电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

BU-65170V1-440W

产品描述Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CDFP70, 48.30 X 25.40 MM, 3.81 MM HEIGHT, FP-70
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小563KB,共44页
制造商Data Device Corporation
下载文档 详细参数 全文预览

BU-65170V1-440W概述

Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CDFP70, 48.30 X 25.40 MM, 3.81 MM HEIGHT, FP-70

BU-65170V1-440W规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Data Device Corporation
零件包装代码DFP
包装说明DFP,
针数70
Reach Compliance Codecompliant
地址总线宽度16
边界扫描NO
最大时钟频率16 MHz
通信协议MIL STD 1553A; MIL STD 1553B
数据编码/解码方法BIPH-LEVEL(MANCHESTER)
最大数据传输速率0.125 MBps
外部数据总线宽度16
JESD-30 代码R-CDFP-F70
JESD-609代码e0
低功率模式NO
串行 I/O 数2
端子数量70
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DFP
封装形状RECTANGULAR
封装形式FLATPACK
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
筛选级别MIL-PRF-38534
座面最大高度3.81 mm
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式FLAT
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
uPs/uCs/外围集成电路类型SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553

文档预览

下载PDF文档
BU-65170/61580 and BU-61585
MIL-STD-1553A/B NOTICE 2 RT and BC/RT/MT,
ADVANCED COMMUNICATION ENGINE (ACE)
ACE User’s Guide
Also Available
DESCRIPTION
DDC's BU-65170, BU-61580 and
BU-61585 Bus Controller / Remote
Terminal
/
Monitor
Terminal
(BC/RT/MT)
A d v a n c e d
Communication Engine (ACE) termi-
nals comprise a complete integrated
interface between a host processor
and a MIL-STD-1553 A and B or
STANAG 3838 bus.
The ACE series is packaged in a 1.9 -
square-inch, 70-pin, low-profile,
cofired MultiChip Module (MCM)
ceramic package that is well suited for
applications with stringent height
requirements.
The BU-61585 ACE integrates dual
transceiver, protocol, memory man-
agement, processor interface logic,
and a total of 12K words of RAM in a
choice of DIP or flat pack packages.
The BU-61585 requires +5 V power
and either -15 V or -12 V power.
The BU-61585 internal RAM can be
configured as 12K x 16 or 8K x 17.
The 8K x 17 RAM feature provides
capability for memory integrity check-
ing by implementing RAM parity gen-
eration and verification on all access-
es. To minimize board space and
“glue” logic, the ACE provides ultimate
flexibility in interfacing to a host
processor and internal/external RAM.
The advanced functional architecture
of the ACE terminals provides soft-
ware
compatibility
to
DDC's
Advanced Integrated Multiplexer (AIM)
series hybrids, while incorporating a
multiplicity of architectural enhance-
ments. It allows flexible operation
while off-loading the host processor,
ensuring data sample consistency,
and supports bulk data transfers.
The ACE hybrids may be operated at
either 12 or 16 MHz. Wire bond
options allow for programmable RT
address (hardwired is standard) and
external transmitter inhibit inputs.
FEATURES
Fully Integrated MIL-STD-1553
Interface Terminal
Interface
Flexible Processor/Memory
Standard 4K x 16 RAM and
Optional RAM Parity
Optional 12K x 16 or 8K x 17 RAM
Available
Generation/Checking
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Flexible RT Data Buffering
Programmable Illegalization
Selective Message Monitor
Simultaneous RT/Monitor Mode
TX/RX_A
SHARED
RAM
CH. A
TRANSCEIVER
A
DATA
BUFFERS
PROCESSOR
DATA BUS
*
TX/RX_A
DATA BUS
DUAL
ENCODER/DECODER,
MULTIPROTOCOL
AND
MEMORY
MANAGEMENT
D15-D0
TX/RX_B
ADDRESS BUS
ADDRESS
BUFFERS
A15-A0
PROCESSOR
ADDRESS BUS
CH. B
TRANSCEIVER
B
TX/RX_B
PROCESSOR
AND
MEMORY
INTERFACE
LOGIC
TRANSPARENT/BUFFERED, STRBD, SELECT,
RD/WR, MEM/REG, TRIGGER_SEL/MEMENA-IN,
MSB/LSB/DTGRT
IOEN, MEMENA-OUT, READYD
ADDR_LAT/MEMOE, ZERO_WAIT/MEMWR,
8/16-BIT/DTREQ, POLARITY_SEL/DTACK
INT
PROCESSOR
AND
MEMORY
CONTROL
INTERRUPT
REQUEST
RT ADDRESS
RTAD4-RTAD0, RTADP
INCMD
MISCELLANEOUS
CLK_IN, TAG_CLK,
MSTCLR,SSFLAG/EXT_TRG
* SEE ORDERING INFORMATION FOR AVAILABLE MEMORY
FIGURE 1. ACE BLOCK DIAGRAM
©
1992, 1999 Data Device Corporation
路过的好心的哥哥姐姐近来看看吧
Linking... global.obj : error LNK2019: unresolved external symbol _SHCreateMenuBar referenced in function "struct HMENU__ * __cdecl GetMenu(struct HWND__ *)" (?GetMenu@@YAPAUHMENU ......
lwb_168 嵌入式系统
对三级管云里雾里的
NPN型三极管,到底怎么通过基极的信号控制集电极的电流的呢?...
fall8950 嵌入式系统
共晶材料的选择及焊接温度的控制 高亮度LED封装工艺及方案
芯片设计 从芯片的演变历程中发现,各大LED生产商在上游磊晶技术上不断改进,如利用不同的电极设计控制电流密度,利用ITO薄膜技术令通过LED的电流能平均分布等,使在结构上都尽可能产生最多的 ......
探路者 LED专区
tl16c554问题求助
问题: TL16C554A现在通讯,在前面两三小时,通讯是正常的。但是过后TL16C554A数据通讯不正常,通过串口检测工具发现发送数据不对,我手动给不正常通道发数据,接受的数据也不正常。TL16C554A ......
longzhaocy TI技术论坛
STM32单片机开发中的RTOS
很多STM32单片机初学者都是从裸机开始的,裸机确实也能开发出好的产品。但是,作为一个嵌入式软件工程师,况且用的并不是51那种低端单片机,如果只会用裸机开发产品,那肯定是不够的。 要从 ......
可乐zzZ stm32/stm8
BQ25895的几个问题解决分享
bq25895 是一款适用于单节锂离子电池和锂聚合物电池的高度集成型 5A 开关模式电池充电管理和系统电源路径管理器件,具有充电和系统设置的 I2C 串行接口。但在使用过程中,在电池充电管理设计 ......
qwqwqw2088 模拟与混合信号

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1321  2532  354  2206  1888  49  51  46  7  29 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved