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TZA3001U

产品描述IC SPECIALTY INTERFACE CIRCUIT, UUC40, 2 X 2 X 0.38 MM, DIE-40, Interface IC:Other
产品类别模拟混合信号IC    驱动程序和接口   
文件大小147KB,共32页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
下载文档 详细参数 选型对比 全文预览

TZA3001U概述

IC SPECIALTY INTERFACE CIRCUIT, UUC40, 2 X 2 X 0.38 MM, DIE-40, Interface IC:Other

TZA3001U规格参数

参数名称属性值
厂商名称NXP(恩智浦)
零件包装代码DIE
包装说明DIE,
针数40
Reach Compliance Codeunknown
接口集成电路类型INTERFACE CIRCUIT
JESD-30 代码S-XUUC-N40
功能数量1
端子数量40
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料UNSPECIFIED
封装代码DIE
封装形状SQUARE
封装形式UNCASED CHIP
认证状态Not Qualified
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
温度等级INDUSTRIAL
端子形式NO LEAD
端子位置UPPER

TZA3001U文档预览

INTEGRATED CIRCUITS
DATA SHEET
TZA3001AHL; TZA3001BHL;
TZA3001U
SDH/SONET STM4/OC12 laser
drivers
Product specification
Supersedes data of 2000 Feb 22
2002 Aug 13
Philips Semiconductors
Product specification
SDH/SONET STM4/OC12 laser drivers
FEATURES
622 Mbits/s data input, both Current Mode Logic (CML)
and Positive Emitter Coupled Logic (PECL) compatible;
maximum 800 mV (p-p)
Adaptive laser output control with dual loop, stabilizing
optical 1 and 0 levels
Optional external control of laser modulation and biasing
currents (non-adaptive)
Automatic laser shutdown
Few external components required
Rise and fall times of 120 ps (typical value)
Jitter <50 mUI (p-p)
RF output current sinking capability of 60 mA
Bias current sinking capability of 90 mA
Power dissipation of 430 mW (typical value)
Low cost LQFP32 5
×
5 plastic package
Single 5 V power supply.
TZA3001AHL
Laser alarm output for signalling extremely low and high
bias current conditions.
TZA3001BHL
Extra STM4 622 Mbits/s loop mode input; both CML and
PECL compatible.
TZA3001U
Bare die version with combined bias alarm and loop
mode functionality.
ORDERING INFORMATION
TYPE
NUMBER
TZA3001AHL
TZA3001BHL
TZA3001U
bare die; 2000
×
2000
×
380
µm
PACKAGE
NAME
LQFP32
DESCRIPTION
APPLICATIONS
TZA3001AHL;
TZA3001BHL;
SDH/SONET STM4/OC12 optical transmission systems
SDH/SONET STM4/OC12 optical laser modules.
GENERAL DESCRIPTION
The TZA3001AHL, TZA3001BHL and TZA3001U are fully
integrated laser drivers for STM4/OC12 (622 Mbits/s)
systems, incorporating the RF path between the data
multiplexer and the laser diode. Since the dual loop bias
and modulation control circuits are integrated on the IC,
the external component count is low. Only decoupling
capacitors and adjustment resistors are required.
The TZA3001AHL features an alarm function for signalling
extreme bias current conditions. The alarm low and high
threshold levels can be adjusted to suit the application
using only a resistor or a current Digital-to-Analog
Converter (DAC).
The TZA3001BHL is provided with an additional RF data
input to allow remote system testing (loop mode).
The TZA3001U is a bare die version for use in compact
laser module designs. The die contains 40 pads and
features the combined functionality of the TZA3001AHL
and the TZA3001BHL.
VERSION
SOT401-1
plastic low profile quad flat package; 32 leads; body 5
×
5
×
1.4 mm
2002 Aug 13
2
Philips Semiconductors
Product specification
SDH/SONET STM4/OC12 laser drivers
BLOCK DIAGRAM
TZA3001AHL; TZA3001BHL;
TZA3001U
handbook, full pagewidth
ALARM TONE TZERO ALARMLO ALARMHI
26
4
5
21
LASER
CONTROL
BLOCK
data input
(differential)
18
2
22
23
13
MONIN
ONE
ZERO
LA
LAQ
BIAS
DIN
DINQ
28
29
CURRENT
SWITCH
12
15
TZA3001AHL
19, 20
27, 30
4
VCC(R) VCC(G) VCC(B)
ALS
BAND GAP
REFERENCE
6
BGAP
7
10
31
1, 3, 8, 9,
11, 14, 16, 17
24, 25, 32
11
GND
MGK271
Fig.1 Block diagram of TZA3001AHL.
handbook, full pagewidth
ENL
26
TONE
4
TZERO
5
LASER
CONTROL
BLOCK
2
22
23
13
MONIN
ONE
ZERO
LA
LAQ
BIAS
DIN
DINQ
DLOOP
DLOOPQ
28
29
19
20
BAND GAP
REFERENCE
6
MUX
CURRENT
SWITCH
12
15
BGAP
TZA3001BHL
18, 21
27, 30
4
VCC(R) VCC(G) VCC(B)
ALS
7
10
31
1, 3, 8, 9,
11, 14, 16, 17
24, 25, 32
11
GND
MGK270
Fig.2 Block diagram of TZA3001BHL.
2002 Aug 13
3
Philips Semiconductors
Product specification
SDH/SONET STM4/OC12 laser drivers
PINNING
PIN
SYMBOL
TZA3001AHL TZA3001BHL
GND
MONIN
GND
IGM
TONE
TZERO
BGAP
V
CC(G)
V
CC(G)
GND
GND
V
CC(B)
V
CC(B)
GND
LAQ
LA
GND
BIAS
GND
GND
GND
ALARMHI
V
CC(R)
V
CC(R)
DLOOP
V
CC(R)
DLOOPQ
V
CC(R)
ALARMLO
V
CC(R)
ONE
ZERO
GND
GND
ALARM
ENL
V
CC(R)
2002 Aug 13
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
TZA3001U
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
4
ground
PAD
TZA3001AHL; TZA3001BHL;
TZA3001U
DESCRIPTION
monitor photodiode current input
ground
not connected
connection for external capacitor used for setting
optical 1 control loop time constant (optional)
connection for external capacitor used for setting
optical 0 control loop time constant (optional)
connection for external band gap decoupling capacitor
supply voltage (green domain); note 1
supply voltage (green domain); note 1
ground
ground
supply voltage (blue domain); note 2
supply voltage (blue domain); note 2
ground
laser modulation output inverted
laser modulation output
ground
laser bias current output
ground
ground
ground
maximum bias current alarm reference level input
supply voltage (red domain); note 3
supply voltage (red domain); note 3
loop mode data input
supply voltage (red domain); note 3
loop mode data input inverted
supply voltage (red domain); note 3
minimum bias current alarm reference level input
supply voltage (red domain); note 3
optical 1 reference level input
optical 0 reference level input
ground
ground
alarm output
loop mode enable input
supply voltage (red domain); note 3
Philips Semiconductors
Product specification
SDH/SONET STM4/OC12 laser drivers
TZA3001AHL; TZA3001BHL;
TZA3001U
PIN
SYMBOL
TZA3001AHL TZA3001BHL
DIN
DINQ
V
CC(R)
ALS
GND
GND
Notes
28
29
30
31
32
28
29
30
31
32
PAD
DESCRIPTION
TZA3001U
35
36
37
38
39
40
data input
data input inverted
supply voltage (red domain); note 3
automatic laser shutdown input
ground
ground
1. Supply voltage for the Monitor PhotoDiode (MPD) input current.
2. Supply voltage for the laser modulation outputs (LA, LAQ).
3. Supply voltage for the data inputs (DIN, DINQ), optical 1 and 0 reference level inputs (ONE, ZERO), and the bias
current alarm reference level inputs (ALARMHI, ALARMLO).
27 VCC(R)
30 VCC(R)
29 DINQ
handbook, full pagewidth
26 ALARM
32 GND
25 GND
31 ALS
28 DIN
GND
MONIN
GND
TONE
TZERO
BGAP
VCC(G)
GND
1
2
3
4
24 GND
23 ZERO
22 ONE
21 ALARMLO
TZA3001AHL
5
6
7
8
20 VCC(R)
19 VCC(R)
18 ALARMHI
17 GND
VCC(B) 10
GND 11
LAQ 12
LA 13
GND 14
BIAS 15
GND 16
GND
9
MGK273
Fig.3 Pin configuration of TZA3001AHL.
2002 Aug 13
5

