Single Buffer/Driver With Open-Drain Output 5-SC70 -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP5/6,.08 |
| 针数 | 5 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| SN74AUC1G07DCKRG4 | SN74AUC1G07DCKR | SN74AUC1G07YZPR | SN74AUC1G07DBVT | SN74AUC1G07DCKT | SN74AUC1G07DBVRG4 | SN74AUC1G07DBVRE4 | SN74AUC1G07DCKTG4 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Single Buffer/Driver With Open-Drain Output 5-SC70 -40 to 85 | Single Buffer/Driver With Open-Drain Output 5-SC70 -40 to 85 | Single Buffer/Driver With Open-Drain Output 5-DSBGA -40 to 85 | Single Buffer/Driver With Open-Drain Output 5-SOT-23 -40 to 85 | Single Buffer/Driver With Open-Drain Output 5-SC70 -40 to 85 | Single Buffer/Driver With Open-Drain Output 5-SOT-23 -40 to 85 | Single Buffer/Driver With Open-Drain Output 5-SOT-23 -40 to 85 | Single Buffer/Driver With Open-Drain Output 5-SC70 -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | SOIC | BGA | SOT-23 | SOIC | SOT-23 | SOT-23 | SOIC |
| 包装说明 | TSSOP, TSSOP5/6,.08 | TSSOP, TSSOP5/6,.08 | VFBGA, BGA5,2X3,20 | LSSOP, TSOP5/6,.11,37 | TSSOP, TSSOP5/6,.08 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | TSSOP, TSSOP5/6,.08 |
| 针数 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | - | EAR99 | EAR99 | - |
| Factory Lead Time | 6 weeks | 1 week | 1 week | 1 week | 1 week | 6 weeks | 6 weeks | - |
| 系列 | - | AUC | AUC | AUC | AUC | AUC | AUC | AUC |
| JESD-30 代码 | - | R-PDSO-G5 | R-PBGA-B5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 |
| JESD-609代码 | - | e4 | e1 | e4 | e4 | e4 | e4 | e4 |
| 长度 | - | 2 mm | 1.4 mm | 2.9 mm | 2 mm | 2.9 mm | 2.9 mm | 2 mm |
| 负载电容（CL） | - | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF |
| 逻辑集成电路类型 | - | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
| 最大I（ol） | - | 0.009 A | 0.009 A | 0.009 A | 0.009 A | 0.009 A | 0.009 A | 0.005 A |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | - | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | VFBGA | LSSOP | TSSOP | LSSOP | LSSOP | TSSOP |
| 封装等效代码 | - | TSSOP5/6,.08 | BGA5,2X3,20 | TSOP5/6,.11,37 | TSSOP5/6,.08 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSSOP5/6,.08 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | - | TR | TR | TR | TR | TR | TR | TR |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | - | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V |
| 最大电源电流（ICC） | - | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | - |
| Prop。Delay @ Nom-Su | - | 3.3 ns | 3.3 ns | 3.3 ns | 3.3 ns | 3.3 ns | 3.3 ns | 3.3 ns |
| 传播延迟（tpd） | - | 3.3 ns | 3.3 ns | 3.3 ns | 3.3 ns | 3.3 ns | 3.3 ns | 3.3 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | - | NO | NO | NO | NO | NO | NO | NO |
| 座面最大高度 | - | 1.1 mm | 0.5 mm | 1.45 mm | 1.1 mm | 1.45 mm | 1.45 mm | 1.1 mm |
| 最大供电电压 (Vsup) | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 最小供电电压 (Vsup) | - | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | - | YES | YES | YES | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | GULL WING | BALL | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 0.65 mm | 0.5 mm | 0.95 mm | 0.65 mm | 0.95 mm | 0.95 mm | 0.65 mm |
| 端子位置 | - | DUAL | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 1.25 mm | 0.9 mm | 1.6 mm | 1.25 mm | 1.6 mm | 1.6 mm | 1.25 mm |
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