DUAL N-CHANNEL MATCHED MOSFET PAIR
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | ALD [Advanced Linear Devices] |
零件包装代码 | DIP |
包装说明 | IN-LINE, R-PDIP-T8 |
针数 | 8 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
其他特性 | LOW THRESHOLD, HIGH INPUT IMPEDANCE |
配置 | COMMON SUBSTRATE, 2 ELEMENTS |
最小漏源击穿电压 | 12 V |
最大漏源导通电阻 | 75 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR |
JESD-30 代码 | R-PDIP-T8 |
JESD-609代码 | e0 |
元件数量 | 2 |
端子数量 | 8 |
工作模式 | ENHANCEMENT MODE |
最高工作温度 | 70 °C |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
极性/信道类型 | N-CHANNEL |
最大功率耗散 (Abs) | 0.5 W |
认证状态 | Not Qualified |
表面贴装 | NO |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
ALD1101PA | ALD1101 | ALD1101APA | ALD1101DA | ALD1101SA | ALD1101A | ALD1101B | ALD1101BPA | |
---|---|---|---|---|---|---|---|---|
描述 | DUAL N-CHANNEL MATCHED MOSFET PAIR | DUAL N-CHANNEL MATCHED MOSFET PAIR | DUAL N-CHANNEL MATCHED MOSFET PAIR | DUAL N-CHANNEL MATCHED MOSFET PAIR | DUAL N-CHANNEL MATCHED MOSFET PAIR | DUAL N-CHANNEL MATCHED MOSFET PAIR | DUAL N-CHANNEL MATCHED MOSFET PAIR | DUAL N-CHANNEL MATCHED MOSFET PAIR |
是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | - | - | 含铅 |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | - | - | 不符合 |
零件包装代码 | DIP | - | DIP | DIP | SOT | - | - | DIP |
包装说明 | IN-LINE, R-PDIP-T8 | - | IN-LINE, R-PDIP-T8 | IN-LINE, R-GDIP-T8 | SMALL OUTLINE, R-PDSO-G8 | - | - | IN-LINE, R-PDIP-T8 |
针数 | 8 | - | 8 | 8 | 8 | - | - | 8 |
Reach Compliance Code | unknow | - | unknow | unknow | unknow | - | - | unknow |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | - | - | EAR99 |
其他特性 | LOW THRESHOLD, HIGH INPUT IMPEDANCE | - | LOW THRESHOLD, HIGH INPUT IMPEDANCE | LOW THRESHOLD, HIGH INPUT IMPEDANCE | LOW THRESHOLD, HIGH INPUT IMPEDANCE | - | - | LOW THRESHOLD, HIGH INPUT IMPEDANCE |
配置 | COMMON SUBSTRATE, 2 ELEMENTS | - | COMMON SUBSTRATE, 2 ELEMENTS | COMMON SUBSTRATE, 2 ELEMENTS | COMMON SUBSTRATE, 2 ELEMENTS | - | - | COMMON SUBSTRATE, 2 ELEMENTS |
最小漏源击穿电压 | 12 V | - | 12 V | 12 V | 12 V | - | - | 12 V |
最大漏源导通电阻 | 75 Ω | - | 75 Ω | 75 Ω | 75 Ω | - | - | 75 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR | - | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | - | - | METAL-OXIDE SEMICONDUCTOR |
JESD-30 代码 | R-PDIP-T8 | - | R-PDIP-T8 | R-GDIP-T8 | R-PDSO-G8 | - | - | R-PDIP-T8 |
JESD-609代码 | e0 | - | e0 | e0 | e0 | - | - | e0 |
元件数量 | 2 | - | 2 | 2 | 2 | - | - | 2 |
端子数量 | 8 | - | 8 | 8 | 8 | - | - | 8 |
工作模式 | ENHANCEMENT MODE | - | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | - | - | ENHANCEMENT MODE |
最高工作温度 | 70 °C | - | 70 °C | 125 °C | 70 °C | - | - | 70 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
封装形式 | IN-LINE | - | IN-LINE | IN-LINE | SMALL OUTLINE | - | - | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
极性/信道类型 | N-CHANNEL | - | N-CHANNEL | N-CHANNEL | N-CHANNEL | - | - | N-CHANNEL |
最大功率耗散 (Abs) | 0.5 W | - | 0.5 W | 0.5 W | 0.5 W | - | - | 0.5 W |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
表面贴装 | NO | - | NO | NO | YES | - | - | NO |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | GULL WING | - | - | THROUGH-HOLE |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | - | - | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
晶体管应用 | SWITCHING | - | SWITCHING | SWITCHING | SWITCHING | - | - | SWITCHING |
晶体管元件材料 | SILICON | - | SILICON | SILICON | SILICON | - | - | SILICON |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved