NOTE: PT5020 ISRs are not Short-Circuit Protected.
Specifications
Characteristics
Output Current
(Unless otherwise stated, T
a
=25°C, V
in
=5V, I
o
=I
o
max, C
2
=100µF)
PT5020 SERIES
Symbol
I
o
Conditions
Over V
in
range
V
o
= –1.7V to –6.5V
V
o
= –9V
V
o
= –12V
V
o
= –15V
Min
0.25
(1)
0.10
(1)
0.10
(1)
0.10
(1)
4.75
—
—
—
—
—
—
—
—
On start up
Over I
o
range
—
Free Air Convection
(40-60LFM)
Per Mil-STD-883D, Method 2002.3
1 msec, Half Sine, mounted to a fixture
Suffixes N, A, & C
Suffixes L & M
Suffixes N, A, & C
Suffixes L & M
V
o
=1.7 to 8V
V
o
≥8
V
—
—
0.8
500
-20
—
-40
—
—
—
—
—
Typ
—
—
—
—
—
±1.5
±0.5
±0.5
75
±2
500
3.0
150
1.0
(3)
1.0
1
650
—
50
—
500
5
20
4.5
6.5
(5)
Max
1.0
0.60
0.50
0.30
7
(2)
±3
±1
±1
—
±5
—
5.0
—
—
—
1.2
800
+85
(4)
—
+125
—
—
—
—
—
Units
A
V
%V
o
%V
o
%V
o
%
%V
o
µSec
%V
o
%I
o
max
A
mSec
MHz
kHz
°C
°C/W
°C
G’s
G’s
grams
Input Voltage Range
Output Voltage Tolerance
Line Regulation
Load Regulation
Efficiency
V
o
Ripple (pk-pk)
Transient Response
Current Limit
Inrush Current
Switching Frequency
Operating Temperature Range
Thermal Resistance
Storage Temperature
Mechanical Shock
Mechanical Vibration
Per Mil-STD-883D, 20-2000 Hz
Weight
Notes:
(1)
(2)
(3)
(4)
(5)
V
in
∆V
o
Reg
line
Reg
load
η
V
r
t
tr
I
lim
I
ir
t
ir
ƒ
s
T
a
Over I
o
range
Over V
in
Range
T
a
= -20°C to SOA limit
(3)
Over V
in
range
I
o
min
≤
I
o
≤
I
o
max
I
o
=0.5 I
o
max
20MHz bandwidth
25% load change
V
o
over/undershoot
θ
ja
T
s
The ISR will operate at no load with reduced specifications.
For applications with input voltages greater than 7 VDC, use the PT78NR100 Series.
The inrush current stated is above the normal input current for the associated output load.
See Safe Operating Area curves or consult the factory for the appropriate derating
The tab pins on the 5-pin mount package types (suffixes L & M) must be soldered. For more information see the applicable package outline drawing.
For technical support and more information, see inside back cover or visit www.ti.com
PT5020 Series
Positive Input/Negative Output
Integrated Switching Regulator
Typical Characteristics
PT5024 (-12VDC)
(See Note A)
PT5022 (-5VDC)
(See Note A)
Efficiency vs Output Current
10 0
90
100
90
Vin
Efficiency vs Output Current
Efficiency - %
Efficiency - %
V in
80
70
60
50
40
0
0 .1
0 .2
0 .3
0 .4
0 .5
7.0V
6.5V
6.0V
5.5V
5.0V
4.75V
80
70
60
50
40
0
0 .2
0 .4
0 .6
0 .8
1
7.0 V
6.5 V
6.0 V
5.5 V
5.0 V
4.7 5V
Iout-(Amps)
Iout-(Amps)
Ripple Voltage vs Output Current
160
140
80
10 0
Ripple Voltage vs Output Current
Ripple-(mV)
V in
4 .7 5 V
5 .0 V
5 .5 V
6 .0 V
6 .5 V
7 .0 V
Ripple-(mV)
120
100
80
60
40
20
0
0
0.1
0.2
0.3
0.4
0.5
Vin
4 .7 5V
5 .0 V
5 .5 V
6 .0 V
6 .5 V
7 .0 V
60
40
20
0
0
0.2
0.4
0.6
0.8
1
Iout-(Amps)
Iout-(Amps)
Power Dissipation vs Output Current
2
Power Dissipation vs Output Current
2.5
1.5
Vin
4.75V
5.0V
5.5V
6.0V
6.5V
7.0V
2
Vin
4.75V
5.0V
5.5V
6.0V
6.5V
7.0V
PD-(Watts)
PD-(Watts)
1.5
1
1
0.5
0.5
0
0
0.1
0.2
0.3
0.4
0.5
0
0
0.2
0.4
