TS81102G0MFS,TS81102G0MFS pdf中文资料,TS81102G0MFS引脚图,TS81102G0MFS电路-Datasheet-电子工程世界

Datasheet> 器件分类 > 无线/射频/通信> 电信电路> TS81102G0MFS

TS81102G0MFS: 产品描述Telecom Circuit, 1-Func, CQFP196, CERAMIC, QFP-196; 产品类别无线/射频/通信电信电路; 文件大小522KB，共31页; 制造商e2v technologies

下载文档详细参数选型对比全文预览

TS81102G0MFS概述

Telecom Circuit, 1-Func, CQFP196, CERAMIC, QFP-196

TS81102G0MFS规格参数

参数名称	属性值
厂商名称	e2v technologies
零件包装代码	QFP
包装说明	HQFP,
针数	196
Reach Compliance Code	compliant
JESD-30 代码	S-CQFP-G196
长度	33.91 mm
功能数量	1
端子数量	196
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	HQFP
封装形状	SQUARE
封装形式	FLATPACK, HEAT SINK/SLUG
认证状态	Not Qualified
座面最大高度	3.4 mm
标称供电电压	5 V
表面贴装	YES
电信集成电路类型	TELECOM CIRCUIT
温度等级	MILITARY
端子形式	GULL WING
端子节距	0.635 mm
端子位置	QUAD
宽度	33.91 mm

TS81102G0MFS相似产品对比

	TS81102G0MFS	TS81102G0CFS	TS81102G0VFS	TS81102G0MFS9NB2	TS81102G0MFS9NB3	TS81102G0MFS9NC2	TS81102G0MFS9NC3	TS81102G0MFS9NC1	TS81102G0MFS9NB1
描述	Telecom Circuit, 1-Func, CQFP196, CERAMIC, QFP-196	Telecom Circuit, 1-Func, CQFP196, CERAMIC, QFP-196	Telecom Circuit, 1-Func, CQFP196, CERAMIC, QFP-196	Telecom Circuit, 1-Func, CQFP196, CERAMIC, QFP-196	Telecom Circuit, 1-Func, CQFP196, CERAMIC, QFP-196	Telecom Circuit, 1-Func, CQFP196, CERAMIC, QFP-196	Telecom Circuit, 1-Func, CQFP196, CERAMIC, QFP-196	Telecom Circuit, 1-Func, CQFP196, CERAMIC, QFP-196	Telecom Circuit, 1-Func, CQFP196, CERAMIC, QFP-196
厂商名称	e2v technologies	e2v technologies	e2v technologies	e2v technologies	e2v technologies	e2v technologies	e2v technologies	e2v technologies	e2v technologies
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
包装说明	HQFP,	HQFP,	HQFP,	HQFP,	HQFP,	HQFP,	HQFP,	HQFP,	HQFP,
针数	196	196	196	196	196	196	196	196	196
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
JESD-30 代码	S-CQFP-G196	S-CQFP-G196	S-CQFP-G196	S-CQFP-G196	S-CQFP-G196	S-CQFP-G196	S-CQFP-G196	S-CQFP-G196	S-CQFP-G196
长度	33.91 mm	33.91 mm	33.91 mm	33.91 mm	33.91 mm	33.91 mm	33.91 mm	33.91 mm	33.91 mm
功能数量	1	1	1	1	1	1	1	1	1
端子数量	196	196	196	196	196	196	196	196	196
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	HQFP	HQFP	HQFP	HQFP	HQFP	HQFP	HQFP	HQFP	HQFP
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	3.4 mm	3.4 mm	3.4 mm	3.4 mm	3.4 mm	3.4 mm	3.4 mm	3.4 mm	3.4 mm
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
电信集成电路类型	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
宽度	33.91 mm	33.91 mm	33.91 mm	33.91 mm	33.91 mm	33.91 mm	33.91 mm	33.91 mm	33.91 mm
最高工作温度	125 °C	-	-	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-	-	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
温度等级	MILITARY	-	-	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY

推荐资源

器件捷径: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多