IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDIP8, PLASTIC, DIP-8, Power Management Circuit
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP8,.3 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-PDIP-T8 |
| JESD-609代码 | e0 |
| 信道数量 | 2 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.937 mm |
| 最大供电电流 (Isup) | 1 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| LTC694CN-3.3 | LTC694CS-3.3 | LTC694IN-3.3 | LTC694IS-3.3 | |
|---|---|---|---|---|
| 描述 | IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDIP8, PLASTIC, DIP-8, Power Management Circuit | IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO8, PLASTIC, SOIC-8, Power Management Circuit | IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDIP8, PLASTIC, DIP-8, Power Management Circuit | IC 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO8, PLASTIC, SOIC-8, Power Management Circuit |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | SOIC | DIP | SOIC |
| 包装说明 | DIP, DIP8,.3 | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 |
| 针数 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 信道数量 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | SOP |
| 封装等效代码 | DIP8,.3 | SOP8,.25 | DIP8,.3 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.937 mm | 1.75 mm | 3.937 mm | 1.75 mm |
| 最大供电电流 (Isup) | 1 mA | 2.5 mA | 2.5 mA | 2.5 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 3.9 mm | 7.62 mm | 3.9 mm |
NXP MCU
嵌入式系统
模拟与混合信号
嵌入式系统
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