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SMBJP6KE24-TP-HF

产品描述Trans Voltage Suppressor Diode,
产品类别分立半导体    二极管   
文件大小416KB,共5页
制造商Micro Commercial Components (MCC)
标准
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SMBJP6KE24-TP-HF概述

Trans Voltage Suppressor Diode,

SMBJP6KE24-TP-HF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Micro Commercial Components (MCC)
Reach Compliance Codecompliant
ECCN代码EAR99
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
湿度敏感等级1
峰值回流温度(摄氏度)260
处于峰值回流温度下的最长时间10

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MCC
Micro Commercial Components
TM
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
SMBJP6KE6.8(C)A
THRU
SMBJP6KE550(C)A
Transient
Voltage Suppressor
6.8 to 550 Volts
600 Watt
DO-214AA
(SMBJ) (LEAD FRAME)
A
Features
Halogen
free available upon request by adding suffix "-HF"
For surface mount applicationsin in or der to optimize board space
Available in both unidirectional and bidirectional construction
and suffix"C" designates bidirectional type
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Fast response time: typical less than 1.0ps from 0 volts to
V
BR
minimum
Low inductance
Excellent clamping capability
UL Recognized File # E331408
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals: solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes posit ive end (cathode)
B
except Bidirectional
Maximum soldering temperature: 260 C for 10 seconds
o
C
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Peak Pulse Current on
I
PP
See Table 1 Note:
2
10/1000us waveform
Peak Pulse Power
P
PP
600W
Note:
2,
Dissipation
Operation And Storage T
J
, T
STG
-55
o
C to
Temperature Range
+175
o
C
Thermal Resistance
R
thJC
25
O
C/W
R
thJL
20
O
C/W
F
H
D
G
E
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.00
1.91
0.05
NOTES:
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
DIM
A
B
C
D
E
F
G
H
MAX
.185
.155
.012
.060
.220
.096
.087
.008
MAX
4.70
3.94
0.31
1
..52
5.59
2.44
2.21
0.203
NOTE
2.
Non-repetitive current pulse, per Fig.3 and derated above
o
T
A
=25 C per Fig.2.
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.082”
0.050”
Revision:
E
www.mccsemi.com
1 of 5
2013/07/18

 
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