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MK1709SLF

产品描述SOIC-8, Tube
产品类别逻辑    逻辑   
文件大小346KB,共10页
制造商IDT (Integrated Device Technology)
标准  
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MK1709SLF概述

SOIC-8, Tube

MK1709SLF规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码SOIC
包装说明0.150 INCH, ROHS COMPLIANT, SOIC-8
针数8
制造商包装代码DCG8
Reach Compliance Codecompliant
系列1709
输入调节STANDARD
JESD-30 代码R-PDSO-G8
JESD-609代码e3
长度4.9 mm
逻辑集成电路类型PLL BASED CLOCK DRIVER
最大I(ol)0.012 A
湿度敏感等级1
功能数量1
反相输出次数
端子数量8
实输出次数1
最高工作温度85 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装等效代码SOP8,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
电源3.3 V
认证状态Not Qualified
座面最大高度1.75 mm
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级OTHER
端子面层Matte Tin (Sn) - annealed
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度3.9 mm
最小 fmax167 MHz

MK1709SLF文档预览

DATASHEET
LOW EMI CLOCK GENERATOR
Description
The MK1709 generates a low EMI output clock from a clock
input. The part is designed to dither the LCD interface clock
for flat panel graphics controllers. The device uses IDT’s
proprietary mix of analog and digital Phase Locked Loop
(PLL) technology to spread the frequency spectrum of the
output, thereby reducing the frequency amplitude peaks by
several dB.
The MK1709 offers centered spread from a high speed
clock input. Refer to the MK1714-01/02 for a crystal input
and the widest selection of input frequencies and
multipliers.
IDT offers many other clocks for computers and computer
peripherals. Consult us when you need to remove crystals
and oscillators from your board.
MK1709
Features
Packaged in 8-pin SOIC (MK1709S) and in 8-pin TSSOP
(MK1709AG)
Pb-free package
Provides a spread spectrum output clock
Supports flat panel controllers
Guaranteed to +85° C operation
Accepts a clock input, provides same frequency dithered
output
Good for all VGA modes from 40 to 167 MHz
Peak reduction by 7dB - 14dB typical on 3rd - 19th odd
harmonics
Low EMI feature can be disabled
Includes power-down
Operating voltage of 3.3 V
Advanced, low-power CMOS process
Block Diagram
VDD
S0
S1
S2
Low EMI Enable
PLL Clock
Synthesis
and Spread
Spectrum
Circuitry
Input
Buffer
Clock Out
ICLK
GND
IDT™
LOW EMI CLOCK GENERATOR
1
MK1709
REV M 051310
MK1709
LOW EMI CLOCK GENERATOR
SSCG
Pin Assignment
ICLK
VDD
GND
CLK
1
2
3
4
8
7
6
5
S2
S1
S0
LEE
Spread Percentage and Direction
Select Table
S2
Pin 8
(1709S)
Pin 6
(1709AG)
0
0
0
S1
Pin 7
(1709S)
Pin 5
(1709AG)
0
0
0
S0
Pin 6
(1709S)
Pin 4
(1709AG)
0
M
1
Frequency
Spread
Range
Percentage
(%)
8-pin SOIC (MK1709S)
40-50
40-50
40-50
(MK1709S)
25-50
(MK1709AG)
40-50
(MK1709S)
25-50
(MK1709AG)
40-50
50 -100
50 -100
50 -100
Power Down
50 -100
50 -100
100-165
100-165
100-165
100-165
100-165
100-165
Power Down
±0.9
±0.7
±0.8
GND
CLK
LEE
S0
1
2
3
4
8
7
6
5
VDD
ICLK
S2
S1
0
M
0
±0.6
8-pin TSSOP (MK1709AG)
0
0
0
0
0
1
1
1
1
1
1
1
1
1
M
M
1
1
1
0
0
0
M
M
M
1
1
1
M
1
0
M
1
0
M
1
0
M
1
0
M
1
±1.1
±0.6
±0.7
±0.8
±0.9
±1.1
±0.7
±0.6
±1.1
±1.35
±0.8
±0.9
0 = connect to GND
M = unconnected (floating) has internal Pull up resistor to
VDD and is considered as a 1 state
1 = connect directly to VDD
IDT™
LOW EMI CLOCK GENERATOR
2
MK1709
REV M 051310
MK1709
LOW EMI CLOCK GENERATOR
SSCG
Pin Descriptions
(MK1709S)
Pin
Number
Pin
Name
Pin Type
Pin Description
1
2
3
4
5
6
7
8
ICLK
VDD
GND
CLK
LEE
S0
S1
S2
Input
Power
Power
Output
Input
Input
Input
Input
Connect to graphics input clock.
Connect to +3.3 V.
Connect to ground.
Spread spectrum clock output per table above.
Low EMI enable. Turns on spread spectrum when high. Internal pull-up resistor.
Function select 0 input. Selects spread amount and direction per table above.
Internal mid-level.
Function select 1 input. Selects spread amount and direction per table above.
Internal mid-level.
Function select 2 input. Selects spread amount and direction per table above.
Pin Descriptions
(MK1709AG)
Pin
Number
Pin
Name
Pin Type
Pin Description
1
2
3
4
5
6
7
8
GND
CLK
LEE
S0
S1
S2
ICLK
VDD
Power
Output
Input
Input
Input
Input
Input
Power
Connect to ground.
Spread spectrum clock output per table above.
Low EMI enable. Turns on spread spectrum when high. Internal pull-up resistor.
Function select 0 input. Selects spread amount and direction per table above.
Internal mid-level.
Function select 1 input. Selects spread amount and direction per table above.
Internal mid-level.
Function select 2 input. Selects spread amount and direction per table above.
Connect to graphics input clock.
Connect to +3.3 V.
IDT™
LOW EMI CLOCK GENERATOR
3
MK1709
REV M 051310
MK1709
LOW EMI CLOCK GENERATOR
SSCG
External Components
The MK1709 requires a minimum number of external
components for proper operation.
Decoupling Capacitor
A decoupling capacitor of 0.01µF must be connected
between VDD and GND on pins 2 and 3 for the MK1709S,
or pins 1 and 8 for the MK1709AG. Place the capacitor as
close to these pins as possible. For optimum device
performance, the decoupling capacitor should be mounted
on the component side of the PCB. Avoid the use of vias in
the decoupling circuit.
Series Termination Resistor
When the PCB trace between the clock output and the load
is over 1 inch, series termination should be used. To series
terminate a 50Ω trace (a commonly used trace impedance),
place a 33Ω resistor in series with the clock line, as close to
the clock output pin as possible. The nominal impedance of
the clock output is 20Ω
.
Select Pin Operation
The S1, S0 select pins are 2-level, meaning they have three
separate states to make the selections shown in the table on
page 2.
PCB layout Recommendations
For optimum device performance and lowest output phase
noise, the following guidelines should be observed.
1) The 0.01µF decoupling capacitor should be mounted on
the component side of the board as close to the VDD pin as
possible. No vias should be used between the decoupling
capacitor and VDD pin. The PCB trace to VDD pin should
be kept as short as possible, as should the PCB trace to the
ground via.
2) Place a 33Ω series termination resistor (if needed) close
to the clock output to minimize EMI.
3) An optimum layout is one with all components on the
same side of the board, minimizing vias through other signal
layers. Other signal traces should be routed away from the
MK1709. This includes signal traces just underneath the
device, or on layers adjacent to the ground plane layer used
by the device.
IDT™
LOW EMI CLOCK GENERATOR
4
MK1709
REV M 051310
MK1709
LOW EMI CLOCK GENERATOR
SSCG
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the MK1709. These ratings, which are
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range. Typical values are at 25° C.
Item
Supply Voltage, VDD (referenced to GND)
All Inputs and Outputs (referenced to GND)
Ambient Operating Temperature
Storage Temperature
Soldering Temperature (maximum of 10 seconds)
5V
Rating
-0.5 V to VDD+0.5 V
0 to +85° C
-65 to +150° C
260° C
Recommended Operation Conditions
Parameter
Ambient Operating Temperature
Power Supply Voltage (measured in respect to GND)
Min.
0
+3.135
Typ.
Max.
+85
+3.6
Units
°
C
V
DC Electrical Characteristics
Unless stated otherwise,
VDD = 3.3 V,
Ambient Temperature 0 to +85° C
Parameter
Operating Voltage
Supply Current (MK1709S)
Supply Current (MK1709AG)
Input High Voltage (ICLK)
Input High Voltage (S1, S0)
Input High Voltage (other inputs)
Input Low Voltage (ICLK)
Input Low Voltage
Output High Voltage (CMOS)
Output High Voltage
Output Low Voltage
Input Capacitance
Symbol
VDD
IDD
IDD
IDD
V
IH
V
IH
V
IH
V
IL
V
IL
V
OH
V
OH
V
OL
C
IN
Conditions
No load, at 3.3 V
No load, 50M
No load, 150M
Min.
3.135
Typ.
20
13
23
Max.
3.465
Units
V
mA
µA
V
V
V
(VDD/2)+1
VDD-0.5
2
VDD/2
VDD/2
I
OH
= -4mA
I
OH
= -12 mA
I
OL
= 12 mA
S0, S1, S2, LEE pins
7
VDD-0.4
2.4
(VDD/2)-1
0.5
V
V
V
V
0.4
V
pF
IDT™
LOW EMI CLOCK GENERATOR
5
MK1709
REV M 051310

