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S29JL032J70BHI310

产品描述Flash, 2MX16, 70ns, PBGA48, 8.15 X 6.15 MM, HALOGEN AND LEAD FREE, FBGA-48
产品类别存储    存储   
文件大小2MB,共63页
制造商SPANSION
官网地址http://www.spansion.com/
标准
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S29JL032J70BHI310概述

Flash, 2MX16, 70ns, PBGA48, 8.15 X 6.15 MM, HALOGEN AND LEAD FREE, FBGA-48

S29JL032J70BHI310规格参数

参数名称属性值
是否Rohs认证符合
厂商名称SPANSION
零件包装代码BGA
包装说明8.15 X 6.15 MM, HALOGEN AND LEAD FREE, FBGA-48
针数48
Reach Compliance Codeunknown
ECCN代码3A991.B.1.A
最长访问时间70 ns
其他特性TOP BOOT BLOCK
备用内存宽度8
启动块TOP
命令用户界面YES
通用闪存接口YES
数据轮询YES
JESD-30 代码R-PBGA-B48
JESD-609代码e1
长度8.15 mm
内存密度33554432 bit
内存集成电路类型FLASH
内存宽度16
湿度敏感等级3
功能数量1
部门数/规模8,63
端子数量48
字数2097152 words
字数代码2000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织2MX16
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装等效代码BGA48,6X8,32
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行PARALLEL
电源3/3.3 V
编程电压3 V
认证状态Not Qualified
就绪/忙碌YES
座面最大高度1 mm
部门规模8K,64K
最大待机电流0.000005 A
最大压摆率0.045 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
切换位YES
类型NOR TYPE
宽度6.15 mm

S29JL032J70BHI310相似产品对比

S29JL032J70BHI310 S29JL032J60BHI313 S29JL032J60TFI310 S29JL032J60TFI213 S29JL032J70BHI313 S29JL032J70TFI313 S29JL032J60BHI310 S29JL032J60TFI210 S29JL032J60TFI313
描述 Flash, 2MX16, 70ns, PBGA48, 8.15 X 6.15 MM, HALOGEN AND LEAD FREE, FBGA-48 Flash, 2MX16, 60ns, PBGA48, 8.15 X 6.15 MM, HALOGEN AND LEAD FREE, FBGA-48 Flash, 2MX16, 60ns, PDSO48, LEAD FREE, MO-142(D)DD, TSOP-48 Flash, 2MX16, 60ns, PDSO48, LEAD FREE, MO-142(D)DD, TSOP-48 Flash, 2MX16, 70ns, PBGA48, 8.15 X 6.15 MM, HALOGEN AND LEAD FREE, FBGA-48 Flash, 2MX16, 70ns, PDSO48, LEAD FREE, MO-142(D)DD, TSOP-48 Flash, 2MX16, 60ns, PBGA48, 8.15 X 6.15 MM, HALOGEN AND LEAD FREE, FBGA-48 Flash, 2MX16, 60ns, PDSO48, LEAD FREE, MO-142(D)DD, TSOP-48 Flash, 2MX16, 60ns, PDSO48, LEAD FREE, MO-142(D)DD, TSOP-48
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合
零件包装代码 BGA BGA TSOP1 TSOP1 BGA TSOP1 BGA TSOP1 TSOP1
包装说明 8.15 X 6.15 MM, HALOGEN AND LEAD FREE, FBGA-48 8.15 X 6.15 MM, HALOGEN AND LEAD FREE, FBGA-48 LEAD FREE, MO-142(D)DD, TSOP-48 LEAD FREE, MO-142(D)DD, TSOP-48 8.15 X 6.15 MM, HALOGEN AND LEAD FREE, FBGA-48 LEAD FREE, MO-142(D)DD, TSOP-48 8.15 X 6.15 MM, HALOGEN AND LEAD FREE, FBGA-48 LEAD FREE, MO-142(D)DD, TSOP-48 LEAD FREE, MO-142(D)DD, TSOP-48
针数 48 48 48 48 48 48 48 48 48
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
最长访问时间 70 ns 60 ns 60 ns 60 ns 70 ns 70 ns 60 ns 60 ns 60 ns
其他特性 TOP BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK
备用内存宽度 8 8 8 8 8 8 8 8 8
启动块 TOP TOP TOP TOP TOP TOP TOP TOP TOP
命令用户界面 YES YES YES YES YES YES YES YES YES
通用闪存接口 YES YES YES YES YES YES YES YES YES
数据轮询 YES YES YES YES YES YES YES YES YES
JESD-30 代码 R-PBGA-B48 R-PBGA-B48 R-PDSO-G48 R-PDSO-G48 R-PBGA-B48 R-PDSO-G48 R-PBGA-B48 R-PDSO-G48 R-PDSO-G48
JESD-609代码 e1 e1 e3 e3 e1 e3 e1 e3 e3
长度 8.15 mm 8.15 mm 18.4 mm 18.4 mm 8.15 mm 18.4 mm 8.15 mm 18.4 mm 18.4 mm
内存密度 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
内存宽度 16 16 16 16 16 16 16 16 16
湿度敏感等级 3 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1 1
部门数/规模 8,63 8,63 8,63 8,63 8,63 8,63 8,63 8,63 8,63
端子数量 48 48 48 48 48 48 48 48 48
字数 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
字数代码 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA VFBGA TSSOP TSSOP VFBGA TSSOP VFBGA TSSOP TSSOP
封装等效代码 BGA48,6X8,32 BGA48,6X8,32 TSSOP48,.8,20 TSSOP48,.8,20 BGA48,6X8,32 TSSOP48,.8,20 BGA48,6X8,32 TSSOP48,.8,20 TSSOP48,.8,20
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
电源 3/3.3 V 3.3 V 3.3 V 3.3 V 3/3.3 V 3/3.3 V 3.3 V 3.3 V 3.3 V
编程电压 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
就绪/忙碌 YES YES YES YES YES YES YES YES YES
座面最大高度 1 mm 1 mm 1.2 mm 1.2 mm 1 mm 1.2 mm 1 mm 1.2 mm 1.2 mm
部门规模 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K
最大待机电流 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A
最大压摆率 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) Matte Tin (Sn) Matte Tin (Sn) Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) Matte Tin (Sn) Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) Matte Tin (Sn) Matte Tin (Sn)
端子形式 BALL BALL GULL WING GULL WING BALL GULL WING BALL GULL WING GULL WING
端子节距 0.8 mm 0.8 mm 0.5 mm 0.5 mm 0.8 mm 0.5 mm 0.8 mm 0.5 mm 0.5 mm
端子位置 BOTTOM BOTTOM DUAL DUAL BOTTOM DUAL BOTTOM DUAL DUAL
切换位 YES YES YES YES YES YES YES YES YES
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 6.15 mm 6.15 mm 12 mm 12 mm 6.15 mm 12 mm 6.15 mm 12 mm 12 mm
厂商名称 SPANSION - SPANSION SPANSION SPANSION SPANSION SPANSION SPANSION SPANSION

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