SKiiP 1092 GB 170 - 474 CTV
Absolute Maximum Ratings
Symbol
V
isol 4)
T
op
,T
stg
Conditions
AC, 1min
Operating / stor. temperature
1)
Values
4000
-25...+85
1700
1200
1000
-40...+150
1000
2000
8640
373
18
30
7,0
75
Units
V
°C
V
V
A
°C
A
A
A
kAs
2
V
V
kHz
kV/µs
IGBT and Inverse Diode
V
CES
V
CC 5)
Operating DC link voltage
I
C
IGBT
3)
T
j
IGBT + Diode
I
F
Diode
I
FM
Diode, t
p
< 1 ms
I
FSM
Diode, T
j
= 150 °C, 10ms; sin
2
I t (Diode) Diode, T
j
= 150 °C, 10ms
Driver
V
S1
Stabilized Power Supply
V
S2
Non-stabilized Power Supply
f
smax
Switching frequency
dV/dt
Primary to secondary side
SKiiPPACK
®
SK integrated intelligent
Power PACK
halfbridge
SKiiP
7,9)
1092 GB 170 - 474 CTV
Preliminary Data
Case S4
Characteristics
Symbol
IGBT
11)
V
(BR)CES
I
CES
V
TO
r
T
V
Cesat
V
Cesat
E
on
+ E
off
C
CHC
L
CE
Conditions
1)
min.
≥V
CES
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
typ.
−
−
60
−
−
−
−
−
3,2
2
−
−
−
−
−
−
−
−
max.
−
4
−
1,77
4,1
5,1
3,85
845/130
1
−
−
2,60
2,90
120
0,90
1,3
0,023
0,063
33
Units
V
mA
mA
V
mΩ
V
V
mJ
nF
nH
V
V
mJ
V
mΩ
K/W
K/W
K/KW
mA
mA
µs
A
A
°C
V
Driver without supply
V
GE
= 0,
T
j
= 25 °C
V
CE
= V
CES
T
j
= 125 °C
T
j
= 125 °C
T
j
= 125 °C
I
C
= 800A,
T
j
= 125 °C
I
C
= 800A,
T
j
= 25 °C
V
CC
=900/1200V, I
C
=1000A
T
j
= 125 °C
per Phase, AC side
Top, Bottom
T
j
= 125 °C
T
j
= 25 °C
T
j
= 125 °C
Inverse Diode
2)
V
F
= V
EC
I
F
= 800A;
V
F
= V
EC
I
F
= 800A;
E
on
+ E
off
I
F
= 1000A;
V
TO
T
j
= 125 °C
r
T
T
j
= 125 °C
Features
•
Short circuit protection, due to
evaluation of current sensor
signals
•
Isolated power supply
•
Low thermal impedance
•
Optimal thermal management
with integrated heatsink
•
Pressure contact technology
with increased power cycling
capability, compact design
•
Low stray inductance
•
High power, small losses
•
Over-temperature protection
1)
2)
3)
4)
Thermal Characteristics
R
thjs10)
per IGBT
10)
R
thjs
per Diode
6,10)
R
thsa
P16 heatsink; see case S4
Driver
I
S1
Supply current 15V-supply
I
S2
Supply current 24V-supply
t
interlock-driver
Interlock-time
SKiiPPACK protection
I
TRIPSC
Short circuit protection
I
TRIPLG
Ground fault protection
T
TRIP
Over-temp. protection
9)
U
DCTRIP
U
DC
-protection
Mechanical Data
M1
DC terminals, SI Units
M2
AC terminals, SI Units
B 7
−
62
5)
6)
7)
290+490*f
s
/f
smax
+1,3*I
AC
/A
220+370*f
s
/f
smax
+1,0*I
AC
/A
3,0
1250
-
115
1225
4
8
−
−
0898
6
10
8)
9)
10)
Nm
Nm
T
heatsink
= 25 °C, unless
otherwise specified
CAL = Controlled Axial Lifetime
Technology (soft and fast)
without driver
Driver input to DC link /
AC output to DC link / AC
output to heatsink
with Semikron-DC link (low
inductance)
other heatsinks on request
C - Integrated current sensors
T - Temperature protection
V - 15 V or 24 V power supply
AC connection busbars must be
connected by the user; copper
busbars available on request
