电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

FMM5815X

产品描述Wide Band Medium Power Amplifier, 17500MHz Min, 20000MHz Max, 3.57 X 2.76 MM, 0.07 MM HEIGHT, HERMETIC SEALED, DIE
产品类别无线/射频/通信    射频和微波   
文件大小1006KB,共4页
制造商SUMITOMO(住友)
官网地址https://global-sei.com/
标准  
下载文档 详细参数 全文预览

FMM5815X概述

Wide Band Medium Power Amplifier, 17500MHz Min, 20000MHz Max, 3.57 X 2.76 MM, 0.07 MM HEIGHT, HERMETIC SEALED, DIE

FMM5815X规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称SUMITOMO(住友)
Reach Compliance Codeunknown
其他特性HIGH RELIABILITY
特性阻抗50 Ω
构造COMPONENT
最大输入功率 (CW)22 dBm
最大工作频率20000 MHz
最小工作频率17500 MHz
最高工作温度85 °C
最低工作温度-65 °C
射频/微波设备类型WIDE BAND MEDIUM POWER

FMM5815X文档预览

FMM5815X
17.5-20GHz Power Amplifier MMIC
FEATURES
High Output Power: P1dB = 31dBm (Typ.)
High Gain: G1dB = 21dB (Typ.)
High PAE:
η
add = 30% (Typ.)
Impedance Matched Zin/Zout = 50Ω
0.25µm PHEMT Technology
DESCRIPTION
The FMM5815X is a high-gain, high linearity, 3-stage MMIC
amplifier designed for operation in the17.5-20.0 GHz
frequency range. This amplifier has an input and output
designed for use in 50Ω systems.This device is well suited for
point-to-point communication applications.
Eudyna’s stringent Quality Assurance Program assures the
highest reliability and consistent performance.
ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25°C)
Item
Drain Voltage
Gate Voltage
Input Power
Storage Temperature
Operating Backside Temperature
Symbol
VDD
VGG
Pin
Tstg
Top
Condition
Rating
10
-3.0
22
-65 to +175
-65 to +85
Unit
V
V
dBm
°C
°C
Eudyna recommends the following conditions for the long term reliable operation of GaAs FETs:
1. The drain-source operating voltage (VDD) should not exceed 6 volts.
2. The forward and reverse gate currents should not exceed 4 and -0.39 mA respectively.
3. This product should be hermetically packaged
ELECTRICAL CHARACTERISTICS (Ambient Temperature Tc=25°C)
Item
Frequency Range
Output Power at 1 dB G.C.P.
Power Gain at 1 dB G.C.P.
Drain Current
Power-Added Efficiency
Input Return Loss
Output Return Loss
3rd Order Intermodulation
Distortion
Symbol
f
P
1dB
G
1dB
Iddrf
η
add
RLin
RLout
IM3
VDD = 6V
IDD
=
600mA (Typ.)
ZS = ZL = 50Ω
Conditions
Limits
Min. Typ. Max.
17.5 - 20.0
29.5
19
-
-
-
-
∆f=10MHz,
2-Tone Test,
-37.0
Pout=20dBm S.C.L.
31
21
700
30
-12
-8
-40
-
24
950
-
-
-
-
Unit
GHz
dBm
dB
mA
%
dB
dB
dBc
Note 1:
RF parameter sample size 10pcs. Criteria (accept/reject)=(0/1)
Note 2:
Electrical Characteristic is specified on RF-probe measurements
G.C.P.: Gain Compression Point
S.C.L.: Single Carrier Level
Edition 1.1
September 2004
1
FMM5815X
17.5-20GHz Power Amplifier MMIC
IM3 vs. OUTPUT POWER
-20
-25
-30
IM3 (dBc)
-35
-40
-45
-50
-55
-60
17
19
21
23
25
27
29
15
Total Output Power (dBm)
-4
0
4
8
12
0
VDD = 6V
IDD(DC) = 600mA
OUTPUT POWER vs. INPUT POWER
35
VDD = 6V
IDD(DC) = 600mA
Total Output Power (dBm)
17.5GHz
18.0GHz
20.0GHz
31
17.5GHz
18.0GHz
20.0GHz
Pout
27
23
η
add
40
η
add (%)
19
20
Total Input Power (dBm)
P1dB & G1dB vs. FREQUENCY
40
36
P1dB(dBm), G1dB(dB)
32
28
24
20
16
VDD = 6V
IDD(DC) = 600mA
P1dB
G1dB
η
add
120
104
88
72
56
40
24
η
add (%)
17.5
18.0
18.5
19.0
19.5
20.0
Frequency (GHz)
2
FMM5815X
17.5-20GHz Power Amplifier MMIC
S-PARAMETERS
VDD = 6V, IDS = 600mA
FREQUENCY
S11
