Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. I
ZT1
= 5 mA: 2.4 to 24 V, I
ZT1
= 2 mA: 27 to 75 V; I
ZT2
= 1 mA: 2.4 to 24 V, I
ZT2
= 0.5 mA: 27 to 75 V.
2. Zener voltage is measured with a pulse test current I
Z
at an ambient temperature of 25°C.
*Includes SZ-prefix devices where applicable.
www.onsemi.com
3
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
2
1
STYLE 1
1
2
SOD−523
CASE 502−01
ISSUE E
STYLE 2
−X−
D
−Y−
E
2X
DATE 28 SEP 2010
SCALE 4:1
b
0.08
1
M
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
DIM
A
b
c
D
E
H
E
L
L2
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
X Y
TOP VIEW
A
c
H
E
SIDE VIEW
2X
GENERIC
MARKING DIAGRAM*
L
1
STYLE 1
XX
M
XX
XX
2
1
STYLE 2
M
M
2
NO POLARITY
2X
L2
= Specific Device Code
Date Code
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.48
2X
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “
G”,
may or may not be present.
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
STYLE 2:
1.80
0.40
2X
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON11524D
SOD−523
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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