options available for driver:
U - DC link voltage sense
F – Fiber optic connector
“
s
” referenced to temperature
sensor
©by
SEMIKRON
PIN-array - halfbridge driver SKiiPPACK 4-fold type “GB”
X1:
Pin
1
2
3
signal
shield
BOT IN
4)
ERROR OUT
1)
remark
connected to GND, when shielded cable is used
positive 15V CMOS logic; 10 kΩ impedance,
don´t connect when using fiber optic
LOW = NO ERROR; open Collector Output;
max. 30 V / 15 mA
don´t connect when using fiber optic,
propagation delay 1
µs
min. pulsewidth error-memory-reset 8
µs
positive 15V CMOS logic; 10 kΩ impedance
don´t connect when using fiber optic
LOW = NO ERROR =
ϑ
DCB
< 115 + 5°C
open collector Output; max. 30 V / 15 mA
„low“ output voltage < 0,6 V
„high“ output voltage max. 30 V
24 V
DC
(20 - 30 V)
don´t supply with 24 V, when using + 15 V
DCIN
supply voltage monitoring threshold 19,5 V
15 V
DC
+ 4 %
don´t supply with 15 V, when using + 24 V
DCIN
supply voltage monitoring threshold 13 V
GND for power supply and
GND for digital signals
4
5
TOP IN
4)
Overtemp. OUT
1)
6
7
8
9
10
11
12
+ 24 V
DC
IN
+ 24 V
DC
IN
+ 15 V
DC
IN
+ 15 V
DC
IN
GND
GND
Temp. analog OUT or U
DC
when using option “U”
U
DC
analog OUT
2)
actual DC-link voltage, 9 V refer to U
DCmax
max. output current 5 mA; overvoltage trip level 9 V
GND aux
3)
I analog OUT
GND for analog signals
current actual value, 8,0 V refer to I
C
@ 25 °C
overcurrent trip level 10 V
⇔
125 % I
C
@ 25 °C
current value > 0
⇔
SKiiP is source
current value < 0
⇔
SKiiP is sink
13
14
X10: halfbridge 1 (HB1) OUT
Pin Signal
1
2
8
11
12
13
16
17
Collector TOP (HB1)
Gate TOP (HB1)
Emitter TOP (HB1)
Collector BOT (HB1)
Gate BOT (HB1)
Emitter BOT (HB1)
X11: halfbridge 2 (HB2) OUT
Pin Signal
1
2
8
11
12
13
16
17
Temp.-Sensor (HB2)1
Temp.-Sensor (HB2)2
Collector TOP (HB2)
Gate TOP (HB2)
Emitter TOP (HB2)
Collector BOT (HB2)
Gate BOT (HB2)
Emitter BOT (HB2)
X12: halfbridge 3 (HB3) OUT
Pin Signal
1
2
8
11
12
13
16
17
Collector TOP (HB3)
Gate TOP (HB3)
Emitter TOP (HB3)
Collector BOT (HB3)
Gate BOT (HB3)
Emitter BOT (HB3)
1)
X13: halfbridge 4 (HB4) OUT
Pin Signal
1
2
8
11
12
13
16
17
Collector TOP (HB4)
Gate TOP (HB4)
Emitter TOP (HB4)
Collector BOT (HB4)
Gate BOT (HB4)
Emitter BOT (HB4)
type “GAL”
as type “GB” except
- PIN X1-4: connect this pin to GND
- TOP switch does not exist
type “GAR”
as type “GB” except
- PIN X1-2: connect this pin to GND
- BOTTOM switch does not exist
Open collector output, external pull
up resistor necessary
2)
When using option “U” the analog
temperature signal is not available
3)
GND aux = reference for analog
output signals
4)
„high“ (min) 11,2 V
„low“ (max) 5,4 V
B 7 – 12
0898
© by SEMIKRON
Case S4
SKiiPPACK 4 - GB
Weight without heatsink: 3,54 kg
P16:
8,46 kg
SKiiPPACK 4 - GB with F-option
© by SEMIKRON
0898
B7–4
微控制器 MCU
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