1MX1 FAST PAGE DRAM, 60ns, PDSO20, PLASTIC, REVERSE, FP-24/20
| 参数名称 | 属性值 |
| 厂商名称 | FUJITSU(富士通) |
| 零件包装代码 | SOIC |
| 包装说明 | TSOP1-R, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE |
| 最长访问时间 | 60 ns |
| 其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| JESD-30 代码 | R-PDSO-G20 |
| 长度 | 14.4 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | FAST PAGE DRAM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 20 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX1 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1-R |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 认证状态 | Not Qualified |
| 刷新周期 | 512 |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 6 mm |
| MB81C1000A-60PFTR | MB81C1000A-80C | MB81C1000A-60C | MB81C1000A-10C | MB81C1000A-60PFTN | MB81C1000A-70C | |
|---|---|---|---|---|---|---|
| 描述 | 1MX1 FAST PAGE DRAM, 60ns, PDSO20, PLASTIC, REVERSE, FP-24/20 | Fast Page DRAM, 1MX1, 80ns, CMOS, CDIP18 | Fast Page DRAM, 1MX1, 60ns, CMOS, CDIP18 | Fast Page DRAM, 1MX1, 100ns, CMOS, CDIP18 | 1MX1 FAST PAGE DRAM, 60ns, PDSO20, PLASTIC, FP-24/20 | Fast Page DRAM, 1MX1, 70ns, CMOS, CDIP18 |
| 零件包装代码 | SOIC | DIP | DIP | DIP | SOIC | DIP |
| 包装说明 | TSOP1-R, | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | TSOP1, | DIP, DIP18,.3 |
| 针数 | 20 | 18 | 18 | 18 | 20 | 18 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 60 ns | 80 ns | 60 ns | 100 ns | 60 ns | 70 ns |
| JESD-30 代码 | R-PDSO-G20 | R-XDIP-T18 | R-XDIP-T18 | R-XDIP-T18 | R-PDSO-G20 | R-XDIP-T18 |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 18 | 18 | 18 | 20 | 18 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | TSOP1-R | DIP | DIP | DIP | TSOP1 | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.5 mm | 2.54 mm | 2.54 mm | 2.54 mm | 0.5 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | - | 不符合 |
| I/O 类型 | - | SEPARATE | SEPARATE | SEPARATE | - | SEPARATE |
| JESD-609代码 | - | e0 | e0 | e0 | - | e0 |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| 封装等效代码 | - | DIP18,.3 | DIP18,.3 | DIP18,.3 | - | DIP18,.3 |
| 电源 | - | 5 V | 5 V | 5 V | - | 5 V |
| 最大待机电流 | - | 0.001 A | 0.001 A | 0.001 A | - | 0.001 A |
| 最大压摆率 | - | 0.062 mA | 0.074 mA | 0.054 mA | - | 0.068 mA |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
淘e淘
FPGA/CPLD
模拟电子
模拟与混合信号
DSP 与 ARM 处理器
PCB设计
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