Bus Driver, 1-Func, 4-Bit, Inverted Output, TTL, CQCC28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 包装说明 | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | unknown |
| 控制类型 | ENABLE LOW |
| JESD-30 代码 | S-XQCC-J28 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC28,.5SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| AM2961JC | 5962-01-205-4693 | AM2961DCTB | AM2961DCT | AM2962DE | AM2962FMB | AM2961FMB | 5962-01-202-2414 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver, 1-Func, 4-Bit, Inverted Output, TTL, CQCC28 | Bus Driver, 1-Func, 4-Bit, True Output, TTL, CDIP24 | Bus Driver, 1-Func, 4-Bit, Inverted Output, TTL, CDIP24 | Bus Driver, 1-Func, 4-Bit, Inverted Output, TTL, CDIP24 | Bus Driver, 1-Func, 4-Bit, True Output, TTL, CDIP24 | Bus Driver, 1-Func, 4-Bit, True Output, TTL, CDFP24 | Bus Driver, 1-Func, 4-Bit, Inverted Output, TTL, CDFP24 | Bus Driver, 1-Func, 4-Bit, Inverted Output, TTL, CDIP24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DFP, FL24,.4 | DFP, FL24,.4 | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | compli | compliant | compliant | unknown | unknown | unknown | compli |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 代码 | S-XQCC-J28 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDFP-F24 | R-XDFP-F24 | R-XDIP-T24 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | - | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | TRUE | INVERTED | INVERTED | TRUE | TRUE | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | QCCJ | DIP | DIP | DIP | DIP | DFP | DFP | DIP |
| 封装等效代码 | LDCC28,.5SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | FL24,.4 | FL24,.4 | DIP24,.3 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| 表面贴装 | YES | NO | NO | NO | NO | YES | YES | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | - |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - |
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