Look-Ahead Carry Generator, CMOS, CQCC20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | S-XQCC-N20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | LOOK-AHEAD CARRY GENERATOR |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| IDT54FCT182LB | IDT74FCT182PQ | IDT54FCT182ALB | IDT54FCT182DB | IDT54FCT182ADB | IDT54FCT182AEB | IDT54FCT182EB | |
|---|---|---|---|---|---|---|---|
| 描述 | Look-Ahead Carry Generator, CMOS, CQCC20 | Look-Ahead Carry Generator, CMOS, PDIP16 | Look-Ahead Carry Generator, CMOS, CQCC20 | Look-Ahead Carry Generator, CMOS, CDIP16 | Look-Ahead Carry Generator, CMOS, CDIP16 | Look-Ahead Carry Generator, CMOS, CDFP20 | Look-Ahead Carry Generator, CMOS, CDFP20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | S-XQCC-N20 | R-PDIP-T16 | S-XQCC-N20 | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F20 | R-XDFP-F20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | LOOK-AHEAD CARRY GENERATOR | LOOK-AHEAD CARRY GENERATOR | LOOK-AHEAD CARRY GENERATOR | LOOK-AHEAD CARRY GENERATOR | LOOK-AHEAD CARRY GENERATOR | LOOK-AHEAD CARRY GENERATOR | LOOK-AHEAD CARRY GENERATOR |
| 端子数量 | 20 | 16 | 20 | 16 | 16 | 20 | 20 |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | QCCN | DIP | QCCN | DIP | DIP | DFP | DFP |
| 封装等效代码 | LCC20,.35SQ | DIP16,.3 | LCC20,.35SQ | DIP16,.3 | DIP16,.3 | FL20,.3 | FL20,.3 |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
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