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2-382466-1

产品描述SOCKET, DIP24, IC SOCKET
产品类别连接器    插座   
文件大小105KB,共1页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
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2-382466-1概述

SOCKET, DIP24, IC SOCKET

2-382466-1规格参数

参数名称属性值
Reach Compliance Codeunknow
ECCN代码EAR99
联系完成配合TIN
联系完成终止TIN
设备插槽类型IC SOCKET
使用的设备类型DIP24
外壳材料GLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE
JESD-609代码e3
制造商序列号382466
触点数24
Base Number Matches1

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2-382466-1
T E I nternal N umber: 2 - 3 8 2 4 6 6 - 1
Product Highlights:
l
DIP Socket
l
Number of Positions = 24
l
Row-to-Row Spacing = 15.49 mm
l
Through Hole C ontact Termination Type
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Mount Style = Vertical
View all Features
Obsolete
C ontact Product Information C enter
A dd to M y P art L is t
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
I C SOC KETS
(PDF, English)
Product Specifications:
l
None Available
Application Specifications:
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Surface-Mount DIPLOMATE Dual Leaf (DL) In-Line Pakca...
(PDF, English)
Instruction Sheets:
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None Available
CAD Files:
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None Available
List all Documents
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Product Type
= DIP Socket
l
Number of Positions
= 24
l
Profile = Standard
l
Frame Style
= Ladder
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Leg Style
= Straight
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Proprietary Name = DIPLOMATE DL
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C olor = Brown
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Qty./Tube = 17
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Qty. Tubes/Box = 100
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Product Series = Standard
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C omment = Through-hole sockets are compatible with surface
mount soldering practices.
Electrical Characteristics:
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Insulation Resistance (M?) = 10,000
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C ontact Resistance (m?) = 30
Termination Related Features:
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Termination Post Length (mm [in])
= 3.25 [0.128]
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Solder Tail C ontact Plating = Tin
Body Related Features:
l
Row-to-Row Spacing (mm [in])
= 15.49 [0.610]
l
Mount Style
= Vertical
l
C enterline (mm [in])
= 2.54 [0.100]
Contact Related Features:
l
C ontact Termination Type
= Through Hole
l
C ontact Base Material
= Beryllium C opper
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C ontact Mating Area Plating Material
= Tin
l
C ontact Style
= Stamped + Formed
l
Mating C ontact Type
= Dual Leaf
Housing Related Features:
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Housing Material = PC T, Glass Filled
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Housing Flammability Rating = UL 94V-0
Configuration Related Features:
l
Height Above PC Board (mm [in])
= 5.33 [0.210]
Industry Standards:
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RoHS/ELV C ompliance
= Not reviewed for ELV/RoHS compliance
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Lead Free Solder Processes
= Not reviewed for lead free solder
process
Conditions for Usage:
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Temperature Range (?C ) = 105
Operation/Application:
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Application = Production
Packaging Related Features:
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Packaging Method
= Tube
Other:
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Brand = AMP
Additional Information:
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Product Line Information
Related Products:
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Tooling
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2009 Tyco Electronics C orporation All Rights Reserved
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