TEMPERATURE MEASUREMENT ONLY DEVICE |
| JESD-609代码 | e3 | - | e3 | e3 | e3 | e3 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 表面贴装 | YES | - | YES | YES | YES | YES |
| 端子面层 | Matte Tin (Sn) | - | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
| 零件包装代码 | - | SOIC | SOIC | SOIC | SOIC | SOIC |
| 针数 | - | 16 | 8 | 8 | 8 | 8 |
| 包装说明 | - | - | MICRO, SOIC-8 | SOIC-8 | SOIC-8 | MICRO, SOIC-8 |
| 模拟集成电路 - 其他类型 | - | - | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
| JESD-30 代码 | - | - | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 |
| 长度 | - | - | 3 mm | 4.9 mm | 4.9 mm | 3 mm |
| 湿度敏感等级 | - | - | 1 | 1 | 1 | 1 |
| 功能数量 | - | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | - | 8 | 8 | 8 | 8 |
| 封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | TSSOP | SOP | SOP | TSSOP |
| 封装形状 | - | - | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | - | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | - | - | 260 | 260 | 260 | 260 |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | - | 1.1 mm | 1.75 mm | 1.75 mm | 1.1 mm |
| 最大供电电压 (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | - | - | 3 V | 3 V | 3 V | 3 V |
| 温度等级 | - | - | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | - | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | - | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm |
| 端子位置 | - | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | - | 40 | 40 | 40 | 40 |
| 宽度 | - | - | 3 mm | 3.9 mm | 3.9 mm | 3 mm |
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