电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

SSW-111-24-S-Q-RA

产品描述Board Connector, 22 Contact(s), 2 Row(s), Female, Right Angle, Solder Terminal, Socket,
产品类别连接器    连接器   
文件大小527KB,共3页
制造商SAMTEC
官网地址http://www.samtec.com/
下载文档 详细参数 全文预览

SSW-111-24-S-Q-RA概述

Board Connector, 22 Contact(s), 2 Row(s), Female, Right Angle, Solder Terminal, Socket,

SSW-111-24-S-Q-RA规格参数

参数名称属性值
厂商名称SAMTEC
Reach Compliance Codecompliant
主体/外壳类型SOCKET
连接器类型BOARD CONNECTOR
联系完成配合GOLD (30)
联系完成终止MATTE TIN
触点性别FEMALE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e3
MIL 符合性NO
制造商序列号SSW-1
混合触点NO
安装方式RIGHT ANGLE
安装类型BOARD
装载的行数2
选件GENERAL PURPOSE
端子节距2.54 mm
端接类型SOLDER
触点总数22
UL 易燃性代码94V-0

文档预览

下载PDF文档
REVISION BX
SSW-1XX-XX-XXX-X-XX-XXX-XX
No OF POSITIONS
-01 THRU -50
(-P OPTION: 36 POS MAX)
DO NOT
SCALE FROM
THIS PRINT
LEAD STYLE
(SEE TABLE 1)
-01 THRU -06 (STD. INS. FORCE)
-21 THRU -24 (LOW INS. FORCE)
OPTION
-LL: LOCKING LEAD
(SEE FIG 4, SHT 2)
(N/A IN SINGLE ROW,
1 & 2 POSITION)
POLARIZING OPTION
INDICATE POS, SEE FIG 3, SHT 3
OPTION
-RA: RIGHT ANGLE (SEE FIG 2, SHT 2)
(STYLE -01 & -21 N/A)
-N: NOTCH (SEE FIG 6, SHT 3)
(ONLY AVAILABLE IN -D ROW)
(ONLY AVAILABLE IN 5, 7, 8, 10, 12,
13, 15, 17, 20, 25, 32, 36 POSITIONS)
(USE NSW-XX-D-N-XX BODY,
SEE TABLE 6)
PLATING SPECIFICATION
-G: 20µ" GOLD IN CONTACT AREA,
3µ" GOLD ON TAIL
-T: MATTE TIN CONTACT AND TAIL
(CONTACT -21 THRU -24 N/A)
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
-H: 30µ" HEAVY GOLD IN CONTACT AREA,
ROW SPECIFICATION
3µ" GOLD ON TAIL
-E: 50µ" EXTRA HEAVY GOLD IN CONTACT AREA,
-S: SINGLE
3µ" GOLD ON TAIL
-D: DOUBLE
(CONTACT -01 & -02 STRAIGHT ONLY)
-T: TRIPLE
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA,
-P: SINGLE
MATTE TIN ON TAIL
-Q: TRIPLE WITH ONLY OUTER 2 ROWS
-STL: 30µ" SELECTIVE GOLD IN CONTACT AREA,
FILLED
TIN/LEAD (90/10 ± 5%) TAIL
-TL: TIN/LEAD (90/10 ± 5%) CONTACT AND TAIL
(AVAILABLE ONLY ON LEAD STYLES -01)
-TM: MATTE TIN CONTACT AND TAIL (CONTACT -21 THRU -24 N/A)
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
-FM: 3µ" FLASH GOLD SELECTIVE IN CONTACT AREA,
MATTE TIN ON TAIL
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
.050 1.27 REF
((No. OF POS x .10[2.5]) + .02[0.5])
SEE NOTE 10
.0110 0.280
REF
.095 2.41
REF
.095 2.41
REF
.245 6.22
.195 4.95
REF
SEE NOTE 8
.295 7.49
REF
60°
.335 8.51
DETAIL 'A'
SCALE 4 : 1
SEE NOTE 5
NOTES:
'A'
*"B"
.031 0.79 X .016[0.41]
REF (TYP)
+.000
*"B"
- .005
FOR
C
C
-S
MACHINE FILL ONLY
-P
