SKCD 81 C 065 I4F
Absolute Maximum Ratings
Symbol
V
RRM
I
FSM
i²t
T
jmax
Conditions
T
j
= 25 °C, I
R
= 0.15 mA
10 ms
sin 180°
T
j
= 25 °C
T
j
= 150 °C
Values
650
1470
1290
8321
175
Unit
V
A
A
A²s
°C
T
j
= 150 °C, t
p
= 10 ms, sin 180°
CAL-DIODE
I
F
= 200 A
1)
V
RRM
= 650 V
Size: 9 x 9 mm²
SKCD 81 C 065 I4F
Features
• low forward voltage drop combined
with a low temperature dependence
• easy paralleling due to a small forward
voltage spread
• very soft recovery behavior
• small switching losses
• high ruggedness
Electrical Characteristics
Symbol
I
F(AV)
I
R
V
F
Conditions
T
c
= 80 °C, T
j
= 175 °C, F
i
=PI/2,
Semitrans Assembly; R
th(j-c)
= 0.4 K/W
T
j
= 25 °C, V
RRM
= 650 V
T
j
= 150 °C, V
RRM
= 650 V
T
j
= 25 °C, I
F
= 148 A
T
j
= 150 °C, I
F
= 148 A
T
j
= 175 °C, I
F
= 148 A
min.
typ.
139
max.
Unit
A
0.15
44.00
1.30
1.24
1.18
0.85
2.64
0.78
2.68
1.62
1.56
1.49
0.99
3.85
0.95
3.65
mA
mA
V
V
V
V
m
V
m
V
(TO)
r
T
V
(TO)
r
T
T
j
= 150 °C
T
j
= 150 °C
T
j
= 175 °C
T
j
= 175 °C
Dynamic Characteristics
Symbol
E
rr
E
rr
Q
rr
Q
rr
I
rrm
I
rrm
Conditions
T
j
= 25 °C, 200 A, 400 V, 3000 A/µs
T
j
= 150 °C, 200 A, 400 V, 3000 A/µs
T
j
= 25 °C, 200 A, 400 V, 3000 A/µs
T
j
= 150 °C, 200 A, 400, 3000 A/µs
T
j
= 25 °C, 200 A, 400 V, 3000 A/µs
T
j
= 150 °C, 200 A, 400, 3000 A/µs
min.
typ.
2.1
5.8
7.8
19.7
130
196
max.
Unit
mJ
mJ
µC
µC
A
A
Typical Applications*
• freewheeling diode for IGBT
Footnotes
1)
Nominal IGBT I
F
rating,
verified by design and characterization
Thermal Characteristics
Symbol
T
j
T
stg
T
solder
T
solder
10 min.
5 min.
Conditions
min.
-40
-40
typ.
max.
175
175
250
320
Unit
°C
°C
°C
°C
Mechanical Characteristics
Symbol
Raster
size
Area total
Anode
Cathode
Wire bond
Package
Chips /
Package
Metallization
Metallization
Conditions
Values
9x9
81
bondable (Al)
solderable (Ag/Ni)
Al, typ. diameter = 300 µm
150 mm wafer frame
179
Unit
mm
2
mm²
pcs
SKCD
© by SEMIKRON
Rev. 0 – 12.06.2012
1
SKCD 81 C 065 I4F
Fig. 1: Rated current vs. thermal resistance
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
2
Rev. 0 – 12.06.2012
© by SEMIKRON
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