REVISIONS
LTR
A
DESCRIPTION
Added device class Q parts and case outline X to drawing. Corrected
DATE (YR-MO-DA)
APPROVED
00-04-20
Raymond Monnin
E1 terminal symbol to
E.
Corrected table 1 footnotes. Corrections to
paragraph 1.5 and figure 4. Added 10 second data retention table to
figure 5. - glg
B
Corrections to case outline X dimensions and data retention
characteristics tables. - glg
Corrections to paragraph 1.5 and addition of footnote. - glg
Corrections to sheet 16, 1 second data retention test table. - glg
Corrected CAGE code typo, 67264 changed to 67268. Updated
boilerplate. ksr
Added 02 device for -40
°
C to +125
°
C temp range. Updated
boilerplate. ksr
Boilerplate update and part of five year review. tcr
00-05-30
Raymond Monnin
C
D
E
00-07-26
00-08-30
02-03-18
Raymond Monnin
Raymond Monnin
Raymond Monnin
F
02-05-28
Raymond Monnin
G
07-12-05
Robert M. Heber
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
G
15
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16
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REV
G
19
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21
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1
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22
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2
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27
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SHEET
PREPARED BY
Gary L. Gross
CHECKED BY
Jeff Bowling
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
Raymond Monnin
DRAWING APPROVAL DATE
99-09-28
REVISION LEVEL
G
MICROCIRCUIT, MEMORY, DIGITAL, CMOS,
512K x 8-BIT, RADIATION-HARDENED SRAM,
MONOLITHIC SILICON
SIZE
A
CAGE
CODE
67268
1 OF
27
5962-99606
5962-E097-08
SHEET
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing documents three product assurance class levels consisting of high reliability (device classes Q and
M), space application (device class V), and for appropriate satellite and similar applications (device class T). A choice of case
outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of
Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class T, the user is encouraged to review the
manufacturers Quality Management (QM) plan as part of their evaluation of these parts and their acceptability in the intended
application.
1.2 PIN. The PIN shall be as shown in the following example:
5962
D
99606
01
T
X
C
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
1.2.1 RHA designator. Device classes Q, T and V RHA marked devices shall meet the MIL-PRF-38535 specified RHA levels
and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535 appendix
A specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types shall identify the circuit function as follows:
Device type
01
02
Generic number 1/
7Q512
7Q512
Circuit function
512K X 8-bit Radiation-hardened SRAM (MIL-TEMP)
512K X 8-bit Radiation-hardened SRAM (EXTENDED-TEMP)
Access time
100 ns
100 ns
1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Certification and qualification to MIL-PRF-38535 with performance as specified
in the device manufacturers approved quality management plan
Q, V
T
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
U
X
Descriptive designator
CDFP1-F32
See figure 1
Terminals
32
36
Package style
Flat pack
Flat pack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38535 for classes Q, T and V or MIL-PRF-38535,
appendix A for device class M.
__________________
1/ Generic numbers are also listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document
and will also be listed in QML-38535 and MIL-HDBK-103.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
G
5962-99606
SHEET
2
1.3 Absolute maximum ratings. 2/ 3/
Supply voltage range, (V
DD
) .................................................................................
Voltage range on any input pin ............................................................................
Voltage range on any output pin ..........................................................................
Input current, dc ...................................................................................................
Power dissipation.................................................................................................
Operating free-air temperature range, (T
A
) ..........................................................
Storage temperature range, (T
STG
) ......................................................................
Junction temperature, (T
J
) ...................................................................................
Thermal resistance, junction-to-case, (
Θ
JC
): Case U ...........................................
1.4 Recommended operating conditions.
Supply voltage range, (V
DD
) .................................................................................
Supply voltage, (V
SS
) ...........................................................................................
Input voltage, dc...................................................................................................
Operating free-air temperature, (T
A
) ....................................................................
Operating free-air temperature, (T
A
) ....................................................................
1.5 Radiation features
Maximum total dose available (dose rate = 3 rads(Si)/s)..................................... > 10 x 10
3
rads(Si) 4/
Single event phenomenon (SEP) effective
linear energy threshold (LET) with no upsets .................................................... > 1MeV-cm
2
/mg 4/
with no latch-up ................................................................................................. > 80 MeV-cm
2
/mg 4/
1.6 Digital logic testing for device classes T, Q, and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, method 5012) .............................................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract..
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.
+4.5 V dc to +5.5 V dc
0 V dc
0 V dc to V
DD
-55°C to +125°C
(Device 01)
-40°C to +125°C
(Device 02)
-0.5 V dc to +7.0 V dc
-0.5 V dc to +7.0 V dc
-0.5 V dc to +7.0 V dc
+ 10 mA
1.0 W
-55°C to +125°C
-65°C to +150°C
+150°C
+10°C/W
100 percent
________________
2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
3/ All voltage values in this drawing are with respect to V
SS
.
4/ Contact the device manufacturer for detailed lot information.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
G
5962-99606
SHEET
3
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q, T and V shall be in accordance with
MIL-PRF-38535, and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not effect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q, T and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 and figure 1 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Output load circuit. The output load circuit shall be as specified on figure 4.
3.2.5 Timing waveforms. The timing waveforms shall be as specified on figure 5.
3.2.6 Radiation test circuit. The radiation test circuit shall be as specified on figure 6.
3.2.7 Functional tests. Various functional tests used to test this device are contained in the appendix. If the test patterns
cannot be implemented due to test equipment limitations, alternate test patterns to accomplish the same results shall be allowed.
For device class M, alternate test patterns shall be maintained under document revision level control by the manufacturer and
shall be made available to the preparing or aquiring activity upon request. For device classes Q, T and V, alternate test patterns
shall be under the control of the device manufacturer’s Technology Review Board (TRB) in accordance with MIL-PRF-38535 and
shall be made available to the preparing or aquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q, T, and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall
be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q, T and V shall be a "QML" or "Q" as required
in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
G
5962-99606
SHEET
4
3.6 Certificate of compliance. For device classes Q, T and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q, T and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q, T and V in MIL-PRF-38535 or
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 41 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein.
For device class T, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 and the device
manufacturer's QM plan, including screening, qualification, and conformance inspection. The performance envelope and
reliability information shall be as specified in the manufacturers QM plan.
For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
For device class T, screening shall be in accordance with the device manufacturer's QM plan, and shall be conducted on all
devices prior to qualification and technology conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in)
electrical parameters of method 5004 and substitute lines 1 through 6 of table IIA herein.
The test circuit shall be maintained by the manufacturer under document revision level control and shall be made
available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases,
and power dissipation, as applicable, in accordance with the intent specified in method 1015.
(1) Dynamic burn-in (method 1015 of MIL-STD-883, test condition D; for circuit, see 4.2.1b herein).
c.
Interim and final electrical parameters shall be as specified in table IIA herein.
b.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
G
5962-99606
SHEET
5
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