.100 2.54
C
-D
FIG 1
-D-N
.100 2.54
.200 5.08
-T
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. MAXIMUM CUT FLASH: .015[.38] WITH NO FLASH BELOW STANDOFFS OR IN CONTACT HOLES.
3. MINIMUM CONTACT PUSHOUT FORCE: 1.5 LBS.
4. MAXIMUM ALLOWABLE BOW: .003[.08] INCH/INCH.
5. MAXIMUM ALLOWABLE SWAY: 2° (TYP) FOR HAND FILL & 1° (TYP) FOR MACHINE FILL.
6. MAXIMUM ALLOWABLE VARIATION BETWEEN ROWS: .010[.25].
7. "END WALLS" AFTER CUTTING SHOULD BE .020±.003 [.51±.08].
8. NOTCH ON -P-RA & -D-RA-N OPTIONS TO BE ORIENTED AS SHOWN.
9. SHEAR LOCATION TO BE WITHIN .001[.03] OF THE BREAK OFF CENTER LOCATION.
10. SHEAR LOCATION TO BE WITHIN .001[.03] OF THE BREAK OFF CENTER LOCATION
FOR MACHINE FILL.
11. LEAD STYLE X2 (SINGLE AND DOUBLE) -RA's TO BE LAYER PACKAGED. ALL OTHER -RA
LEAD STYLES: UNDER 5 POSITION TO BE LAYER PACKAGED, 5 AND UP TO BE PACKAGED
IN TUBES.
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01 [.3]
.XXX: .005 [.13]
ANGLES
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
INSULATOR:
-S, -D, -D-N: VECTRA E130i, COLOR: BLACK UL94 V0
-P, -T: PCT, COLOR: BLACK UL94 V0
CONTACT: PHOSPHOR BRONZE, SPRING TEMPER
ALLOY 511 OR 510
(TENSILE STRENGTH 90-100 KSI)
(YEILD STRENGTH @ 2% OFFSET 88-98 KSI)
PER MIL-B-13501
THICKNESS: .0160±.001 [0.635±0.03]
F:\DWG\MISC\MKTG\SSW-1XX-XX-XXX-X-XX-XXX-XX-MKT.SLDDRW
SHEET SCALE: 2:1
ASSEMBLY, SOCKET STRIP .016 X .031 TAIL
SSW-1XX-XX-XXX-X-XX-XXX-XX
06/12/1987
SHEET
1
OF
3
BY:
PURVIS
msp430 I2C read
char readMode_specialFunction(int deviceAddress, int registerAddress) { char data; UCB0I2CSA = (deviceAddress >> 1); UCB0CTL1 |= UCTR + UCTXSTT; while((IFG2 & UCB0T ......
back2001 微控制器 MCU
什么是DFX设计?
DFX是面向产品生命周期各环节的设计,其中X代表产品生命周期的某一个环节或特性,它是一种新的设计技术,在设计阶段尽可能早地考虑产品的性能、质量、可制造性、可装配性、可测试性、产品服务和 ......
vayo123 PCB设计
MSP430G2553如何产生有限个脉冲数量的PWM波
现在想用MSP430产生PWM波来控制步进电机转动一定圈数,使用计数器来控制产生脉冲的数量吗? 有例程更好 :) 大神们求助啊~...
leisheng1992 微控制器 MCU
关于串口发送数码管显示的问题
大家好,下面这个程序可以用串口助手发送十六进制数并在数码管上显示.因为串口通讯软件只能发2位数,所以显示也只能是2位, 请教大家:如和实现三位数字的发送与显示,举例说明:比如我想发送123并在 ......
whhjdz 单片机
弱弱地问一下AC97与IIS
今天看三星给的2450开发手册的驱动开发 发现手册里面有AC97与IIS驱动的选择问题 于是乎.....上来论坛问问高手。。。。 AC97与IIS的区别是什么? 补充一句,小弟我是菜鸟,还未入门!...
mbwr 嵌入式系统
AM335X DDR3 512M调试过程
AM335x MPU 有很多有点: 1.有很高的性价比,集成 3D 图形加速引擎,2 个千兆以太网口,LCDC,TSC 等等。 2.有很完整的生态系统。Linux,Android SDK 都很完善,让人很容易上手。 3.TI 的资 ......
amyuyang DSP 与 ARM 处理器

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 646  2039  1998  2113  1752  5  49  8  11  32 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved