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Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MC7447ATHX1167NB

MC7447ATHX1167NB: 产品描述32-BIT, 1167MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共59页; 制造商Rochester Electronics; 官网地址https://www.rocelec.com/

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MC7447ATHX1167NB在线购买

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MC7447ATHX1167NB概述

32-BIT, 1167MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

MC7447ATHX1167NB规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	Rochester Electronics
零件包装代码	BGA
包装说明	25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
针数	360
Reach Compliance Code	unknown
其他特性	ALSO REQUIRES 1.8V OR 2.5V SUPPLY
地址总线宽度	36
位大小	32
边界扫描	YES
最大时钟频率	167 MHz
外部数据总线宽度	64
格式	FLOATING POINT
集成缓存	YES
JESD-30 代码	S-CBGA-B360
JESD-609代码	e0
长度	25 mm
低功率模式	YES
湿度敏感等级	1
端子数量	360
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	BGA
封装形状	SQUARE
封装形式	GRID ARRAY
峰值回流温度（摄氏度）	260
认证状态	COMMERCIAL
座面最大高度	3.24 mm
速度	1167 MHz
最大供电电压	1.35 V
最小供电电压	1.25 V
标称供电电压	1.3 V
表面贴装	YES
技术	CMOS
端子面层	TIN LEAD
端子形式	BALL
端子节距	1.27 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	40
宽度	25 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC

MC7447ATHX1167NB相似产品对比

	MC7447ATHX1167NB	MC7447AVS1000NB	MC7447AVS1333LB	MC7447AVS1000LB	MC7447AVU733NB	MC7447AVS733NB
描述	32-BIT, 1167MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360	32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360	32-BIT, 1333MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360	32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360	32-BIT, 733MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360	32-BIT, 733MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360
是否无铅	含铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	符合	符合	符合	符合	符合
零件包装代码	BGA	LGA	LGA	LGA	BGA	LGA
包装说明	25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360	25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360	25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360	25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360	25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360	25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360
针数	360	360	360	360	360	360
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
其他特性	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	ALSO REQUIRES 1.8V OR 2.5V SUPPLY
地址总线宽度	36	36	36	36	36	36
位大小	32	32	32	32	32	32
边界扫描	YES	YES	YES	YES	YES	YES
最大时钟频率	167 MHz	167 MHz	167 MHz	167 MHz	167 MHz	167 MHz
外部数据总线宽度	64	64	64	64	64	64
格式	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
集成缓存	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-CBGA-B360	S-CBGA-X360	S-CBGA-X360	S-CBGA-X360	S-CBGA-B360	S-CBGA-X360
长度	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm
低功率模式	YES	YES	YES	YES	YES	YES
湿度敏感等级	1	1	1	1	1	1
端子数量	360	360	360	360	360	360
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	BGA	CGA	CGA	CGA	BGA	CGA
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
峰值回流温度（摄氏度）	260	260	260	260	260	260
认证状态	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
座面最大高度	3.24 mm	2.2 mm	2.2 mm	2.2 mm	2.8 mm	2.2 mm
速度	1167 MHz	1000 MHz	1333 MHz	1000 MHz	733 MHz	733 MHz
最大供电电压	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V
最小供电电压	1.25 V	1.25 V	1.25 V	1.25 V	1.25 V	1.25 V
标称供电电压	1.3 V	1.3 V	1.3 V	1.3 V	1.3 V	1.3 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子面层	TIN LEAD	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	TIN COPPER/TIN SILVER	NOT SPECIFIED
端子形式	BALL	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	BALL	UNSPECIFIED
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	40	40	40	40	40	40
宽度	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
厂商名称	Rochester Electronics	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics

MC7447ATHX1167NB

MC7447ATHX1167NB在线购买

MC7447ATHX1167NB概述

MC7447ATHX1167NB规格参数

MC7447ATHX1167NB相似产品对比

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