MK1709SLF相似产品对比

MK1709SLF MK1709SLFTR
描述 SOIC-8, Tube SOIC-8, Reel
Brand Name Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 不含铅
是否Rohs认证 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 SOIC SOIC
包装说明 0.150 INCH, ROHS COMPLIANT, SOIC-8 0.150 INCH, ROHS COMPLIANT, SOIC-8
针数 8 8
制造商包装代码 DCG8 DCG8
Reach Compliance Code compliant compliant
系列 1709 1709
输入调节 STANDARD STANDARD
JESD-30 代码 R-PDSO-G8 R-PDSO-G8
JESD-609代码 e3 e3
长度 4.9 mm 4.9 mm
逻辑集成电路类型 PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
最大I(ol) 0.012 A 0.012 A
湿度敏感等级 1 1
功能数量 1 1
端子数量 8 8
实输出次数 1 1
最高工作温度 85 °C 85 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SOP
封装等效代码 SOP8,.25 SOP8,.25
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
电源 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified
座面最大高度 1.75 mm 1.75 mm
最大供电电压 (Vsup) 3.465 V 3.465 V
最小供电电压 (Vsup) 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 OTHER OTHER
端子面层 Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
端子形式 GULL WING GULL WING
端子节距 1.27 mm 1.27 mm
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 3.9 mm 3.9 mm
最小 fmax 167 MHz 167 MHz

 
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