HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP14, DIP-14
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
其他特性 | MASTER SLAVE OPERATION |
系列 | HC/UH |
JESD-30 代码 | R-GDIP-T14 |
JESD-609代码 | e0 |
长度 | 19.43 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | J-K FLIP-FLOP |
位数 | 2 |
功能数量 | 2 |
端子数量 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 2/6 V |
传播延迟(tpd) | 185 ns |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 4.5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | NEGATIVE EDGE |
宽度 | 7.62 mm |
最小 fmax | 21 MHz |
MM54HC73J | 54HC73J/883C | 54HC73J/883B | MM74HC73N | MM74HC73J | |
---|---|---|---|---|---|
描述 | HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP14, DIP-14 | IC HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP14, CERAMIC, DIP-14, FF/Latch | IC HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP14, CERAMIC, DIP-14, FF/Latch | HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14, DIP-14 | HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP14, DIP-14 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP14,.3 | DIP, | DIP, | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | unknown | compliant | compliant | unknown | unknown |
其他特性 | MASTER SLAVE OPERATION | MASTER SLAVE OPERATION | MASTER SLAVE OPERATION | MASTER SLAVE OPERATION | MASTER SLAVE OPERATION |
系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 代码 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-PDIP-T14 | R-GDIP-T14 |
逻辑集成电路类型 | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
位数 | 2 | 2 | 2 | 2 | 2 |
功能数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
传播延迟(tpd) | 185 ns | 185 ns | 185 ns | 160 ns | 160 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 4.5 V | 5 V | 5 V | 4.5 V | 4.5 V |
表面贴装 | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
触发器类型 | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
最小 fmax | 21 MHz | 21 MHz | 21 MHz | 25 MHz | 25 MHz |
厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
JESD-609代码 | e0 | - | - | e0 | e0 |
长度 | 19.43 mm | - | - | 19.18 mm | 19.43 mm |
负载电容(CL) | 50 pF | - | - | 50 pF | 50 pF |
封装等效代码 | DIP14,.3 | - | - | DIP14,.3 | DIP14,.3 |
电源 | 2/6 V | - | - | 2/6 V | 2/6 V |
端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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