CD4077BFB
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Renesas(瑞萨电子) |
包装说明 | DIP, DIP14,.3 |
Reach Compliance Code | not_compliant |
JESD-30 代码 | R-XDIP-T14 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | XNOR GATE |
最大I(ol) | 0.00036 A |
端子数量 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5/15 V |
Prop。Delay @ Nom-Sup | 280 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
筛选级别 | 38535Q/M;38534H;883B |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
CD4077BFB | CD4070BF/3A | 5962-01-219-6292 | CD4077BEX98 | CD4077BF/3A | CD4070BEX98 | 5962-01-208-9468 | |
---|---|---|---|---|---|---|---|
描述 | CD4077BFB | IC,LOGIC GATE,QUAD 2-INPUT XOR,CMOS,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT XNOR,CMOS,DIP,14PIN,CERAMIC | CD4077BEX98 | XNOR GATE | CD4070BEX98 | IC,LOGIC GATE,QUAD 2-INPUT XOR,CMOS,DIP,14PIN,CERAMIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-GDIP-T14 | R-PDIP-T14 | R-XDIP-T14 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | XNOR GATE | XOR GATE | XNOR GATE | XNOR GATE | XNOR GATE | XOR GATE | XOR GATE |
最大I(ol) | 0.00036 A | 0.00036 A | 0.00036 A | 0.00042 A | 0.00036 A | 0.00042 A | 0.00036 A |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 85 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -40 °C | -55 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
Prop。Delay @ Nom-Sup | 280 ns | 280 ns | 280 ns | 280 ns | 280 ns | 280 ns | 280 ns |
施密特触发器 | NO | NO | NO | NO | NO | NO | NO |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | Renesas(瑞萨电子) | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | - | - |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
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