TZA3001U相似产品对比

TZA3001U TZA3001BHL TZA3001AHL TZA3001AHL-T TZA3001BHL-T
描述 IC SPECIALTY INTERFACE CIRCUIT, UUC40, 2 X 2 X 0.38 MM, DIE-40, Interface IC:Other IC SPECIALTY INTERFACE CIRCUIT, PQFP32, 5 X 5 X 1.40 MM, PLASTIC, LQFP-32, Interface IC:Other IC SPECIALTY INTERFACE CIRCUIT, PQFP32, 5 X 5 X 1.40 MM, PLASTIC, LQFP-32, Interface IC:Other IC SPECIALTY INTERFACE CIRCUIT, PQFP32, Interface IC:Other IC SPECIALTY INTERFACE CIRCUIT, PQFP32, Interface IC:Other
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
包装说明 DIE, LFQFP, LFQFP, QFP32,.28SQ,20 LFQFP, LFQFP,
Reach Compliance Code unknown unknown compliant unknown unknown
接口集成电路类型 INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 代码 S-XUUC-N40 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32
功能数量 1 1 1 1 1
端子数量 40 32 32 32 32
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIE LFQFP LFQFP LFQFP LFQFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 UNCASED CHIP FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 NO LEAD GULL WING GULL WING GULL WING GULL WING
端子位置 UPPER QUAD QUAD QUAD QUAD
零件包装代码 DIE QFP QFP - -
针数 40 32 32 - -
长度 - 5 mm 5 mm 5 mm 5 mm
座面最大高度 - 1.6 mm 1.6 mm 1.6 mm 1.6 mm
端子节距 - 0.5 mm 0.5 mm 0.5 mm 0.5 mm
宽度 - 5 mm 5 mm 5 mm 5 mm
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