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SAK-TC1796-256F150EBC

产品描述Microcontroller, 32-Bit, FLASH, 150MHz, CMOS, PBGA416, PLASTIC, BGA-416
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小4MB,共136页
制造商Infineon(英飞凌)
官网地址http://www.infineon.com/
下载文档 详细参数 选型对比 全文预览 文档解析

SAK-TC1796-256F150EBC概述

Microcontroller, 32-Bit, FLASH, 150MHz, CMOS, PBGA416, PLASTIC, BGA-416

SAK-TC1796-256F150EBC规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Infineon(英飞凌)
零件包装代码BGA
包装说明PLASTIC, BGA-416
针数416
Reach Compliance Codecompliant
ECCN代码3A991.A.2
Factory Lead Time1 week
具有ADCYES
地址总线宽度24
位大小32
最大时钟频率40 MHz
DAC 通道NO
DMA 通道YES
外部数据总线宽度32
JESD-30 代码S-PBGA-B416
长度27 mm
湿度敏感等级3
I/O 线路数量127
端子数量416
最高工作温度125 °C
最低工作温度-10 °C
PWM 通道NO
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA416,26X26,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)250
电源1.5,2.5/3.3,3.3 V
认证状态Not Qualified
RAM(字节)65536
ROM(单词)131072
ROM可编程性FLASH
座面最大高度2.5 mm
速度150 MHz
最大供电电压1.58 V
最小供电电压1.42 V
标称供电电压1.5 V
表面贴装YES
技术CMOS
温度等级OTHER
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度27 mm
uPs/uCs/外围集成电路类型MICROCONTROLLER

文档解析

作为一款32位单芯片微控制器,TC1796采用Infineon TriCore技术,专为需要高可靠性和实时性能的应用优化。核心处理器包括TriCore V1.3 CPU和32位Peripheral Control Processor(PCP2),后者配备16KB参数内存和32KB代码内存,实现并行任务处理。内存系统整合2MB程序闪存、128KB数据闪存及多种RAM类型,通过内存保护系统(MPS)增强数据安全。外部总线单元(EBU)提供32位接口,支持同步突发闪存访问,扩展外部存储能力。 外设功能丰富,包括两个异步/同步串行接口(ASC)用于UART通信,两个高速同步串行通道(SSC)支持可编程数据长度,以及Micro Second Bus(MSC)接口用于外部功率设备连接。MultiCAN控制器集成4个CAN节点,处理高效数据网关传输。模拟子系统包含两个16通道ADC和一个4通道FADC,后者采用硬件数据缩减技术,提升采样效率。通用定时器阵列(GPTA)和LTCA2单元提供灵活定时和PWM功能,管理多达39个I/O线。 系统控制单元(SCU)管理时钟生成和PLL,支持多种启动选项。电源设计核心电压1.5V,I/O电压3.3V,功耗管理系统优化能耗模式。调试接口支持JTAG和OCDS Level 2,提供16条跟踪输出线。封装为P/PG-BGA-416-4,工作温度-40°C至+125°C,适用于电动汽车控制、工业驱动等需要高集成度和鲁棒性的领域。

