Microcontroller, 8-Bit, Z8 CPU, 16MHz, CMOS, PQCC68,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | IXYS |
Reach Compliance Code | unknown |
具有ADC | NO |
地址总线宽度 | 16 |
位大小 | 8 |
CPU系列 | Z8 |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | 8 |
JESD-30 代码 | S-PQCC-J68 |
长度 | 24.23 mm |
I/O 线路数量 | 52 |
端子数量 | 68 |
最高工作温度 | 70 °C |
最低工作温度 | |
PWM 通道 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC68,1.0SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 3.3/5 V |
认证状态 | Not Qualified |
RAM(字节) | 236 |
ROM(单词) | 0 |
速度 | 16 MHz |
最大压摆率 | 35 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 3 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 24.23 mm |
Z86C9616VSC | Z86C6120VEC | Z86C6220PEC | Z86C6220VEC | Z86C9620PEC | Z86C9620VEC | Z86C6120PEC | Z86C9616PSC | Z86C9616PEC | Z86C6120PSC | |
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描述 | Microcontroller, 8-Bit, Z8 CPU, 16MHz, CMOS, PQCC68, | Microcontroller, 8-Bit, MROM, Z8 CPU, 20MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, MROM, Z8 CPU, 20MHz, CMOS, PDIP64, | Microcontroller, 8-Bit, MROM, Z8 CPU, 20MHz, CMOS, PQCC68, | Microcontroller, 8-Bit, Z8 CPU, 20MHz, CMOS, PDIP64, | Microcontroller, 8-Bit, Z8 CPU, 20MHz, CMOS, PQCC68, | Microcontroller, 8-Bit, MROM, Z8 CPU, 20MHz, CMOS, PDIP40, | Microcontroller, 8-Bit, Z8 CPU, 16MHz, CMOS, PDIP64, | Microcontroller, 8-Bit, Z8 CPU, 16MHz, CMOS, PDIP64, | Microcontroller, 8-Bit, MROM, Z8 CPU, 20MHz, CMOS, PDIP40, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
CPU系列 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 |
JESD-30 代码 | S-PQCC-J68 | S-PQCC-J44 | R-PDIP-T64 | S-PQCC-J68 | R-PDIP-T64 | S-PQCC-J68 | R-PDIP-T40 | R-PDIP-T64 | R-PDIP-T64 | R-PDIP-T40 |
端子数量 | 68 | 44 | 64 | 68 | 64 | 68 | 40 | 64 | 64 | 40 |
最高工作温度 | 70 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 70 °C | 105 °C | 70 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | SDIP | QCCJ | SDIP | QCCJ | DIP | SDIP | SDIP | DIP |
封装等效代码 | LDCC68,1.0SQ | LDCC44,.7SQ | SDIP64,.75 | LDCC68,1.0SQ | SDIP64,.75 | LDCC68,1.0SQ | DIP40,.6 | SDIP64,.75 | SDIP64,.75 | DIP40,.6 |
封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE, SHRINK PITCH | CHIP CARRIER | IN-LINE, SHRINK PITCH | CHIP CARRIER | IN-LINE | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE |
电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 236 | 236 | 236 | 236 | 236 | 236 | 236 | 236 | 236 | 236 |
速度 | 16 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 16 MHz | 16 MHz | 20 MHz |
最大压摆率 | 35 mA | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA | 35 mA | 35 mA | 40 mA |
表面贴装 | YES | YES | NO | YES | NO | YES | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 1.78 mm | 1.27 mm | 1.78 mm | 1.27 mm | 2.54 mm | 1.78 mm | 1.78 mm | 2.54 mm |
端子位置 | QUAD | QUAD | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
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