FACTSHEET F-200
LGAF–120– 01– G–8
LGAF–108 – 01–G–8
LAND GRID ARRAY SOCKET
Dual spring action for
solderless connection
LGAF
SERIES
SPECIFICATIONS
Materials:
Insulator Material:
Liquid Crystal Polymer
Contact Material:
BeCu
Current Rating:
Testing Now!
Plating:
Au over 50µ" (1,27µm) Ni
APPLICATION
Anodized
aluminum cap
(supplied by
others)
Land Grid
Array Package
(supplied by
others)
LGAF Socket
Low profle
Anodized
aluminum
frame
(supplied by
others)
PC Board
(supplied by others)
(1,27mm)
.050"
pitch grid
CONTACT
LGAF
1
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
8
08, 20
= 30
µ
" (076
µ
m) Gold on contacts
–G
Note:
Some lengths,
styles and options are
non-standard, non-returnable.
No. of positions per row x
(1,27) .050 + (2,69) .106
Processing:
Max Processing Temp:
230°C for 60 seconds
SMT Lead Coplanarity:
(0,10mm).004" max
Suggested PCB Layouts:
Your specific layout may vary
(1,27)
.050
(11,43)
.450
(0,18)
.007
(1,27)
.050
(1,65)
.065
(0,33)
.013
(0,64)
.025
DIA
SAMTEC USA
• Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047
SAMTEC UK
• Tel: 01236 739292 • Fax: 01236 727113
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• Tel: 65-745-5955 • Fax: 65-841-1502
SAMTEC GERMANY
• Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299
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• Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61
SAMTEC ITALY
• Tel: 39 039 6890337 • Fax: 39 039 6890315
SAMTEC JAPAN
• Tel: 81-424-42-8318 • Fax: 81-424-42-8319
SAMTEC CHINA
• Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047
SAMTEC TAIWAN
• Tel: (02) 2395-1677 • Fax: (02) 2395-1689
Due to technical progress, all designs, specifications and components are subject to change without notice.
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