Power Supply Support Circuit, Adjustable, 1 Channel, PBGA14, FLIPCHIP-14
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | BGA |
| 包装说明 | FLIPCHIP-14 |
| 针数 | 14 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PBGA-B14 |
| JESD-609代码 | e0 |
| 长度 | 2.54 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | FLIP CHIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.67 mm |
| 最大供电电流 (Isup) | 0.09 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 3.6 V |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 2.03 mm |
| DS2761AX/T&R | DS2761BT | DS2761BT-025 | DS2761AE/T&R | DS2761AT-025 | DS2761AE-025/T&R | DS2761AX | DS2761AX-025/T&R | DS2761BE-025/T&R | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Power Supply Support Circuit, Adjustable, 1 Channel, PBGA14, FLIPCHIP-14 | Power Supply Support Circuit, Fixed, 1 Channel, PDSO16, TSSOP-16 | Power Supply Support Circuit, Fixed, 1 Channel, PDSO16, TSSOP-16 | Power Supply Support Circuit, Adjustable, 1 Channel, PDSO16, TSSOP-16 | Power Supply Support Circuit, Fixed, 1 Channel, PDSO16, TSSOP-16 | Power Supply Support Circuit, Adjustable, 1 Channel, PDSO16, TSSOP-16 | Power Supply Support Circuit, Fixed, 1 Channel, PBGA14, FCP-14 | Power Supply Support Circuit, Adjustable, 1 Channel, PBGA14, FLIPCHIP-14 | Power Supply Support Circuit, Adjustable, 1 Channel, PDSO16, TSSOP-16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | BGA | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | BGA | BGA | TSSOP |
| 包装说明 | FLIPCHIP-14 | TSSOP-16 | TSSOP-16 | TSSOP-16 | TSSOP-16 | TSSOP-16 | FCP-14 | FLIPCHIP-14 | TSSOP-16 |
| 针数 | 14 | 16 | 16 | 16 | 16 | 16 | 14 | 14 | 16 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | NO | NO | YES | NO | YES | NO | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PBGA-B14 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PBGA-B14 | R-PBGA-B14 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 16 | 16 | 16 | 16 | 16 | 14 | 14 | 16 |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | -40 °C | -40 °C | -20 °C | -40 °C | -20 °C | -40 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | SOP | SOP | TSSOP | SOP | TSSOP | VFBGA | VFBGA | TSSOP |
| 封装等效代码 | FLIP CHIP | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | FLIP CHIP | FLIP CHIP | TSSOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 240 | 240 | NOT SPECIFIED | 240 | 240 |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电流 (Isup) | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | BALL | BALL | GULL WING |
| 端子节距 | 0.5 mm | 0.635 mm | 0.635 mm | 0.65 mm | 0.635 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.65 mm |
| 端子位置 | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | BOTTOM | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 20 | NOT SPECIFIED | 20 | NOT SPECIFIED | NOT SPECIFIED | 20 |
| 长度 | 2.54 mm | - | - | 5 mm | - | 5 mm | 2.69 mm | 2.54 mm | 5 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 座面最大高度 | 0.67 mm | - | - | 1.1 mm | - | 1.1 mm | 0.92 mm | 0.67 mm | 1.1 mm |
| 标称供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
| 宽度 | 2.03 mm | - | - | 4.4 mm | - | 4.4 mm | 2.41 mm | 2.03 mm | 4.4 mm |
| 其他特性 | - | OVER/UNDER VOLTAGE PROTECTION | OVER/UNDER VOLTAGE PROTECTION | OVER/UNDER VOLTAGE PROTECTION | OVER/UNDER VOLTAGE PROTECTION | OVER/UNDER VOLTAGE PROTECTION | - | - | OVER/UNDER VOLTAGE PROTECTION |
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