Fast Page DRAM Module, 16MX9, 60ns, CMOS, SIMM-30
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Mitsubishi(日本三菱) |
| 零件包装代码 | SIMM |
| 包装说明 | , SIP30 |
| 针数 | 30 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE |
| 最长访问时间 | 60 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-XSMA-T30 |
| JESD-609代码 | e0 |
| 内存密度 | 150994944 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 30 |
| 字数 | 16777216 words |
| 字数代码 | 16000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16MX9 |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装等效代码 | SIP30 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 4096 |
| 座面最大高度 | 22.606 mm |
| 最大待机电流 | 0.009 A |
| 最大压摆率 | 0.81 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | SINGLE |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| MH16M09ATJA-6 | MH16M09ACJ-6 | MH16M09ACJ-7 | MH16M09ATJ-7 | MH16M09AJ-6 | MH16M09ATJ-6 | MH16M09AJ-7 | MH16M09ATJA-7 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM Module, 16MX9, 60ns, CMOS, SIMM-30 | Fast Page DRAM Module, 16MX9, 60ns, CMOS, SIMM-30 | Fast Page DRAM Module, 16MX9, 70ns, CMOS, SIMM-30 | Fast Page DRAM Module, 16MX9, 70ns, CMOS, SIMM-30 | Fast Page DRAM Module, 16MX9, 60ns, CMOS, SIMM-30 | Fast Page DRAM Module, 16MX9, 60ns, CMOS, SIMM-30 | Fast Page DRAM Module, 16MX9, 70ns, CMOS, SIMM-30 | Fast Page DRAM Module, 16MX9, 70ns, CMOS, SIMM-30 |
| 零件包装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
| 包装说明 | , SIP30 | SIMM, SIM30 | SIMM, SIM30 | SIMM, SIM30 | SIMM, SIM30 | SIMM, SIM30 | SIMM, SIM30 | , SIP30 |
| 针数 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 60 ns | 60 ns | 70 ns | 70 ns | 60 ns | 60 ns | 70 ns | 70 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XSMA-T30 | R-XSMA-N30 | R-XSMA-N30 | R-XSMA-N30 | R-XSMA-N30 | R-XSMA-N30 | R-XSMA-N30 | R-XSMA-T30 |
| 内存密度 | 150994944 bit | 150994944 bit | 150994944 bit | 150994944 bit | 150994944 bit | 150994944 bit | 150994944 bit | 150994944 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
| 字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 16MX9 | 16MX9 | 16MX9 | 16MX9 | 16MX9 | 16MX9 | 16MX9 | 16MX9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装等效代码 | SIP30 | SIM30 | SIM30 | SIM30 | SIM30 | SIM30 | SIM30 | SIP30 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
| 座面最大高度 | 22.606 mm | 35.56 mm | 35.56 mm | 22.86 mm | 22.86 mm | 22.86 mm | 22.86 mm | 22.606 mm |
| 最大待机电流 | 0.009 A | 0.009 A | 0.009 A | 0.009 A | 0.009 A | 0.009 A | 0.009 A | 0.009 A |
| 最大压摆率 | 0.81 mA | 0.81 mA | 0.675 mA | 0.675 mA | 0.81 mA | 0.81 mA | 0.675 mA | 0.675 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 厂商名称 | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | - | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) |
| 封装代码 | - | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | - |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
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