SCSI Bus Controller, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | LOGIC Devices |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 40 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
地址总线宽度 | 3 |
最大数据传输速率 | 2 MBps |
驱动器接口标准 | X3T9.2 |
外部数据总线宽度 | 8 |
JESD-30 代码 | R-GDIP-T40 |
湿度敏感等级 | 3 |
端子数量 | 40 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
座面最大高度 | 5.715 mm |
最大压摆率 | 20 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 15.24 mm |
uPs/uCs/外围集成电路类型 | BUS CONTROLLER, SCSI |
L5380CMB2 | 5962-9054802MYX | DBP-M959LF-00-2803-DD | L5380CC4 | L5380CC2 | L5380CM2 | |
---|---|---|---|---|---|---|
描述 | SCSI Bus Controller, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40 | SCSI Bus Controller, CMOS, CDIP48, 2.435 X 0.620 INCH, 0.225 INCH, DIP-48 | Array/Network Resistor, Isolated, Tantalum Nitride/nickel Chrome, 0.2W, 280000ohm, 100V, 0.5% +/-Tol, -300,300ppm/Cel, 4726, | SCSI Bus Controller, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40 | SCSI Bus Controller, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40 | SCSI Bus Controller, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40 |
Reach Compliance Code | unknown | unknown | compliant | unknown | unknown | unknown |
端子数量 | 40 | 48 | 8 | 40 | 40 | 40 |
最高工作温度 | 125 °C | 125 °C | 150 °C | 70 °C | 70 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | - | - | -55 °C |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR PACKAGE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | DIP | IN-LINE | IN-LINE | IN-LINE |
技术 | CMOS | CMOS | TANTALUM NITRIDE/NICKEL CHROME | CMOS | CMOS | CMOS |
是否Rohs认证 | 不符合 | - | 符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | LOGIC Devices | - | - | LOGIC Devices | LOGIC Devices | LOGIC Devices |
零件包装代码 | DIP | DIP | - | DIP | DIP | DIP |
包装说明 | DIP, | DIP, | - | DIP, | DIP, | DIP, |
针数 | 40 | 48 | - | 40 | 40 | 40 |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | EAR99 | - | - | 3A001.A.2.C |
地址总线宽度 | 3 | 3 | - | 3 | 3 | 3 |
最大数据传输速率 | 2 MBps | 2 MBps | - | 4 MBps | 2 MBps | 2 MBps |
驱动器接口标准 | X3T9.2 | X3T9.2 | - | X3T9.2 | X3T9.2 | X3T9.2 |
外部数据总线宽度 | 8 | 8 | - | 8 | 8 | 8 |
JESD-30 代码 | R-GDIP-T40 | R-CDIP-T48 | - | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 |
湿度敏感等级 | 3 | - | - | 3 | 3 | 3 |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | - | DIP | DIP | DIP |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.715 mm | - | - | 5.715 mm | 5.715 mm | 5.715 mm |
最大压摆率 | 20 mA | - | - | 20 mA | 20 mA | 20 mA |
最大供电电压 | 5.5 V | 5.5 V | - | 5.25 V | 5.25 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | - | 4.75 V | 4.75 V | 4.5 V |
标称供电电压 | 5 V | 5 V | - | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | - | NO | NO | NO |
温度等级 | MILITARY | MILITARY | - | COMMERCIAL | COMMERCIAL | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | - | - | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL |
宽度 | 15.24 mm | - | - | 15.24 mm | 15.24 mm | 15.24 mm |
uPs/uCs/外围集成电路类型 | BUS CONTROLLER, SCSI | BUS CONTROLLER, SCSI | - | BUS CONTROLLER, SCSI | BUS CONTROLLER, SCSI | BUS CONTROLLER, SCSI |
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