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SST39VF6401-70-4C-B1KE

产品描述4M X 16 FLASH 2.7V PROM, 70 ns, PBGA48, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48
产品类别存储    存储   
文件大小915KB,共29页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
下载文档 详细参数 选型对比 全文预览

SST39VF6401-70-4C-B1KE概述

4M X 16 FLASH 2.7V PROM, 70 ns, PBGA48, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48

SST39VF6401-70-4C-B1KE规格参数

参数名称属性值
厂商名称Microchip(微芯科技)
零件包装代码BGA
包装说明TFBGA,
针数48
Reach Compliance Codeunknown
ECCN代码3A991.B.1.A
最长访问时间70 ns
其他特性BOTTOM BOOT BLOCK
启动块BOTTOM
JESD-30 代码R-PBGA-B48
长度8 mm
内存密度67108864 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
端子数量48
字数4194304 words
字数代码4000000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织4MX16
封装主体材料PLASTIC/EPOXY
封装代码TFBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行PARALLEL
编程电压2.7 V
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
类型NOR TYPE
宽度6 mm

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64 Mbit (x16) Multi-Purpose Flash Plus
SST39VF6401 / SST39VF6402
SST39VF160x / 320x / 640x2.7V 16Mb / 32Mb / 64Mb (x16) MPF+ memories
EOL Data Sheet
FEATURES:
• Organized as 4M x16: SST39VF6401/6402
• Single Voltage Read and Write Operations
– 2.7-3.6V
• Superior Reliability
– Endurance: 100,000 Cycles (Typical)
– Greater than 100 years Data Retention
• Low Power Consumption (typical values at 5 MHz)
– Active Current: 9 mA (typical)
– Standby Current: 3 µA (typical)
– Auto Low Power Mode: 3 µA (typical)
• Hardware Block-Protection/WP# Input Pin
– Top Block-Protection (top 32 KWord)
for SST39VF6402
– Bottom Block-Protection (bottom 32 KWord)
for SST39VF6401
• Sector-Erase Capability
– Uniform 2 KWord sectors
• Block-Erase Capability
– Uniform 32 KWord blocks
• Chip-Erase Capability
• Erase-Suspend/Erase-Resume Capabilities
• Hardware Reset Pin (RST#)
• Security-ID Feature
– SST: 128 bits; User: 128 bits
• Fast Read Access Time:
– 70 ns
• Latched Address and Data
• Fast Erase and Word-Program:
– Sector-Erase Time: 18 ms (typical)
– Block-Erase Time: 18 ms (typical)
– Chip-Erase Time: 40 ms (typical)
– Word-Program Time: 7 µs (typical)
• Automatic Write Timing
– Internal V
PP
Generation
• End-of-Write Detection
– Toggle Bits
– Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pinouts and command sets
• Packages Available
– 48-lead TSOP (12mm x 20mm)
– 48-ball TFBGA (8mm x 10mm)
• All non-Pb (lead-free) devices are RoHS compliant
PRODUCT DESCRIPTION
The SST39VF6401 and SST39VF6402 devices are 4M
x16 respectively, CMOS Multi-Purpose Flash Plus
(MPF+) manufactured with SST’s proprietary, high perfor-
mance CMOS SuperFlash technology. The split-gate cell
design and thick-oxide tunneling injector attain better reli-
ability and manufacturability compared with alternate
approaches. The SST39VF640x write (Program or
Erase) with a 2.7-3.6V power supply. These devices con-
form to JEDEC standard pinouts for x16 memories.
Featuring high performance Word-Program, the
SST39VF640x devices provide a typical Word-Program
time of 7 µsec. These devices use Toggle Bit or Data# Poll-
ing to indicate the completion of Program operation. To pro-
tect against inadvertent write, they have on-chip hardware
and Software Data Protection schemes. Designed, manu-
factured, and tested for a wide spectrum of applications,
these devices are offered with a guaranteed typical endur-
ance of 100,000 cycles. Data retention is rated at greater
than 100 years.
The SST39VF640x devices are suited for applications that
require convenient and economical updating of program,
configuration, or data memory. For all system applications,
they significantly improve performance and reliability, while
lowering power consumption. They inherently use less
energy during Erase and Program than alternative flash
technologies. The total energy consumed is a function of
the applied voltage, current, and time of application. Since
for any given voltage range, the SuperFlash technology
uses less current to program and has a shorter erase time,
the total energy consumed during any Erase or Program
operation is less than alternative flash technologies. These
devices also improve flexibility while lowering the cost for
program, data, and configuration storage applications.
The SuperFlash technology provides fixed Erase and Pro-
gram times, independent of the number of Erase/Program
cycles that have occurred. Therefore the system software
or hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose
Erase and Program times increase with accumulated
Erase/Program cycles.
©2008 Silicon Storage Technology, Inc.
S71223(03)-00-EOL
6/08
1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
MPF is a trademark of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.

SST39VF6401-70-4C-B1KE相似产品对比

SST39VF6401-70-4C-B1KE SST39VF6401-70-4I-EKE SST39VF6401-70-4C-EKE SST39VF6401-70-4I-B1KE SST39VF6402-70-4C-B1KE SST39VF6402-70-4I-B1KE SST39VF6402-70-4I-EKE SST39VF6402-70-4C-EKE
描述 4M X 16 FLASH 2.7V PROM, 70 ns, PBGA48, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 4M X 16 FLASH 2.7V PROM, 70 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 4M X 16 FLASH 2.7V PROM, 70 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 4M X 16 FLASH 2.7V PROM, 70 ns, PBGA48, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 4M X 16 FLASH 2.7V PROM, 70 ns, PBGA48, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 4M X 16 FLASH 2.7V PROM, 70 ns, PBGA48, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 4M X 16 FLASH 2.7V PROM, 70 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 4M X 16 FLASH 2.7V PROM, 70 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48
零件包装代码 BGA TSOP1 TSOP1 BGA BGA BGA TSOP1 TSOP1
包装说明 TFBGA, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 TFBGA, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48
针数 48 48 48 48 48 48 48 48
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
最长访问时间 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns
其他特性 BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK
启动块 BOTTOM BOTTOM BOTTOM BOTTOM TOP TOP TOP TOP
JESD-30 代码 R-PBGA-B48 R-PDSO-G48 R-PDSO-G48 R-PBGA-B48 R-PBGA-B48 R-PBGA-B48 R-PDSO-G48 R-PDSO-G48
长度 8 mm 18.4 mm 18.4 mm 8 mm 8 mm 8 mm 18.4 mm 18.4 mm
内存密度 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
内存宽度 16 16 16 16 16 16 16 16
功能数量 1 1 1 1 1 1 1 1
端子数量 48 48 48 48 48 48 48 48
字数 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
字数代码 4000000 4000000 4000000 4000000 4000000 4000000 4000000 4000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C 85 °C 70 °C
组织 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFBGA TSOP1 TSOP1 TFBGA TFBGA TFBGA TSOP1 TSOP1
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
编程电压 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
端子形式 BALL GULL WING GULL WING BALL BALL BALL GULL WING GULL WING
端子节距 0.8 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm 0.8 mm 0.5 mm 0.5 mm
端子位置 BOTTOM DUAL DUAL BOTTOM BOTTOM BOTTOM DUAL DUAL
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 6 mm 12 mm 12 mm 6 mm 6 mm 6 mm 12 mm 12 mm
厂商名称 Microchip(微芯科技) Microchip(微芯科技) - Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)

 
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