Fixed/Floating Point Digital Signal Processor 361-NFBGA 0 to 90
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, |
| 针数 | 361 |
| Reach Compliance Code | compli |
| ECCN代码 | 3A991A2 |
| Factory Lead Time | 1 week |
| 其他特性 | IT ALSO OPERATES AT 1.1V, 1.2V NOMINAL SUPLY |
| 地址总线宽度 | 23 |
| 桶式移位器 | NO |
| 边界扫描 | YES |
| 最大时钟频率 | 30 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FLOATING POINT |
| 内部总线架构 | SINGLE |
| JESD-30 代码 | S-PBGA-B361 |
| JESD-609代码 | e1 |
| 长度 | 13 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| 端子数量 | 361 |
| 最高工作温度 | 90 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 座面最大高度 | 1.3 mm |
| 最大供电电压 | 1.05 V |
| 最小供电电压 | 0.95 V |
| 标称供电电压 | 1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 13 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| TMS320C6742EZCE2 | TMS320C6742EZWT2 | TMS320C6742EZWTA2 | TMS320C6742BZCE2 | TMS320C6742BZWT2 | TMS320C6742BZWTA2 | |
|---|---|---|---|---|---|---|
| 描述 | Fixed/Floating Point Digital Signal Processor 361-NFBGA 0 to 90 | Fixed/Floating Point Digital Signal Processor 361-NFBGA 0 to 90 | Fixed/Floating Point Digital Signal Processor 361-NFBGA -40 to 105 | Fixed/Floating Point Digital Signal Processor 361-NFBGA 0 to 90 | Fixed/Floating Point Digital Signal Processor 361-NFBGA 0 to 90 | Digital Signal Processors & Controllers - DSP, DSC Fixed/Floating Point DSP |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | LFBGA, | LFBGA, | LFBGA, | LFBGA, BGA361,19X19,25 | LFBGA, BGA361,19X19,32 | LFBGA, BGA361,19X19,32 |
| 针数 | 361 | 361 | 361 | 361 | 361 | 361 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| ECCN代码 | 3A991A2 | 3A991A2 | 3A991A2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| 地址总线宽度 | 23 | 23 | 23 | 23 | 23 | 23 |
| 桶式移位器 | NO | NO | NO | NO | NO | NO |
| 边界扫描 | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 30 MHz | 30 MHz | 30 MHz | 30 MHz | 30 MHz | 30 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| 内部总线架构 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| JESD-30 代码 | S-PBGA-B361 | S-PBGA-B361 | S-PBGA-B361 | S-PBGA-B361 | S-PBGA-B361 | S-PBGA-B361 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 |
| 长度 | 13 mm | 16 mm | 16 mm | 13 mm | 16 mm | 16 mm |
| 低功率模式 | YES | YES | YES | YES | YES | YES |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 361 | 361 | 361 | 361 | 361 | 361 |
| 最高工作温度 | 90 °C | 90 °C | 105 °C | 90 °C | 90 °C | 105 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 座面最大高度 | 1.3 mm | 1.4 mm | 1.4 mm | 1.3 mm | 1.4 mm | 1.4 mm |
| 最大供电电压 | 1.05 V | 1.05 V | 1.05 V | 1.32 V | 1.32 V | 1.32 V |
| 最小供电电压 | 0.95 V | 0.95 V | 0.95 V | 1.14 V | 1.14 V | 1.14 V |
| 标称供电电压 | 1 V | 1 V | 1 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | INDUSTRIAL | OTHER | OTHER | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.65 mm | 0.8 mm | 0.8 mm | 0.65 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 13 mm | 16 mm | 16 mm | 13 mm | 16 mm | 16 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) |
| Factory Lead Time | 1 week | 6 weeks | 6 weeks | 1 week | 1 week | - |
| RAM（字数） | - | 131072 | 131072 | 8192 | 8192 | 8192 |
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