0.6
0.8
1
Iout-(Amps)
Iout-(Amps)
Safe Operating Area (V
IN
=5V)
(See Note B)
90
Safe Operating Area (V
IN
=5V)
(See Note B)
90
Ambient Temperature - (C°)
Ambient Temperature - (C°)
80
80
70
60
50
40
30
20
70
60
Airflow
0 LFM
60 LFM
90 LFM
A i rfl o w
50
90 LFM
40
60 LFM
0 LFM
30
20
0 .0
0 .1
0 .2
0 .3
0 .4
0 .5
0
0.2
0.4
0.6
0.8
1
Maximum Output Current - (Amps)
Maximum Output Current - (Amps)
Note A:
Characteristic data has been developed from actual products tested at 25°C. This data is considered typical data for the Converter.
Note B:
Thermal derating graphs are developed in free-air convection cooling, which corresponds to approximately 40–60LFM of airflow.
For technical support and more information, see inside back cover or visit www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2012
PACKAGING INFORMATION
Orderable Device
PT5021C
PT5021J
PT5021N
PT5022A
PT5022C
PT5022H
PT5022L
PT5022M
PT5022N
PT5023A
PT5023C
PT5024A
PT5024C
PT5024L
PT5024M
PT5024N
PT5025A
PT5025C
PT5025L
PT5025N
PT5026A
PT5026C
PT5026H
PT5026L
PT5026LT
PT5026M
PT5026N
PT5027A
PT5027C
PT5029A
Status
(1)
Package Type Package
Drawing
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
EAC
EAJ
EAD
EAA
EAC
EAH
EAL
EAM
EAD
EAA
EAC
EAA
EAC
EAL
EAM
EAD
EAA
EAC
EAL
EAD
EAA
EAC
EAH
EAL
EAL
EAM
EAD
EAA
EAC
EAA
Pins
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Package Qty
35
35
35
35
16
35
35
35
35
35
35
35
35
35
35
35
35
35
35
35
16
35
35
35
35
35
Eco Plan
(2)
Lead/
Ball Finish
Call TI
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MSL Peak Temp
Level-1-215C-UNLIM
Call TI
N / A for Pkg Type
N / A for Pkg Type
Level-1-215C-UNLIM
N / A for Pkg Type
Level-1-215C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Call TI
Level-1-215C-UNLIM
N / A for Pkg Type
Level-1-215C-UNLIM
Level-1-215C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Level-1-215C-UNLIM
Level-1-215C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Level-1-215C-UNLIM
N / A for Pkg Type
Level-1-215C-UNLIM
Call TI
N / A for Pkg Type
N / A for Pkg Type
Call TI
Level-1-215C-UNLIM
N / A for Pkg Type
(3)
Samples
(Requires Login)
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
Pb-Free (RoHS)
TBD
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
Pb-Free (RoHS)
Pb-Free (RoHS)
OBSOLETE SIP MODULE
OBSOLETE SIP MODULE
OBSOLETE SIP MODULE
OBSOLETE SIP MODULE
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2012
Orderable Device
PT5029M
PT5030A
PT5030N
PT5031L
(1)
Status
(1)
Package Type Package
Drawing
SIP MODULE
SIP MODULE
SIP MODULE
SIP MODULE
EAM
EAA
EAD
EAL
Pins
3
3
3
3
Package Qty
35
35
35
35
Eco Plan
(2)
Lead/
Ball Finish
Call TI
Call TI
Call TI
Call TI
MSL Peak Temp
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Level-1-215C-UNLIM
(3)
Samples
(Requires Login)
NRND
NRND
NRND
NRND
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The
information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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