SAK-TC1796-256F150EBC文档预览

D a ta S he e t , V 1 .0 , Ap r . 2 0 0 8
TC1796
3 2 - B i t S i n g l e - C h i p M i c ro c o n t r o ll e r
TriCore
M i c r o c o n t r o l l e rs
Edition 2008-04
Published by
Infineon Technologies AG
81726 Munich, Germany
©
2008 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
D a ta S he e t , V 1 .0 , Ap r . 2 0 0 8
TC1796
3 2 - B i t S i n g l e - C h i p M i c ro c o n t r o ll e r
TriCore
M i c r o c o n t r o l l e rs
TC1796
TC1796 Data Sheet
Revision History: V1.0, 2008-04
Previous Version: V1.0, 2008-04 “Preliminary”
Page
Subjects (major changes since last revision)
“Preliminary” status removed. No changes in content.
Changes from V0.7, 2006-03 to V1.0, 2008-04 Preliminary
32
69
80
85
96
107
115
126
131
133
Trademarks
TriCore® is a trademark of Infineon Technologies AG.
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
mcdocu.comments@infineon.com
The list of not connected pins (N.C.) improved by adding several
formerly as
V
SS
labeled pins.
Watchdog timer, double reset detection, description corrected.
RTID register updated for the design step BE.
The description of the inactive device current improved.
ADC parameters sample and conversion time moved to a dedicated
table.
The description of the power supply sequence improved..
BFCLKO clock, duty cycle description extended.
MLI timing, maximum operating frequency limit extended, t31 added.
The drawing of the package updated.
Green package variant included.
Example of a temperature profile corrected.
Data Sheet
V1.0, 2008-04
TC1796
Table of Contents
Table of Contents
1
2
2.1
2.2
2.3
2.4
2.5
2.5.1
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.14.1
3.14.2
3.15
3.16
3.17
3.18
3.19
3.20
3.21
3.22
3.23
3.24
3.25
4
4.1
4.1.1
Data Sheet
Summary of Features
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
General Device Information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TC1796 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pad Driver and Input Classes Overview . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pull-Up/Pull-Down Behavior of the Pins . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Architecture and On-Chip Bus Systems . . . . . . . . . . . . . . . . . . . .
On-Chip Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Architectural Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Protection System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Bus Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peripheral Control Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DMA Controller and Memory Checker . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Asynchronous/Synchronous Serial Interfaces (ASC0, ASC1) . . . . . . . . . .
High-Speed Synchronous Serial Interfaces (SSC0, SSC1) . . . . . . . . . . . .
Micro Second Bus Interfaces (MSC0, MSC1) . . . . . . . . . . . . . . . . . . . . . .
MultiCAN Controller (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Micro Link Serial Bus Interface (MLI0, MLI1) . . . . . . . . . . . . . . . . . . . . . . .
General Purpose Timer Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functionality of GPTA0/GPTA1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functionality of LTCA2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog-to-Digital Converter (ADC0, ADC1) . . . . . . . . . . . . . . . . . . . . . . . .
Fast Analog-to-Digital Converter Unit (FADC) . . . . . . . . . . . . . . . . . . . . . .
System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Boot Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Management System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-Chip Debug Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock Generation and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Identification Register Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
10
11
12
13
13
35
36
36
37
39
40
41
42
44
46
48
50
52
54
57
59
60
62
63
65
67
69
70
70
73
74
76
79
80
Electrical Parameters
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
5
V1.0, 2008-04

SAK-TC1796-256F150EBC相似产品对比

SAK-TC1796-256F150EBC SAK-TC1796-256F150EBE SAK-TC1796-256F150EBD
描述 Microcontroller, 32-Bit, FLASH, 150MHz, CMOS, PBGA416, PLASTIC, BGA-416 Microcontroller, 32-Bit, FLASH, 150MHz, CMOS, PBGA416, PLASTIC, BGA-416 Microcontroller, 32-Bit, FLASH, 150MHz, CMOS, PBGA416, ROHS COMPLIANT, PLASTIC, BGA-416
是否Rohs认证 不符合 符合 符合
厂商名称 Infineon(英飞凌) Infineon(英飞凌) Infineon(英飞凌)
零件包装代码 BGA BGA BGA
包装说明 PLASTIC, BGA-416 BGA, BGA416,26X26,40 BGA, BGA416,26X26,40
针数 416 416 416
Reach Compliance Code compliant compliant unknown
ECCN代码 3A991.A.2 3A991.A.2 3A991.A.2
具有ADC YES YES YES
地址总线宽度 24 24 24
位大小 32 32 32
最大时钟频率 40 MHz 40 MHz 40 MHz
DAC 通道 NO NO NO
DMA 通道 YES YES YES
外部数据总线宽度 32 32 32
JESD-30 代码 S-PBGA-B416 S-PBGA-B416 S-PBGA-B416
长度 27 mm 27 mm 27 mm
I/O 线路数量 127 127 127
端子数量 416 416 416
最高工作温度 125 °C 125 °C 125 °C
最低工作温度 -10 °C -10 °C -10 °C
PWM 通道 NO NO NO
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA
封装等效代码 BGA416,26X26,40 BGA416,26X26,40 BGA416,26X26,40
封装形状 SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 250 250 NOT SPECIFIED
电源 1.5,2.5/3.3,3.3 V 1.5,2.5/3.3,3.3 V 1.5,2.5/3.3,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
RAM(字节) 65536 65536 65536
ROM(单词) 131072 2097152 2097152
ROM可编程性 FLASH FLASH FLASH
座面最大高度 2.5 mm 2.5 mm 2.5 mm
速度 150 MHz 150 MHz 150 MHz
最大供电电压 1.58 V 1.58 V 1.58 V
最小供电电压 1.42 V 1.42 V 1.42 V
标称供电电压 1.5 V 1.5 V 1.5 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 OTHER OTHER OTHER
端子形式 BALL BALL BALL
端子节距 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 27 mm 27 mm 27 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
Factory Lead Time 1 week 1 week -
湿度敏感等级 3 3 -
最大压摆率 - 700 mA 700 mA

 
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