(MHZ)
MAG
ANG
16500
17000
17500
18000
18500
19000
19500
20000
20500
21000
.357
.385
.443
.512
.566
.572
.538
.459
.346
.307
47.0
19.3
-10.5
-39.3
-66.7
-92.9
-117.9
-144.7
165.1
74.2
S21
MAG
10.785
12.059
13.360
14.483
14.782
14.585
13.693
13.188
12.600
11.066
S12
ANG
MAG
.004
.005
.005
.007
.007
.005
.005
.003
.005
.006
S22
ANG
-51.8
-42.8
-62.5
-83.0
-95.1
-112.5
-142.9
94.6
33.8
-10.5
MAG
.110
.111
.169
.205
.220
.178
.121
.051
.044
.080
ANG
-20.6
-93.5
-134.6
-166.6
164.9
137.0
108.3
53.6
19.8
11.4
-44.4
-80.4
-117.3
-156.9
161.9
120.3
78.7
37.1
-10.4
-65.4
ASSEMBLY DRAWING
VGG
0.15µF
VDD
0.15µF
220pF
220pF
RFin
RFout
220pF
220pF
Chip Size: 3.57mm x 2.76mm
0.15µF
VDD
3
FMM5815X
17.5-20GHz Power Amplifier MMIC
CHIP OUTLINE
VGG1
VDD1
0
2760
2640
2555
620 750
1155
2380
VDD2
3075
3570
2760
2510
1380
1194
RFout
RFin
280
205
120
0
250
0
Chip Size: 3570µm x 2760µm
Chip Thickness: 70µm
Pad Dimensions: 1. DC Pad: 80µm x 80µm
VDD: 100µm x 100µm
2. RF Pad: 120µm x 80µm
Unit:
µm
0 120
636 750
VDD3
1155
VDD4
VGG2
2380
3075
VDD5
3450 3570
For further information please contact:
CAUTION
Eudyna Devices Inc. products contain
gallium arsenide
(GaAs)
which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
Eudyna Devices USA Inc.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
TEL: (408) 232-9500
FAX: (408) 428-9111
www.us.eudyna.com
• Do not put this product into the mouth.
• Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these by-products
are dangerous to the human body if inhaled, ingested, or swallowed.
• Observe government laws and company regulations when discarding this
product. This product must be discarded in accordance with methods
specified by applicable hazardous waste procedures.
Eudyna Devices Europe Ltd.
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: +44 (0) 1628 504800
FAX: +44 (0) 1628 504888
Eudyna Devices Asia Pte Ltd.
Hong Kong Branch
Rm. 1101, Ocean Centre, 5 Canton Rd.
Tsim Sha Tsui, Kowloon, Hong Kong
TEL: +852-2377-0227
FAX: +852-2377-3921
Eudyna Devices Inc. reserves the right to change products and specifications
without notice. The information does not convey any license under rights of
Eudyna Devices Inc. or others.
© 2004 Eudyna Devices USA Inc.
Printed in U.S.A.
Eudyna Devices Inc.
Sales Division
1, Kanai-cho, Sakae-ku
Yokohama, 244-0845, Japan
TEL: +81-45-853-8156
FAX: +81-45-853-8170
4
什么是WiFi模块的网口?
WiFi模块的网口要从两方面来讲, (1)硬件上: 网络接口指的网络设备的各种接口,我们现今正在使用的网络接口都为以太网接口。 常见的以太网接口类型有RJ-45接口,RJ-11接口,SC光纤 ......
Jacktang 无线连接
【AN-732应用笔记】SOIC封装中的通用精密运算放大器评估板
简介 EVAL-PRAOPAMP-1R评估板支持采用SOIC封装的单通道运算放大器。其目的是以不同的应用电路和配置为用户提供多种选择和广泛的灵活性。 115355 115356...
EEWORLD社区 ADI 工业技术
关于TTI抽奖活动抽中奖品何时能收到问题?
请问我在TTI 这个抽奖活动 https://www.eeworld.com.cn/huodon ... hibitions_20160218/ 中2月26日抽中了一个三星32G存储卡,那么何时能收到这个奖品呢?到时奖品是按照我论坛中登记的会员地址 ......
fmj2006 为我们提建议&公告
华硕工程师谈主板供电电路设计
华硕工程师谈主板供电电路设计...
open82977352 单片机
LED晶圆技术发展趋势及LED晶圆制程
从LED工作原理可知,晶圆材料是LED的核心部分,事实上,LED的波长、亮度、正向电压等主要光电参数基本上取决于晶圆材料。晶圆技术与设备是晶圆制造技术的关键所在,金属有机物化学气相淀积(Meta ......
探路者 LED专区
Software-Defined Radio with LabVIEW FPGA
Software-Defined Radio with LabVIEW FPGA...
安_然 测试/测量

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1026  2178  662  557  65  21  44  14  12  2 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved